DE60313797D1 - Halbleiter-Lichtemissionsbauelement und Verfahren zu seiner Herstellung - Google Patents

Halbleiter-Lichtemissionsbauelement und Verfahren zu seiner Herstellung

Info

Publication number
DE60313797D1
DE60313797D1 DE60313797T DE60313797T DE60313797D1 DE 60313797 D1 DE60313797 D1 DE 60313797D1 DE 60313797 T DE60313797 T DE 60313797T DE 60313797 T DE60313797 T DE 60313797T DE 60313797 D1 DE60313797 D1 DE 60313797D1
Authority
DE
Germany
Prior art keywords
production
emitting device
semiconductor light
semiconductor
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60313797T
Other languages
English (en)
Other versions
DE60313797T2 (de
Inventor
Atsushi Watanabe
Atuya Ito
Hirokazu Takahashi
Yoshinori Kimura
Mamoru Miyachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corp filed Critical Pioneer Corp
Application granted granted Critical
Publication of DE60313797D1 publication Critical patent/DE60313797D1/de
Publication of DE60313797T2 publication Critical patent/DE60313797T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • H01S5/3086—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
DE60313797T 2002-11-18 2003-11-12 Halbleiter-Lichtemissionsbauelement und Verfahren zu seiner Herstellung Expired - Lifetime DE60313797T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002333168 2002-11-18
JP2002333168 2002-11-18
PCT/JP2003/014366 WO2004047245A1 (ja) 2002-11-18 2003-11-12 半導体発行素子及びその製造方法

Publications (2)

Publication Number Publication Date
DE60313797D1 true DE60313797D1 (de) 2007-06-21
DE60313797T2 DE60313797T2 (de) 2008-01-24

Family

ID=32321686

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60313797T Expired - Lifetime DE60313797T2 (de) 2002-11-18 2003-11-12 Halbleiter-Lichtemissionsbauelement und Verfahren zu seiner Herstellung

Country Status (8)

