DE69625713T2 - Piezoelektrisches Dünnschichtelement, Verfahren zum Herstellen und dieses piezoelektrisches Dünnschichtelement verwendender Tintenstrahldruckkopf - Google Patents

Piezoelektrisches Dünnschichtelement, Verfahren zum Herstellen und dieses piezoelektrisches Dünnschichtelement verwendender Tintenstrahldruckkopf

Info

Publication number
DE69625713T2
DE69625713T2 DE1996625713 DE69625713T DE69625713T2 DE 69625713 T2 DE69625713 T2 DE 69625713T2 DE 1996625713 DE1996625713 DE 1996625713 DE 69625713 T DE69625713 T DE 69625713T DE 69625713 T2 DE69625713 T2 DE 69625713T2
Authority
DE
Germany
Prior art keywords
thin film
piezoelectric thin
film element
manufacturing
ink jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1996625713
Other languages
English (en)
Other versions
DE69625713D1 (de
Inventor
Masato Shimada
Tetsushi Takahashi
Hiroyuki Kamei
Hong Qui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE69625713D1 publication Critical patent/DE69625713D1/de
Application granted granted Critical
Publication of DE69625713T2 publication Critical patent/DE69625713T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • B41J2/14233Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C04B35/49Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates
    • C04B35/491Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT
    • C04B35/493Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT containing also other lead compounds
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/62605Treating the starting powders individually or as mixtures
    • C04B35/62625Wet mixtures
    • C04B35/6264Mixing media, e.g. organic solvents
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/077Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
    • H10N30/078Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041Beam type
    • H10N30/2042Cantilevers, i.e. having one fixed end
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type
    • H10N30/704
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • H10N30/8548Lead based oxides
    • H10N30/8554Lead zirconium titanate based
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • B41J2/14233Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B41J2002/14258Multi layer thin film type piezoelectric element
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3206Magnesium oxides or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3213Strontium oxides or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3215Barium oxides or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3225Yttrium oxide or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3241Chromium oxides, chromates, or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3251Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3251Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
    • C04B2235/3255Niobates or tantalates, e.g. silver niobate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3258Tungsten oxides, tungstates, or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3262Manganese oxides, manganates, rhenium oxides or oxide-forming salts thereof, e.g. MnO
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3272Iron oxides or oxide forming salts thereof, e.g. hematite, magnetite
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3275Cobalt oxides, cobaltates or cobaltites or oxide forming salts thereof, e.g. bismuth cobaltate, zinc cobaltite
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3279Nickel oxides, nickalates, or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3284Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3286Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3294Antimony oxides, antimonates, antimonites or oxide forming salts thereof, indium antimonate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3296Lead oxides, plumbates or oxide forming salts thereof, e.g. silver plumbate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/44Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
    • C04B2235/441Alkoxides, e.g. methoxide, tert-butoxide
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/44Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
    • C04B2235/449Organic acids, e.g. EDTA, citrate, acetate, oxalate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661Multi-step sintering
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/76Crystal structural characteristics, e.g. symmetry
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/76Crystal structural characteristics, e.g. symmetry
    • C04B2235/765Tetragonal symmetry
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/76Crystal structural characteristics, e.g. symmetry
    • C04B2235/768Perovskite structure ABO3
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/78Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/787Oriented grains
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/80Phases present in the sintered or melt-cast ceramic products other than the main phase
DE1996625713 1995-09-19 1996-09-18 Piezoelektrisches Dünnschichtelement, Verfahren zum Herstellen und dieses piezoelektrisches Dünnschichtelement verwendender Tintenstrahldruckkopf Expired - Lifetime DE69625713T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP24037295 1995-09-19
JP32267095 1995-12-12
JP19084896 1996-07-19
JP24535396A JP3890634B2 (ja) 1995-09-19 1996-09-17 圧電体薄膜素子及びインクジェット式記録ヘッド

Publications (2)

Publication Number Publication Date
DE69625713D1 DE69625713D1 (de) 2003-02-13
DE69625713T2 true DE69625713T2 (de) 2003-08-07

Family

ID=27475505

Family Applications (3)

Application Number Title Priority Date Filing Date
DE1996623349 Expired - Lifetime DE69623349T2 (de) 1995-09-19 1996-09-18 Piezoelektrisches Dünnschichtelement, Verfahren zum Herstellen und dieses piezoelektrisches Dünnschichtelement verwendender Tintenstrahldruckkopf
DE1996609915 Expired - Lifetime DE69609915T2 (de) 1995-09-19 1996-09-18 Piezoelektrisches Dünnschichtelement, Verfahren zum Herstellen und dieses piezoelektrisches Dünnschichtelement verwendender Tintenstrahldruckkopf
DE1996625713 Expired - Lifetime DE69625713T2 (de) 1995-09-19 1996-09-18 Piezoelektrisches Dünnschichtelement, Verfahren zum Herstellen und dieses piezoelektrisches Dünnschichtelement verwendender Tintenstrahldruckkopf

