HK1124283A1 - An chip holder attachment structure of a scribe device - Google Patents
An chip holder attachment structure of a scribe deviceInfo
- Publication number
- HK1124283A1 HK1124283A1 HK09100615A HK09100615A HK1124283A1 HK 1124283 A1 HK1124283 A1 HK 1124283A1 HK 09100615 A HK09100615 A HK 09100615A HK 09100615 A HK09100615 A HK 09100615A HK 1124283 A1 HK1124283 A1 HK 1124283A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- tip
- tip holder
- holder
- scribe device
- attachment structure
- Prior art date
Links
- 238000009434 installation Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
- B28D7/043—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being angularly adjustable
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0341—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0385—Rotary scoring blade
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9372—Rotatable type
- Y10T83/9403—Disc type
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005348256 | 2005-12-01 | ||
JP2006256769 | 2006-09-22 | ||
PCT/JP2006/324058 WO2007063979A1 (ja) | 2005-12-01 | 2006-12-01 | スクライブ装置、スクライブ方法及びチップホルダ |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1124283A1 true HK1124283A1 (en) | 2009-07-10 |
Family
ID=38092311
Family Applications (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09100615A HK1124283A1 (en) | 2005-12-01 | 2009-01-21 | An chip holder attachment structure of a scribe device |
HK12101881.6A HK1161573A1 (en) | 2005-12-01 | 2012-02-24 | Wheel holder conbined unit |
HK12102559.5A HK1163603A1 (zh) | 2005-12-01 | 2012-03-14 | 劃線裝置及劃線裝置的刀片架更換方法 |
HK12103314A HK1163019A1 (en) | 2005-12-01 | 2012-04-03 | Chip holder |
HK12103313.0A HK1163018A1 (zh) | 2005-12-01 | 2012-04-03 | 劃線裝置 |
HK12103315.8A HK1165368A1 (en) | 2005-12-01 | 2012-04-03 | Holder joint of scribe device |
HK12103756A HK1163048A1 (en) | 2005-12-01 | 2012-04-17 | Scribe method |
Family Applications After (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12101881.6A HK1161573A1 (en) | 2005-12-01 | 2012-02-24 | Wheel holder conbined unit |
HK12102559.5A HK1163603A1 (zh) | 2005-12-01 | 2012-03-14 | 劃線裝置及劃線裝置的刀片架更換方法 |
HK12103314A HK1163019A1 (en) | 2005-12-01 | 2012-04-03 | Chip holder |
HK12103313.0A HK1163018A1 (zh) | 2005-12-01 | 2012-04-03 | 劃線裝置 |
HK12103315.8A HK1165368A1 (en) | 2005-12-01 | 2012-04-03 | Holder joint of scribe device |
HK12103756A HK1163048A1 (en) | 2005-12-01 | 2012-04-17 | Scribe method |
Country Status (8)
Country | Link |
---|---|
US (1) | US8544374B2 (ko) |
EP (2) | EP2801459B1 (ko) |
JP (14) | JP4921383B2 (ko) |
KR (20) | KR101242365B1 (ko) |
CN (18) | CN102992607B (ko) |
HK (7) | HK1124283A1 (ko) |
TW (19) | TWI380961B (ko) |
WO (1) | WO2007063979A1 (ko) |
Families Citing this family (70)
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CN102992607B (zh) * | 2005-12-01 | 2015-08-26 | 三星钻石工业股份有限公司 | 划线装置的架接头 |
KR101260758B1 (ko) * | 2007-06-06 | 2013-05-06 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 멀티 헤드 탑재 스크라이브 장치 및 스크라이브 방법 |
US20100186239A1 (en) * | 2007-06-06 | 2010-07-29 | Hirotake Haraguchi | Tip holder for manual cutter, and manual cutter having the tip holder |
KR101463865B1 (ko) * | 2007-11-16 | 2014-11-25 | 세무코 가부시키 가이샤 | 화상카드, 화상조각장치 및 화상조각방법 |
JP2009166169A (ja) * | 2008-01-15 | 2009-07-30 | Mitsuboshi Diamond Industrial Co Ltd | カッター装置 |
TWI435850B (zh) * | 2008-01-23 | 2014-05-01 | Mitsuboshi Diamond Ind Co Ltd | Scribing device and scribing method |
JP2009174456A (ja) * | 2008-01-25 | 2009-08-06 | Kawamoto Pump Mfg Co Ltd | 給水装置 |
JP5353085B2 (ja) * | 2008-06-23 | 2013-11-27 | 三星ダイヤモンド工業株式会社 | ホルダジョイント、ホルダユニット、スクライブヘッド及びスクライブ装置 |
JP5239547B2 (ja) * | 2008-06-23 | 2013-07-17 | 三星ダイヤモンド工業株式会社 | チップホルダ、ホルダユニット、スクライブヘッド及びスクライブ装置 |
JP5332344B2 (ja) * | 2008-06-30 | 2013-11-06 | 三星ダイヤモンド工業株式会社 | チップホルダ及びホルダユニット |
JP5504631B2 (ja) * | 2009-01-07 | 2014-05-28 | 三星ダイヤモンド工業株式会社 | カッター装置及びカッターホルダ |
JP5173885B2 (ja) * | 2009-02-24 | 2013-04-03 | 三星ダイヤモンド工業株式会社 | スクライブ装置及びスクライブ方法 |
JP5399768B2 (ja) * | 2009-05-01 | 2014-01-29 | 三星ダイヤモンド工業株式会社 | スクライブヘッド及び該スクライブヘッドを用いたスクライブ装置 |
US9312159B2 (en) | 2009-06-09 | 2016-04-12 | Nikon Corporation | Transport apparatus and exposure apparatus |
JP5257323B2 (ja) | 2009-10-29 | 2013-08-07 | 三星ダイヤモンド工業株式会社 | チップホルダユニット |
TWI508153B (zh) * | 2010-04-30 | 2015-11-11 | Mitsuboshi Diamond Ind Co Ltd | Disconnection device and disconnection method of brittle material substrate |
JP2012025595A (ja) | 2010-07-20 | 2012-02-09 | Mitsuboshi Diamond Industrial Co Ltd | スクライブヘッド |
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TWI504576B (zh) * | 2011-10-13 | 2015-10-21 | Mitsuboshi Diamond Ind Co Ltd | A holder, a holder unit and a scribing device |
JP2013112534A (ja) * | 2011-11-25 | 2013-06-10 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の分断方法 |
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