DE60233478D1 - Gruppe iii nitrid-basiertes lichtemittierendes halbleiterbauelement und verfahren zu dessen herstellung - Google Patents

Gruppe iii nitrid-basiertes lichtemittierendes halbleiterbauelement und verfahren zu dessen herstellung

Info

Publication number
DE60233478D1
DE60233478D1 DE60233478T DE60233478T DE60233478D1 DE 60233478 D1 DE60233478 D1 DE 60233478D1 DE 60233478 T DE60233478 T DE 60233478T DE 60233478 T DE60233478 T DE 60233478T DE 60233478 D1 DE60233478 D1 DE 60233478D1
Authority
DE
Germany
Prior art keywords
production
group iii
iii nitride
semiconductor component
emitting semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60233478T
Other languages
English (en)
Inventor
Shinya Asami
Hiroshi Watanabe
Jun Ito
Naoki Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Application granted granted Critical
Publication of DE60233478D1 publication Critical patent/DE60233478D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/918—Light emitting regenerative switching device, e.g. light emitting scr arrays, circuitry

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Biophysics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
DE60233478T 2001-04-25 2002-04-22 Gruppe iii nitrid-basiertes lichtemittierendes halbleiterbauelement und verfahren zu dessen herstellung Expired - Lifetime DE60233478D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001128507 2001-04-25
JP2001167589A JP3912043B2 (ja) 2001-04-25 2001-06-04 Ｉｉｉ族窒化物系化合物半導体発光素子
PCT/JP2002/003996 WO2002089220A1 (fr) 2001-04-25 2002-04-22 Element luminescent a semi-conducteurs contenant un compose de nitrure du groupe iii

Publications (1)

Publication Number Publication Date
DE60233478D1 true DE60233478D1 (de) 2009-10-08

Family

ID=26614235

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60233478T Expired - Lifetime DE60233478D1 (de) 2001-04-25 2002-04-22 Gruppe iii nitrid-basiertes lichtemittierendes halbleiterbauelement und verfahren zu dessen herstellung

Country Status (8)

Country Link
US (1) US7030414B2 (de)
EP (1) EP1383176B1 (de)
JP (1) JP3912043B2 (de)
KR (1) KR100583334B1 (de)
CN (1) CN1315199C (de)
DE (1) DE60233478D1 (de)
TW (1) TWI270989B (de)
WO (1) WO2002089220A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2407701A (en) * 2003-10-28 2005-05-04 Sharp Kk Manufacture of a semiconductor light-emitting device
US20060267043A1 (en) * 2005-05-27 2006-11-30 Emerson David T Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
KR100837404B1 (ko) * 2006-10-18 2008-06-12 삼성전자주식회사 반도체 광전 소자
KR100920915B1 (ko) * 2006-12-28 2009-10-12 서울옵토디바이스주식회사 초격자 구조의 장벽층을 갖는 발광 다이오드
EP1976031A3 (de) * 2007-03-29 2010-09-08 Seoul Opto Device Co., Ltd. Lichtemittierende Diode mit Bohr- und/oder Sperrschichten mit Übergitterstruktur
KR100835116B1 (ko) 2007-04-16 2008-06-05 삼성전기주식회사 질화물 반도체 발광 소자
KR101283233B1 (ko) * 2007-06-25 2013-07-11 엘지이노텍 주식회사 발광 소자 및 그 제조방법
KR100877774B1 (ko) * 2007-09-10 2009-01-16 서울옵토디바이스주식회사 개선된 구조의 발광다이오드
WO2010100689A1 (ja) * 2009-03-03 2010-09-10 パナソニック株式会社 窒化ガリウム系化合物半導体の製造方法、および半導体発光素子
US8669128B2 (en) * 2010-07-29 2014-03-11 National Tsing Hua University Method of producing III-nitride light-emitting diode
US8723189B1 (en) 2012-01-06 2014-05-13 Trustees Of Boston University Ultraviolet light emitting diode structures and methods of manufacturing the same
CN103545406A (zh) 2012-07-16 2014-01-29 展晶科技(深圳)有限公司 多量子阱结构及发光二极管
CN103681830B (zh) * 2012-09-11 2019-01-29 中国科学院微电子研究所 双沟道晶体管及其制备方法
JP2015038949A (ja) 2013-07-17 2015-02-26 株式会社東芝 半導体発光素子及びその製造方法
CN103904173A (zh) * 2014-03-24 2014-07-02 同辉电子科技股份有限公司 一种降低芯片正向工作电压的外延片生长方法
US9985168B1 (en) 2014-11-18 2018-05-29 Cree, Inc. Group III nitride based LED structures including multiple quantum wells with barrier-well unit interface layers
CN106410005B (zh) * 2016-10-18 2018-09-04 华灿光电（浙江）有限公司 一种氮化镓基led外延片及其生长方法
US11393948B2 (en) 2018-08-31 2022-07-19 Creeled, Inc. Group III nitride LED structures with improved electrical performance