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DE1996623349 Expired - Lifetime DE69623349T2 (de) 1995-09-19 1996-09-18 Piezoelektrisches Dünnschichtelement, Verfahren zum Herstellen und dieses piezoelektrisches Dünnschichtelement verwendender Tintenstrahldruckkopf
DE1996609915 Expired - Lifetime DE69609915T2 (de) 1995-09-19 1996-09-18 Piezoelektrisches Dünnschichtelement, Verfahren zum Herstellen und dieses piezoelektrisches Dünnschichtelement verwendender Tintenstrahldruckkopf

Country Status (4)

Country Link
US (3) US6097133A (de)
EP (3) EP0928033B8 (de)
JP (6) JP3890634B2 (de)
DE (3) DE69623349T2 (de)

Families Citing this family (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3438509B2 (ja) * 1997-02-04 2003-08-18 セイコーエプソン株式会社 セラミックス薄膜及びその製造方法
DE69808164T2 (de) * 1997-03-27 2003-01-30 Seiko Epson Corp Verfahren zur Herstellung eines piezoelektrischen Elements
DE69936075T2 (de) * 1998-01-22 2007-09-13 Seiko Epson Corp. Piezoelektrisches Schichtelement und Tintenstrahldruckkopf, der dieses benutzt
JP3520403B2 (ja) 1998-01-23 2004-04-19 セイコーエプソン株式会社 圧電体薄膜素子、アクチュエータ、インクジェット式記録ヘッド、及びインクジェット式記録装置
JP4122564B2 (ja) * 1998-04-24 2008-07-23 セイコーエプソン株式会社 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
DE69934175T2 (de) * 1998-08-12 2007-03-08 Seiko Epson Corp. Piezoelektrischer Aktuator, Tintenstrahlkopf, Drucker, Herstellungsverfahren für den piezoelektrischen Aktuator, Herstellungsverfahren für den Tintenstrahlkopf
JP3517876B2 (ja) * 1998-10-14 2004-04-12 セイコーエプソン株式会社 強誘電体薄膜素子の製造方法、インクジェット式記録ヘッド及びインクジェットプリンタ
US6594875B2 (en) * 1998-10-14 2003-07-22 Samsung Electro-Mechanics Co. Method for producing a piezoelectric/electrostrictive actuator
JP2000243931A (ja) * 1998-12-22 2000-09-08 Toshiba Corp 半導体装置及びその製造方法
GB2345379B (en) * 1998-12-30 2000-12-06 Samsung Electro Mech Method for fabricating piezoelectric/electrostrictive thick film using seeding layer
US6265139B1 (en) * 1998-12-30 2001-07-24 Samsung Electro-Mechanics Co., Ltd. Method for fabricating piezoelectric/electrostrictive ceramic micro actuator using photolithography
JP2000357826A (ja) 1999-04-13 2000-12-26 Seiko Epson Corp 圧電体素子の製造方法、圧電体素子、インクジェット式記録ヘッドおよびプリンタ
JP4327942B2 (ja) * 1999-05-20 2009-09-09 Tdk株式会社 薄膜圧電素子
JP2000332313A (ja) * 1999-05-21 2000-11-30 Matsushita Electric Ind Co Ltd 薄膜圧電型バイモルフ素子及びその応用
US6688729B1 (en) * 1999-06-04 2004-02-10 Canon Kabushiki Kaisha Liquid discharge head substrate, liquid discharge head, liquid discharge apparatus having these elements, manufacturing method of liquid discharge head, and driving method of the same
JP3845544B2 (ja) * 1999-10-01 2006-11-15 日本碍子株式会社 圧電/電歪デバイス及びその製造方法
US6494567B2 (en) 2000-03-24 2002-12-17 Seiko Epson Corporation Piezoelectric element and manufacturing method and manufacturing device thereof