Country Link
US (1) US7312468B2 (de)
EP (1) EP1564854B1 (de)
JP (1) JP4074290B2 (de)
CN (1) CN100365891C (de)
AU (1) AU2003280742A1 (de)
DE (1) DE60313797T2 (de)
TW (1) TWI234915B (de)
WO (1) WO2004047245A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115908B2 (en) * 2004-01-30 2006-10-03 Philips Lumileds Lighting Company, Llc III-nitride light emitting device with reduced polarization fields
KR100765004B1 (ko) * 2004-12-23 2007-10-09 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
TWI282636B (en) 2005-12-29 2007-06-11 Epistar Corp Semiconductor light-emitting device and manufacturing method thereof
JP4905125B2 (ja) * 2006-01-26 2012-03-28 日亜化学工業株式会社 窒化物半導体レーザ素子及びその製造方法
JP4884826B2 (ja) * 2006-04-28 2012-02-29 ローム株式会社 半導体発光素子
US8304756B2 (en) * 2006-10-18 2012-11-06 Nitek, Inc. Deep ultraviolet light emitting device and method for fabricating same
KR100869142B1 (ko) * 2007-06-25 2008-11-18 서울옵토디바이스주식회사 발광 다이오드 및 그 제조방법
DE102007046027A1 (de) * 2007-09-26 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip mit einer Mehrfachquantentopfstruktur
JP2009212336A (ja) * 2008-03-05 2009-09-17 Mitsubishi Electric Corp 窒化物系半導体レーザの製造方法および窒化物系半導体レーザ
US7902545B2 (en) * 2008-05-14 2011-03-08 Baker Hughes Incorporated Semiconductor for use in harsh environments
JP5191843B2 (ja) 2008-09-09 2013-05-08 株式会社東芝 半導体発光素子及びウェーハ
US8704252B2 (en) * 2008-10-23 2014-04-22 Epistar Corporation Light emitting device
JP4881491B2 (ja) 2009-09-01 2012-02-22 株式会社東芝 半導体発光素子
CN102104094B (zh) * 2009-12-21 2013-08-21 晶元光电股份有限公司 发光元件及其制造方法
JP5636773B2 (ja) * 2010-07-06 2014-12-10 ソニー株式会社 半導体レーザ
JP5135465B2 (ja) * 2011-11-29 2013-02-06 株式会社東芝 半導体発光素子及びその製造方法
JP5458162B2 (ja) * 2012-11-07 2014-04-02 株式会社東芝 半導体発光素子
JP2014157852A (ja) * 2013-02-14 2014-08-28 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物半導体発光素子およびその製造方法
DE102015114478A1 (de) * 2015-08-31 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
WO2019147602A1 (en) * 2018-01-29 2019-08-01 Northwestern University Amphoteric p-type and n-type doping of group iii-vi semiconductors with group-iv atoms
JP6968122B2 (ja) * 2019-06-06 2021-11-17 日機装株式会社 窒化物半導体発光素子
US20220190560A1 (en) * 2020-12-15 2022-06-16 Marvell Asia Pte, Ltd. Gain medium structure for semiconductor optical amplifier with high saturation power
CN113410348B (zh) * 2021-06-15 2022-11-18 厦门士兰明镓化合物半导体有限公司 深紫外发光元件及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3307669B2 (ja) * 1992-04-06 2002-07-24 日本電信電話株式会社 化合物半導体超格子
JP3976294B2 (ja) * 1998-06-26 2007-09-12 シャープ株式会社 窒化物系化合物半導体発光素子の製造方法
JP2000261106A (ja) * 1999-01-07 2000-09-22 Matsushita Electric Ind Co Ltd 半導体発光素子、その製造方法及び光ディスク装置
JP2000277868A (ja) * 1999-03-25 2000-10-06 Sanyo Electric Co Ltd 発光素子
JP3438648B2 (ja) * 1999-05-17 2003-08-18 松下電器産業株式会社 窒化物半導体素子
JP3511372B2 (ja) * 1999-08-31 2004-03-29 シャープ株式会社 半導体発光素子およびそれを使用した表示装置
JP2001077417A (ja) * 1999-08-31 2001-03-23 Sharp Corp 窒素化合物半導体発光素子の製造方法
US6803596B2 (en) * 1999-12-27 2004-10-12 Sanyo Electric Co., Ltd. Light emitting device
JP2001267693A (ja) * 2000-03-17 2001-09-28 Sanyo Electric Co Ltd 半導体レーザ素子
US6586762B2 (en) * 2000-07-07 2003-07-01 Nichia Corporation Nitride semiconductor device with improved lifetime and high output power
JP4867064B2 (ja) * 2000-11-17 2012-02-01 住友化学株式会社 発光素子用３−５族化合物半導体およびその製造方法
JP4468600B2 (ja) * 2001-02-20 2010-05-26 富士通株式会社 暗電流低減機構を有する光検知装置
US6649942B2 (en) * 2001-05-23 2003-11-18 Sanyo Electric Co., Ltd. Nitride-based semiconductor light-emitting device
US6835962B2 (en) * 2001-08-01 2004-12-28 Showa Denko Kabushiki Kaisha Stacked layer structure, light-emitting device, lamp, and light source unit
US6833564B2 (en) * 2001-11-02 2004-12-21 Lumileds Lighting U.S., Llc Indium gallium nitride separate confinement heterostructure light emitting devices
US6665329B1 (en) * 2002-06-06 2003-12-16 Sandia Corporation Broadband visible light source based on AllnGaN light emitting diodes

Also Published As

Publication number Publication date
EP1564854B1 (de) 2007-05-09
US20060027814A1 (en) 2006-02-09
WO2004047245A1 (ja) 2004-06-03
JPWO2004047245A1 (ja) 2006-03-23
AU2003280742A1 (en) 2004-06-15
CN100365891C (zh) 2008-01-30
TW200414643A (en) 2004-08-01
DE60313797T2 (de) 2008-01-24
EP1564854A4 (de) 2006-02-08
EP1564854A1 (de) 2005-08-17
TWI234915B (en) 2005-06-21
US7312468B2 (en) 2007-12-25
CN1714487A (zh) 2005-12-28
JP4074290B2 (ja) 2008-04-09

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