DE602004021927D1 - Halbleiterbauelement und verfahren zu seiner herstellung - Google Patents
Halbleiterbauelement und verfahren zu seiner herstellungInfo
- Publication number
- DE602004021927D1 DE602004021927D1 DE602004021927T DE602004021927T DE602004021927D1 DE 602004021927 D1 DE602004021927 D1 DE 602004021927D1 DE 602004021927 T DE602004021927 T DE 602004021927T DE 602004021927 T DE602004021927 T DE 602004021927T DE 602004021927 D1 DE602004021927 D1 DE 602004021927D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- semiconductor component
- semiconductor
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003428695 | 2003-12-25 | ||
JP2004107798 | 2004-03-31 | ||
PCT/JP2004/019675 WO2005064641A2 (en) | 2003-12-25 | 2004-12-21 | Semiconductor device and method of fabricating the same |
Publications (1)
Publication Number | Publication Date |
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DE602004021927D1 true DE602004021927D1 (de) | 2009-08-20 |
Family
ID=34703317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004021927T Active DE602004021927D1 (de) | 2003-12-25 | 2004-12-21 | Halbleiterbauelement und verfahren zu seiner herstellung |
Country Status (7)
Country | Link |
---|---|
US (2) | US7489032B2 (de) |
EP (2) | EP1901349A3 (de) |
KR (1) | KR100731842B1 (de) |
DE (1) | DE602004021927D1 (de) |
HK (1) | HK1095208A1 (de) |
TW (1) | TWI250636B (de) |
WO (1) | WO2005064641A2 (de) |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004015771A2 (en) * | 2002-08-09 | 2004-02-19 | Casio Computer Co., Ltd. | Semiconductor device and method of manufacturing the same |
CN100468719C (zh) | 2003-06-03 | 2009-03-11 | 卡西欧计算机株式会社 | 可叠置的半导体器件及其制造方法 |
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2004
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- 2004-12-21 DE DE602004021927T patent/DE602004021927D1/de active Active
- 2004-12-21 KR KR1020067001723A patent/KR100731842B1/ko not_active IP Right Cessation
- 2004-12-21 EP EP07022771.5A patent/EP1901349A3/de not_active Withdrawn
- 2004-12-21 EP EP04808026A patent/EP1629533B1/de not_active Expired - Fee Related
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HK1095208A1 (en) | 2007-04-27 |
KR100731842B1 (ko) | 2007-06-25 |
WO2005064641A2 (en) | 2005-07-14 |
US7867828B2 (en) | 2011-01-11 |
EP1629533B1 (de) | 2009-07-08 |
EP1629533A2 (de) | 2006-03-01 |
US7489032B2 (en) | 2009-02-10 |
TW200527647A (en) | 2005-08-16 |
EP1901349A2 (de) | 2008-03-19 |
EP1901349A3 (de) | 2013-12-25 |
US20080014681A1 (en) | 2008-01-17 |
TWI250636B (en) | 2006-03-01 |
US20050140007A1 (en) | 2005-06-30 |
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