WO2002029129A1 (fr) * 2000-10-03 2002-04-11 Matsushita Electric Industrial Co., Ltd. Film mince piezo-electrique et son procede de preparation, et element piezo-electrique comportant le film mince piezo-electrique, tete a jet d'encre utilisant l'element piezo-electrique et dispositif d'impression a jet d'encre dote de la tete a jet d'encre
US6869170B2 (en) 2000-10-16 2005-03-22 Seiko Epson Corporation Ink-jet recording head having a vibration plate prevented from being damaged and ink-jet recording apparatus for using the same
JP3491688B2 (ja) 2000-10-16 2004-01-26 セイコーエプソン株式会社 インクジェット式記録ヘッド
KR100398363B1 (ko) * 2000-12-05 2003-09-19 삼성전기주식회사 Fbar 소자 및 그 제조방법
JP4282245B2 (ja) * 2001-01-31 2009-06-17 富士通株式会社 容量素子及びその製造方法並びに半導体装置
US6705708B2 (en) 2001-02-09 2004-03-16 Seiko Espon Corporation Piezoelectric thin-film element, ink-jet head using the same, and method for manufacture thereof
JP4925516B2 (ja) * 2001-03-30 2012-04-25 京セラ株式会社 積層型圧電アクチュエータ及び噴射装置
JP4182329B2 (ja) * 2001-09-28 2008-11-19 セイコーエプソン株式会社 圧電体薄膜素子およびその製造方法、ならびにこれを用いた液体吐出ヘッド及び液体吐出装置
EP1454346B1 (de) * 2001-10-18 2012-01-04 Chul Soo Byun Verfahren und vorrichtung zur chemischen aufdampfung mit der fähigkeit zur verhinderung einer verschmutzung und zur verbesserung der filmwachstumsrate
JP2003133604A (ja) * 2001-10-26 2003-05-09 Seiko Epson Corp 圧電体薄膜素子およびその製造方法、ならびにこれを用いたインクジェット記録ヘッド及びインクジェットプリンタ
JP3971598B2 (ja) * 2001-11-01 2007-09-05 富士通株式会社 強誘電体キャパシタおよび半導体装置
US6620237B2 (en) 2001-11-15 2003-09-16 Spectra, Inc. Oriented piezoelectric film
CN100345320C (zh) 2001-12-18 2007-10-24 松下电器产业株式会社 压电元件、喷墨头、角速度传感器及其制法、喷墨式记录装置
JP4530615B2 (ja) 2002-01-22 2010-08-25 セイコーエプソン株式会社 圧電体素子および液体吐出ヘッド
JP3956134B2 (ja) 2002-01-29 2007-08-08 セイコーエプソン株式会社 圧電体素子の製造方法、及び液体吐出ヘッドの製造方法
US6960911B2 (en) * 2002-01-29 2005-11-01 Kabushiki Kaisha Toshiba Strain sensor
US6969157B2 (en) 2002-05-31 2005-11-29 Matsushita Electric Industrial Co., Ltd. Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus
US7083270B2 (en) * 2002-06-20 2006-08-01 Matsushita Electric Industrial Co., Ltd. Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus
JP4298232B2 (ja) * 2002-07-25 2009-07-15 株式会社村田製作所 圧電磁器組成物、及び圧電素子
JP2004059369A (ja) * 2002-07-29 2004-02-26 Brother Ind Ltd 圧電磁器組成物及びこれを用いたインクジェットヘッド用圧電アクチュエータ
US6944922B2 (en) * 2002-08-13 2005-09-20 Trikon Technologies Limited Method of forming an acoustic resonator
CN101070005B (zh) * 2002-10-17 2010-06-02 京瓷株式会社 促动器及其制造方法以及打印头
DE10348346A1 (de) * 2002-10-17 2004-05-27 Kyocera Corp. Aktuator, Herstellungsverfahren und Druckkopf
JP3999156B2 (ja) * 2003-03-31 2007-10-31 日本碍子株式会社 圧電/電歪膜型素子及び圧電/電歪磁器組成物
US7009328B2 (en) * 2003-06-20 2006-03-07 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device made of piezoelectric/electrostrictive film and manufacturing method
JP3965579B2 (ja) * 2003-07-03 2007-08-29 セイコーエプソン株式会社 圧電体層の形成方法
EP1653527A4 (de) * 2003-07-28 2009-12-23 Kyocera Corp Elektronische komponente des laminattyps und herstellungsverfahren dafür und piezoelektrisches element des laminattyps
