DE102005053765A1 - MEMS-Package und Verfahren zur Herstellung - Google Patents

MEMS-Package und Verfahren zur Herstellung Download PDF

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Publication number
DE102005053765A1
DE102005053765A1 DE102005053765A DE102005053765A DE102005053765A1 DE 102005053765 A1 DE102005053765 A1 DE 102005053765A1 DE 102005053765 A DE102005053765 A DE 102005053765A DE 102005053765 A DE102005053765 A DE 102005053765A DE 102005053765 A1 DE102005053765 A1 DE 102005053765A1
Authority
DE
Germany
Prior art keywords
manufacture
mems package
chip
carrier substrate
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102005053765A
Other languages
English (en)
Other versions
DE102005053765B4 (de
Inventor
Alois Stelzl
Anton Leidl
Stefan Seitz
Hans Krueger
Wolfgang Pahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102005053765.0A priority Critical patent/DE102005053765B4/de
Priority to US12/092,439 priority patent/US8169041B2/en
Priority to JP2008539238A priority patent/JP5130223B2/ja
Priority to PCT/DE2006/001945 priority patent/WO2007054070A1/de
Publication of DE102005053765A1 publication Critical patent/DE102005053765A1/de
Priority to US13/075,936 priority patent/US8432007B2/en
Application granted granted Critical
Publication of DE102005053765B4 publication Critical patent/DE102005053765B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials

Abstract

Das erfindungsgemäße MEMS-Package ist auf einem mechanisch stabilen Trägersubstrat (TS) aufgebaut. Auf dessen Oberseite ist ein MEMS-Chip (MC) montiert. Ebenfalls auf oder über der Oberseite des Trägersubstrats ist zumindest ein Chipbauelement (CB) angeordnet. Eine metallische Schirmungsschicht (SL) überdeckt den MEMS-Chip und das Chipbauelement und schließt mit der Oberseite des Trägersubstrats ab.
DE102005053765.0A 2005-11-10 2005-11-10 MEMS-Package und Verfahren zur Herstellung Active DE102005053765B4 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE102005053765.0A DE102005053765B4 (de) 2005-11-10 2005-11-10 MEMS-Package und Verfahren zur Herstellung
US12/092,439 US8169041B2 (en) 2005-11-10 2006-11-06 MEMS package and method for the production thereof
JP2008539238A JP5130223B2 (ja) 2005-11-10 2006-11-06 Ｍｅｍｓパッケージおよび製造方法
PCT/DE2006/001945 WO2007054070A1 (de) 2005-11-10 2006-11-06 Mems-package und verfahren zur herstellung
US13/075,936 US8432007B2 (en) 2005-11-10 2011-03-30 MEMS package and method for the production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005053765.0A DE102005053765B4 (de) 2005-11-10 2005-11-10 MEMS-Package und Verfahren zur Herstellung

Publications (2)

Publication Number Publication Date
DE102005053765A1 true DE102005053765A1 (de) 2007-05-16
DE102005053765B4 DE102005053765B4 (de) 2016-04-14

Family

ID=37982602

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005053765.0A Active DE102005053765B4 (de) 2005-11-10 2005-11-10 MEMS-Package und Verfahren zur Herstellung

Country Status (4)

Country Link
US (2) US8169041B2 (de)
JP (1) JP5130223B2 (de)
DE (1) DE102005053765B4 (de)
WO (1) WO2007054070A1 (de)

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DE102009019446A1 (de) * 2009-04-29 2010-11-04 Epcos Ag MEMS Mikrofon
EP2375232A1 (de) * 2010-04-08 2011-10-12 Robert Bosch GmbH Drucksensoranordnung
WO2011144570A1 (de) * 2010-05-20 2011-11-24 Epcos Ag Elektrisches bauelement mit flacher bauform und herstellungsverfahren
DE102010033551A1 (de) * 2010-08-05 2012-02-09 Epcos Ag Verfahren zur Herstellung einer Mehrzahl von elektronischen Bauelementen mit elektromagnetischer Schirmung und elektronisches Bauelement mit elektromagnetischer Schirmung
DE102007027127B4 (de) * 2006-06-13 2012-02-16 Denso Corporation Sensor für eine physikalische Grösse
US8130506B2 (en) 2008-06-19 2012-03-06 Infineon Technologies Ag Sensor module
US20120263978A1 (en) * 2011-04-14 2012-10-18 Chung-Hsiung Wang Energy storage device and method of manufacturing the same
DE102011075260A1 (de) * 2011-05-04 2012-11-08 Robert Bosch Gmbh MEMS-Mikrofon
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US8713789B2 (en) 2011-04-26 2014-05-06 Epcos Ag Method of manufacturing a microphone
US8865499B2 (en) 2010-07-08 2014-10-21 Epcos Ag MEMS microphone and method for producing the MEMS microphone
DE102013224607A1 (de) 2013-11-29 2015-06-03 Robert Bosch Gmbh Mikro-elektromechanische Anordnung und Verfahren zum Aufbau einer mikro-elektromechanischen Anordnung
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US8432007B2 (en) 2013-04-30
US20090001553A1 (en) 2009-01-01
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US8169041B2 (en) 2012-05-01
US20110186943A1 (en) 2011-08-04

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