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2875437B2 (ja) 1992-07-30 1999-03-31 シャープ株式会社 半導体発光素子およびその製造方法
JP2910023B2 (ja) 1993-12-24 1999-06-23 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
US5777350A (en) 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
KR100267839B1 (ko) 1995-11-06 2000-10-16 오가와 에이지 질화물 반도체 장치
JPH09139543A (ja) * 1995-11-15 1997-05-27 Hitachi Ltd 半導体レーザ素子
US6057565A (en) * 1996-09-26 2000-05-02 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a non-stoichiometric compound layer and manufacturing method thereof
JPH10150219A (ja) * 1996-11-15 1998-06-02 Toyoda Gosei Co Ltd ３族窒化物半導体レーザ素子
JPH10163523A (ja) * 1996-12-03 1998-06-19 Sumitomo Chem Co Ltd ３−５族化合物半導体の製造方法および発光素子
AU747260B2 (en) 1997-07-25 2002-05-09 Nichia Chemical Industries, Ltd. Nitride semiconductor device
JPH1168158A (ja) 1997-08-20 1999-03-09 Sanyo Electric Co Ltd 窒化ガリウム系化合物半導体装置
JP3836245B2 (ja) 1998-02-09 2006-10-25 豊田合成株式会社 窒化ガリウム系化合物半導体素子
JPH11243251A (ja) * 1998-02-26 1999-09-07 Toshiba Corp 半導体レーザ装置
JPH11251685A (ja) * 1998-03-05 1999-09-17 Toshiba Corp 半導体レーザ
JP3712870B2 (ja) * 1998-09-10 2005-11-02 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子
JP3703975B2 (ja) 1998-09-10 2005-10-05 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子
JP2000261106A (ja) * 1999-01-07 2000-09-22 Matsushita Electric Ind Co Ltd 半導体発光素子、その製造方法及び光ディスク装置
JP3594826B2 (ja) * 1999-02-09 2004-12-02 パイオニア株式会社 窒化物半導体発光素子及びその製造方法
JP4465748B2 (ja) 1999-06-30 2010-05-19 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体素子の製造方法
JP2001053339A (ja) * 1999-08-11 2001-02-23 Toshiba Corp 半導体発光素子およびその製造方法
JP3609661B2 (ja) * 1999-08-19 2005-01-12 株式会社東芝 半導体発光素子
TW419837B (en) 1999-10-13 2001-01-21 Lite On Electronics Inc Fabrication method and structure of light emitting diode

Also Published As

Publication number Publication date
CN1315199C (zh) 2007-05-09
EP1383176A4 (de) 2007-05-23
WO2002089220A1 (fr) 2002-11-07
KR20040004605A (ko) 2004-01-13
US7030414B2 (en) 2006-04-18
KR100583334B1 (ko) 2006-05-25
CN1528022A (zh) 2004-09-08
TWI270989B (en) 2007-01-11
EP1383176B1 (de) 2009-08-26
US20040113169A1 (en) 2004-06-17
EP1383176A1 (de) 2004-01-21
JP2003017743A (ja) 2003-01-17
JP3912043B2 (ja) 2007-05-09

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