US7411339B2 (en) * 2003-11-28 2008-08-12 Seiko Epson Corporation Manufacturing method of actuator device and liquid jet apparatus provided with actuator device formed by manufacturing method of the same
EP1686632B1 (de) * 2003-09-25 2010-06-02 Panasonic Corporation Piezoelektrisches element, tintenstrahlkopf damit und herstellungsverfahren dafür
JP2005103771A (ja) 2003-09-26 2005-04-21 Fuji Photo Film Co Ltd インクジェットヘッドとその製造方法及びインクジェット記録装置
JP4920867B2 (ja) * 2003-11-18 2012-04-18 キヤノン株式会社 アクチュエータおよびインクジェットヘッド
ATE529901T1 (de) * 2004-02-27 2011-11-15 Canon Kk Piezoelektrischer dünnfilm, verfahren zur herstellung eines piezoelektrischen dünnfilms, piezoelektrisches element und inkjet- aufzeichnungskopf
ATE506703T1 (de) * 2004-03-05 2011-05-15 Panasonic Corp Piezoelektrisches element, inkjet-kopf, winkelgeschwindigkeitssensor, herstellungsverfahren dafür und inkjet- aufzeichnungseinrichtung
JP4737375B2 (ja) * 2004-03-11 2011-07-27 セイコーエプソン株式会社 アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法並びに液体噴射装置の製造方法
US7312558B2 (en) 2004-04-02 2007-12-25 Matsushita Electric Industrial Co., Ltd. Piezoelectric element, ink jet head, angular velocity sensor, and ink jet recording apparatus
JP3891190B2 (ja) * 2004-05-21 2007-03-14 ソニー株式会社 圧電素子、圧電装置および角速度センサ
JP4782413B2 (ja) 2004-12-24 2011-09-28 日本碍子株式会社 圧電/電歪体、圧電/電歪積層体、及び圧電/電歪膜型アクチュエータ
EP1693907B1 (de) * 2005-02-21 2010-10-13 Brother Kogyo Kabushiki Kaisha Verfahren zur Herstellung eines piezoelektrischen Aktors
JP4453830B2 (ja) * 2005-03-25 2010-04-21 セイコーエプソン株式会社 圧電素子およびその製造方法、インクジェット式記録ヘッド、並びに、インクジェットプリンタ
JP5297576B2 (ja) * 2005-03-28 2013-09-25 セイコーエプソン株式会社 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置
JP2006278489A (ja) * 2005-03-28 2006-10-12 Seiko Epson Corp 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置
JP4984018B2 (ja) 2005-03-30 2012-07-25 セイコーエプソン株式会社 圧電素子及び液体噴射ヘッド並びに液体噴射装置
JP5019020B2 (ja) * 2005-03-31 2012-09-05 セイコーエプソン株式会社 誘電体膜の製造方法及び圧電体素子の製造方法並びに液体噴射ヘッドの製造方法
JP4793568B2 (ja) 2005-07-08 2011-10-12 セイコーエプソン株式会社 アクチュエータ装置、液体噴射ヘッド及び液体噴射装置
US7364276B2 (en) * 2005-09-16 2008-04-29 Eastman Kodak Company Continuous ink jet apparatus with integrated drop action devices and control circuitry
US7273270B2 (en) 2005-09-16 2007-09-25 Eastman Kodak Company Ink jet printing device with improved drop selection control
US7673976B2 (en) * 2005-09-16 2010-03-09 Eastman Kodak Company Continuous ink jet apparatus and method using a plurality of break-off times
JP2007152912A (ja) * 2005-12-08 2007-06-21 Seiko Epson Corp 圧電素子の製造方法及び圧電素子並びに液体噴射ヘッド
JP5105040B2 (ja) * 2005-12-22 2012-12-19 セイコーエプソン株式会社 圧電素子の製造方法及び液体噴射ヘッドの製造方法
DE102005061528B8 (de) 2005-12-22 2010-06-10 Siemens Ag Piezokeramisches Bauteil mit Bleizirkonattitanat mit Eisen-Wolfram-Dotierung, Verfahren zum Herstellen des piezokeramischen Bauteils und seine Verwendung
JP5398131B2 (ja) * 2006-07-14 2014-01-29 キヤノン株式会社 圧電体素子、圧電体の製造方法及び液体噴射ヘッド
JP5311775B2 (ja) * 2006-07-14 2013-10-09 キヤノン株式会社 圧電体素子、インクジェットヘッド及び圧電体素子の製造方法
JP5354876B2 (ja) * 2006-07-14 2013-11-27 キヤノン株式会社 圧電体の製造方法、圧電体素子及び液体吐出ヘッド
JP5251031B2 (ja) * 2006-09-08 2013-07-31 セイコーエプソン株式会社 圧電素子、液体噴射ヘッド、液体噴射装置、センサー
JP5024518B2 (ja) * 2006-09-21 2012-09-12 セイコーエプソン株式会社 アクチュエータ装置及び液体噴射ヘッド並びに画像記録装置
JP5083496B2 (ja) * 2006-09-21 2012-11-28 セイコーエプソン株式会社 アクチュエータ装置及び液体噴射ヘッド並びに画像記録装置
US7777395B2 (en) * 2006-10-12 2010-08-17 Eastman Kodak Company Continuous drop emitter with reduced stimulation crosstalk
JP2008171858A (ja) * 2007-01-09 2008-07-24 Seiko Epson Corp 圧電素子、圧電体の製造方法及び熱処理装置
JP5196104B2 (ja) * 2007-01-23 2013-05-15 セイコーエプソン株式会社 圧電素子の製造方法、インクジェット式記録ヘッドの製造方法、およびインクジェットプリンターの製造方法
US8020974B2 (en) 2007-01-31 2011-09-20 Panasonic Corporation Piezoelectric thin film device and piezoelectric thin film device manufacturing method, and inkjet head and inkjet recording apparatus
US8089031B2 (en) * 2007-02-27 2012-01-03 Tokyo Electron Limited Heating apparatus for heating objects to be heated, heating method for heating the objects to be heated, and storage medium in which computer-readable program is stored
JP4761071B2 (ja) * 2007-03-05 2011-08-31 セイコーエプソン株式会社 圧電素子、インクジェット式記録ヘッド、およびインクジェットプリンター
US7758171B2 (en) * 2007-03-19 2010-07-20 Eastman Kodak Company Aerodynamic error reduction for liquid drop emitters
JP5277696B2 (ja) * 2008-04-07 2013-08-28 パナソニック株式会社 圧電デバイスの製造方法
US8044557B2 (en) * 2007-04-24 2011-10-25 Panasonic Corporation Piezoelectric device and its manufacturing method
JP4505492B2 (ja) * 2007-11-06 2010-07-21 富士フイルム株式会社 ペロブスカイト型酸化物、強誘電体膜、強誘電体素子、及び液体吐出装置
JP4737185B2 (ja) * 2007-11-15 2011-07-27 ソニー株式会社 圧電素子、角速度センサ、及び圧電素子の製造方法
JP2008153674A (ja) * 2007-12-25 2008-07-03 Seiko Epson Corp インクジェット式記録ヘッド及び圧電体素子
JP2010018510A (ja) * 2007-12-27 2010-01-28 Ngk Insulators Ltd 結晶配向セラミックス
JP2010021512A (ja) * 2008-01-30 2010-01-28 Ngk Insulators Ltd 圧電/電歪膜型素子及びその製造方法
JP5475272B2 (ja) * 2008-03-21 2014-04-16 日本碍子株式会社 圧電/電歪膜型素子
JP4551949B2 (ja) 2008-05-30 2010-09-29 株式会社東芝 電子機器
JP5319211B2 (ja) * 2008-09-01 2013-10-16 本田技研工業株式会社 圧電セラミック材料及びアクチュエータ
JP5475415B2 (ja) * 2008-12-01 2014-04-16 日本碍子株式会社 新規な誘電体ナノポア材料及びその製法
JP2010167570A (ja) * 2009-01-20 2010-08-05 Seiko Epson Corp 液体噴射ヘッドの製造方法、アクチュエーター装置の製造方法、液体噴射ヘッド及び液体噴射装置
US8540851B2 (en) * 2009-02-19 2013-09-24 Fujifilm Corporation Physical vapor deposition with impedance matching network
US8557088B2 (en) * 2009-02-19 2013-10-15 Fujifilm Corporation Physical vapor deposition with phase shift
ES2424244T3 (es) * 2009-04-22 2013-09-30 Kuka Roboter Gmbh Procedimiento y dispositivo para regular un manipulador
JP2011014820A (ja) * 2009-07-06 2011-01-20 Seiko Epson Corp 圧電体薄膜、液体噴射ヘッドおよび液体噴射装置の製造方法
JP2011037149A (ja) * 2009-08-12 2011-02-24 Seiko Epson Corp 液体噴射ヘッド及びそれを用いた液体噴射装置
JP2009293130A (ja) * 2009-08-26 2009-12-17 Fujifilm Corp ペロブスカイト型酸化物、強誘電体膜、強誘電体素子、及び液体吐出装置
JP5523167B2 (ja) 2010-03-30 2014-06-18 日本碍子株式会社 セラミックス及び圧電/電歪素子
JP5132728B2 (ja) * 2010-07-12 2013-01-30 京セラ株式会社 アクチュエータ用圧電部材
JP5582948B2 (ja) * 2010-09-29 2014-09-03 富士フイルム株式会社 内視鏡装置
EP2676459B1 (de) * 2011-02-15 2022-03-30 Fujifilm Dimatix, Inc. Piezoelektrische wandler mit mikrokuppelarrays
US9689748B2 (en) 2011-08-08 2017-06-27 Panasonic Corporation Infrared detection element
JP5556966B2 (ja) 2011-08-08 2014-07-23 パナソニック株式会社 圧電体素子
US8727504B2 (en) 2011-11-11 2014-05-20 Stmicroelectronics, Inc. Microfluidic jetting device with piezoelectric actuator and method for making the same
US8956325B2 (en) 2011-12-07 2015-02-17 Stmicroelectronics, Inc. Piezoelectric microfluidic pumping device and method for using the same
JP6023722B2 (ja) * 2011-12-22 2016-11-09 キヤノンアネルバ株式会社 SrRuO3膜の成膜方法
JP5904591B2 (ja) * 2012-03-15 2016-04-13 太陽誘電株式会社 弾性波デバイス
JP2013197522A (ja) 2012-03-22 2013-09-30 Ricoh Co Ltd 圧電体薄膜素子とその製造方法、該圧電体薄膜素子を用いた液滴吐出ヘッドおよびインクジェット記録装置
TW201416140A (zh) * 2012-10-31 2014-05-01 Ind Tech Res Inst 可撓式超音波致動裝置
US9162454B2 (en) 2013-04-11 2015-10-20 Eastman Kodak Company Printhead including acoustic dampening structure
US9168740B2 (en) 2013-04-11 2015-10-27 Eastman Kodak Company Printhead including acoustic dampening structure
CN105409119B (zh) * 2013-07-25 2019-04-26 日本碍子株式会社 复合基板及其制造方法
US9437806B2 (en) 2013-12-02 2016-09-06 Canon Kabushiki Kaisha Piezoelectric thin film, method of manufacturing the same, piezoelectric thin film manufacturing apparatus and liquid ejection head
TWI650774B (zh) 2014-03-27 2019-02-11 日商三菱綜合材料股份有限公司 摻雜Mn之PZT系壓電體膜形成用組成物及摻雜Mn之PZT系壓電體膜
KR102330630B1 (ko) 2014-03-28 2021-11-23 미쓰비시 마테리알 가부시키가이샤 Mn 및 Nb 도프의 PZT 계 압전체막 형성용 조성물
JP5894222B2 (ja) * 2014-06-12 2016-03-23 京セラ株式会社 積層型電子部品およびその製法
US9199462B1 (en) 2014-09-19 2015-12-01 Eastman Kodak Company Printhead with print artifact supressing cavity
JP6460387B2 (ja) * 2015-01-26 2019-01-30 Tdk株式会社 圧電薄膜素子、圧電アクチュエータ、圧電センサ、並びにハードディスクドライブ、及びインクジェットプリンタ装置
JP6428345B2 (ja) 2015-02-16 2018-11-28 三菱マテリアル株式会社 Ptzt圧電体膜及びその圧電体膜形成用液組成物の製造方法
JP6392469B2 (ja) 2015-11-16 2018-09-19 富士フイルム株式会社 圧電体膜、圧電素子、および液体吐出装置
US10865311B2 (en) 2016-05-18 2020-12-15 Canon Kabushiki Kaisha Coating liquid for forming piezoelectric thin film, method of producing coating liquid for forming piezoelectric thin film, piezoelectric thin film, method of manufacturing piezoelectric thin film, and liquid ejection head
US10618285B2 (en) 2016-06-17 2020-04-14 Canon Kabushiki Kaisha Piezoelectric substrate and method of manufacturing the piezoelectric substrate, and liquid ejection head
JP6992239B2 (ja) * 2017-09-14 2022-01-13 株式会社アルバック 車載用pzt薄膜積層体の製造方法
JP7176329B2 (ja) * 2018-09-28 2022-11-22 株式会社リコー 強誘電体薄膜の形成方法ならびに圧電素子および液体吐出ヘッドの製造方法
TW202112670A (zh) * 2019-05-31 2021-04-01 日商三菱綜合材料股份有限公司 壓電體膜之製造方法、壓電體膜及壓電元件
CN112853286A (zh) * 2019-11-12 2021-05-28 应用材料公司 压电膜的物理气相沉积

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145899A (de) * 1974-05-07 1975-11-22
JPS5787188A (en) * 1980-11-20 1982-05-31 Matsushita Electric Ind Co Ltd Manufacture of piezoelectric ceramics
JPH062614B2 (ja) * 1984-10-31 1994-01-12 三菱マテリアル株式会社 セラミックス材料
US5198269A (en) * 1989-04-24 1993-03-30 Battelle Memorial Institute Process for making sol-gel deposited ferroelectric thin films insensitive to their substrates
SG83626A1 (en) * 1989-07-11 2001-10-16 Seiko Epson Corp Piezoelectric/electrostrictive actuator having at least one piezoelectric/electrostrictive film
JPH03232755A (ja) * 1990-02-08 1991-10-16 Matsushita Electric Ind Co Ltd 圧電磁器の製造方法
JPH045874A (ja) * 1990-04-21 1992-01-09 Matsushita Electric Ind Co Ltd 強誘電体薄膜およびその製造方法
JPH04149078A (ja) * 1990-10-08 1992-05-22 Japan Radio Co Ltd 圧電振動子、超音波送受波器及び超音波送受波器用圧電材料の製造方法
US5265315A (en) * 1990-11-20 1993-11-30 Spectra, Inc. Method of making a thin-film transducer ink jet head
JP3021930B2 (ja) * 1991-02-13 2000-03-15 三菱マテリアル株式会社 強誘電体薄膜の結晶配向性制御方法
JP3048072B2 (ja) * 1991-05-25 2000-06-05 ローム株式会社 酸化膜の成膜方法及びその装置
JP2834355B2 (ja) * 1991-11-25 1998-12-09 松下電器産業株式会社 強誘電体薄膜構成体の製造方法
JPH05257103A (ja) * 1992-03-11 1993-10-08 Ricoh Co Ltd 強誘電体薄膜及びその作製方法
JP3218406B2 (ja) * 1992-04-23 2001-10-15 キヤノン株式会社 カンチレバー型変位素子、及びこれを用いたカンチレバー型プローブ、及びこのカンチレバー型プローブを用いた走査型トンネル顕微鏡、情報処理装置
WO1993022140A1 (en) * 1992-04-23 1993-11-11 Seiko Epson Corporation Liquid jet head and production thereof
JP3144948B2 (ja) * 1992-05-27 2001-03-12 日本碍子株式会社 インクジェットプリントヘッド
JP3144949B2 (ja) * 1992-05-27 2001-03-12 日本碍子株式会社 圧電/電歪アクチュエータ
JP3212159B2 (ja) * 1992-09-28 2001-09-25 ローム株式会社 結晶性薄膜製造方法
JP3244311B2 (ja) * 1992-09-28 2002-01-07 ローム株式会社 半導体装置の製造方法
JPH06168624A (ja) * 1992-11-27 1994-06-14 Murata Mfg Co Ltd 強誘電体薄膜素子
US5504388A (en) * 1993-03-12 1996-04-02 Ngk Insulators, Ltd. Piezoelectric/electrostrictive element having electrode film(s) with specified surface roughness
JP3207315B2 (ja) * 1993-03-12 2001-09-10 日本碍子株式会社 圧電/電歪膜型素子
JP3232755B2 (ja) 1993-03-24 2001-11-26 ダイキン工業株式会社 空気調和装置
JP3341357B2 (ja) * 1993-06-08 2002-11-05 セイコーエプソン株式会社 圧電体薄膜素子
JPH0794600A (ja) * 1993-06-29 1995-04-07 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP3521499B2 (ja) * 1993-11-26 2004-04-19 日本碍子株式会社 圧電/電歪膜型素子
JP3282085B2 (ja) * 1993-12-28 2002-05-13 日本碍子株式会社 圧電/電歪膜型素子の製造方法
JP3461398B2 (ja) * 1994-01-13 2003-10-27 ローム株式会社 誘電体キャパシタおよびその製造方法
JP3162584B2 (ja) * 1994-02-14 2001-05-08 日本碍子株式会社 圧電/電歪膜型素子及びその製造方法
JP3837712B2 (ja) * 1996-02-16 2006-10-25 日本テキサス・インスツルメンツ株式会社 強誘電体キャパシタ及びその製造方法
JP3209082B2 (ja) * 1996-03-06 2001-09-17 セイコーエプソン株式会社 圧電体薄膜素子及びその製造方法、並びにこれを用いたインクジェット式記録ヘッド

Also Published As

Publication number Publication date
EP0764992A1 (de) 1997-03-26
US6294860B1 (en) 2001-09-25
DE69625713D1 (de) 2003-02-13
EP0764992B8 (de) 2003-07-02
EP0764992B1 (de) 2000-08-23
JP4921863B2 (ja) 2012-04-25
JP3890634B2 (ja) 2007-03-07
EP0928034B8 (de) 2003-05-28
DE69623349T2 (de) 2002-12-19
JP4424332B2 (ja) 2010-03-03
DE69609915T2 (de) 2000-12-21
JP4572346B2 (ja) 2010-11-04
JP2006287254A (ja) 2006-10-19
DE69623349D1 (de) 2002-10-02
JPH1081016A (ja) 1998-03-31
JP4618196B2 (ja) 2011-01-26
EP0928033B1 (de) 2002-08-28
JP2006310877A (ja) 2006-11-09
EP0928034A2 (de) 1999-07-07
EP0928033B8 (de) 2003-05-28
EP0928033A3 (de) 1999-08-04
DE69609915D1 (de) 2000-09-28
EP0928034B1 (de) 2003-01-08
JP2006287255A (ja) 2006-10-19
JP4424333B2 (ja) 2010-03-03
EP0928033A2 (de) 1999-07-07
EP0928034A3 (de) 1999-08-04
US6387225B1 (en) 2002-05-14
JP2006324681A (ja) 2006-11-30
US6097133A (en) 2000-08-01
JP2006339663A (ja) 2006-12-14

Similar Documents

Publication Publication Date Title
DE69625713T2 (de) Piezoelektrisches Dünnschichtelement, Verfahren zum Herstellen und dieses piezoelektrisches Dünnschichtelement verwendender Tintenstrahldruckkopf
DE69716157D1 (de) Piezolelektrischer Vibrator, diesen piezoelektrischen Vibrator verwendender Tintenstrahldruckkopf und Verfahren zur Herstellung
DE60000948D1 (de) Dünnschichtiges piezoelektrisches bilaminares Element, diese benutzender mechanischer Detektor und Tintenstrahldruckkopf und Herstellungsverfahren dafür
DE69618156D1 (de) Strahldrucktintezusammensetzung und Aufzeichnungsverfahren
DE69516744T2 (de) Druckmedium, dessen Herstellungsverfahren und Tintenstrahldruckverfahren unter Verwendung desselben
DE69519501D1 (de) Seitenbreitiges piezoelektrisches Tintenstrahldruckgerät und Verfahren zu dessen Herstellung
DE69623144T2 (de) Tintenstrahlkopf, Tintenstrahlpatrone, Druckgerät und Tintenstrahldruckverfahren
DE69735457D1 (de) Antriebvorrichtung mit piezoelektrischem Element, Verfahren zur Herstellung derselben und Tintenstrahlaufzeichnungskopf
DE69937713D1 (de) Piezoelektrisches gerät, tintenstrahldruckkopf, verfahren zum herstellen und drucker
DE69606271T2 (de) Kit und Verfahren zum Nachfüllen der Tinte für Tintenstrahldrucker
DE69529317T2 (de) Farbstrahldruckkopf, Farbstrahldruckkopfpatrone, Farbstrahlauszeichnungsapparat und Verfahren zum Herstellen des Kopfes
DE69601927D1 (de) Ansteuerungsverfahren und -vorrichtung für einen tintenstrahldrucker
DE69607054D1 (de) Tintenstrahlkopf, den Tintenstrahlkopf anwendendes Druckgerät und dessen Steuerverfahren
DE69603447T2 (de) Piezoelektrische Dünnschichtanordnung und ein diese Anordnung enthaltende Tintenstrahldruckkopf
DE69502605D1 (de) Verfahren zum Betreiben eines Tintenstrahldruckers und Tintenstrahldrucker, dieses Verfahren benutzend
DE69517417T2 (de) Piezoelektrische dünnschichtanordnung, verfahren zur herstellung derselben und einen diese anordnung enthaltenden tintenstrahldruckkopf
DE69628234D1 (de) Tintenstrahlkopf, Tintenstrahlvorrichtung und Tintenstrahlaufzeichnungsverfahren
DE69839540D1 (de) Piezoelektrisches Schichtelement, Verfahren zum Herstellen und Tintenstrahldruckkopf
DE69531508D1 (de) Verfahren zum tintenstrahldrucken und tintenstrahldruckkopf zur durchführung desverfahrens
DE69613267T2 (de) Tintenstrahldrucktinte und Druckverfahren
DE69529773D1 (de) Tintenstrahldruckverfahren und tintenstrahldruckkopf
DE69624854D1 (de) Tintenstrahlaufzeichnungsverfahren und Gerät unter Verwendung desselben
DE69123044T2 (de) Verfahren sowie druckkopf für mehrfarbigen tintenstrahldruck und herstellungsverfahren für diesen druckkopf
DE69612588D1 (de) Tintenstrahldruckkopf, Verfahren zum Herstellen des Kopfes und Tintenstrahldrucker
DE69800736T2 (de) Tintenstrahldruckgerät und dieses verwendende Druckverfahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition