DE60234678D1 - Leiterplatte und verfahren zu ihrer herstellung - Google Patents

Leiterplatte und verfahren zu ihrer herstellung

Info

Publication number
DE60234678D1
DE60234678D1 DE60234678T DE60234678T DE60234678D1 DE 60234678 D1 DE60234678 D1 DE 60234678D1 DE 60234678 T DE60234678 T DE 60234678T DE 60234678 T DE60234678 T DE 60234678T DE 60234678 D1 DE60234678 D1 DE 60234678D1
Authority
DE
Germany
Prior art keywords
pcb
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60234678T
Other languages
English (en)
Inventor
Toshio Sugawa
Yoshihisa Takase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of DE60234678D1 publication Critical patent/DE60234678D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
DE60234678T 2001-11-12 2002-10-30 Leiterplatte und verfahren zu ihrer herstellung Expired - Lifetime DE60234678D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001345607A JP4062907B2 (ja) 2001-11-12 2001-11-12 回路基板およびその製造方法
PCT/JP2002/011266 WO2003043393A1 (fr) 2001-11-12 2002-10-30 Carte de circuit imprime et procede de fabrication

Publications (1)

Publication Number Publication Date
DE60234678D1 true DE60234678D1 (de) 2010-01-21

Family

ID=19158918

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60234678T Expired - Lifetime DE60234678D1 (de) 2001-11-12 2002-10-30 Leiterplatte und verfahren zu ihrer herstellung

Country Status (6)

Country Link
US (1) US7197820B2 (de)
EP (1) EP1357775B1 (de)
JP (1) JP4062907B2 (de)
CN (1) CN100563407C (de)
DE (1) DE60234678D1 (de)
WO (1) WO2003043393A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003228259A1 (en) * 2002-08-08 2004-02-25 Nanoink, Inc. Protosubstrates
JP3979391B2 (ja) * 2004-01-26 2007-09-19 松下電器産業株式会社 回路形成基板の製造方法および回路形成基板の製造用材料
US7321496B2 (en) * 2004-03-19 2008-01-22 Matsushita Electric Industrial Co., Ltd. Flexible substrate, multilayer flexible substrate and process for producing the same
JP2006080424A (ja) * 2004-09-13 2006-03-23 Matsushita Electric Ind Co Ltd 配線基板およびその製造方法
JP4593331B2 (ja) * 2005-03-24 2010-12-08 古河電気工業株式会社 積層回路基板とその製造方法
KR20070073730A (ko) * 2005-07-15 2007-07-10 마쯔시다덴기산교 가부시키가이샤 배선 기판, 배선 재료 및 동장 적층판 및 배선 기판의 제조방법
US7976956B2 (en) * 2005-08-01 2011-07-12 Furukawa Circuit Foil., Ltd. Laminated circuit board
JP4609849B2 (ja) * 2005-08-01 2011-01-12 古河電気工業株式会社 積層回路基板
JP4609850B2 (ja) * 2005-08-01 2011-01-12 古河電気工業株式会社 積層回路基板
JP2007088043A (ja) * 2005-09-20 2007-04-05 Fujitsu Ltd 冷却装置
KR100905566B1 (ko) * 2007-04-30 2009-07-02 삼성전기주식회사 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법
EP2033756A1 (de) * 2007-09-05 2009-03-11 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Herstellungsverfahren für ein Formprodukt
TWI363585B (en) * 2008-04-02 2012-05-01 Advanced Semiconductor Eng Method for manufacturing a substrate having embedded component therein
EP2405727A1 (de) * 2009-04-02 2012-01-11 Panasonic Corporation Herstellungsverfahren für eine leiterplatte und leiterplatte
TWI385770B (zh) * 2009-05-27 2013-02-11 Unimicron Technology Corp 封裝基板及其製法
JP2013502704A (ja) * 2009-08-19 2013-01-24 ピコドリル エスアー 基板に導電性ビアを製造する方法
JP2011181902A (ja) * 2010-02-04 2011-09-15 Nitto Denko Corp 配線回路基板およびそれを備えた燃料電池
TW201916180A (zh) * 2017-09-29 2019-04-16 矽品精密工業股份有限公司 基板結構及其製法
US20230018333A1 (en) * 2019-12-17 2023-01-19 Nhk Spring Co., Ltd. Laminate, bonding method, and intermediate product for circuit board

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964666A (en) * 1975-03-31 1976-06-22 Western Electric Company, Inc. Bonding contact members to circuit boards
JPS61229389A (ja) * 1985-04-03 1986-10-13 イビデン株式会社 セラミツク配線板およびその製造方法
DE3786600T2 (de) * 1986-05-30 1993-11-04 Furukawa Electric Co Ltd Mehrschichtige gedruckte schaltung und verfahren zu ihrer herstellung.
JPH05275830A (ja) 1992-03-26 1993-10-22 Ibiden Co Ltd 電子部品搭載用基板の製造方法
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
US5652042A (en) * 1993-10-29 1997-07-29 Matsushita Electric Industrial Co., Ltd. Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
JPH1056264A (ja) 1996-08-10 1998-02-24 Toshiba Chem Corp 多層プリント配線板
EP1802186B1 (de) * 1996-11-20 2011-05-11 Ibiden Co., Ltd. Leiterplatte
EP1921902B1 (de) * 1996-12-19 2011-03-02 Ibiden Co., Ltd. Mehrlagige Leiterplatte
US6376049B1 (en) * 1997-10-14 2002-04-23 Ibiden Co., Ltd. Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
WO1999034654A1 (fr) * 1997-12-29 1999-07-08 Ibiden Co., Ltd. Plaquette a circuits imprimes multicouche
DE69928518T2 (de) * 1998-02-26 2006-03-30 Ibiden Co., Ltd., Ogaki Mehrschichtige leiterplatte mit einer struktur von gefüllten kontaktlöchern
JP2000068620A (ja) * 1998-08-25 2000-03-03 Matsushita Electric Ind Co Ltd 回路基板及びその製造方法
KR100833723B1 (ko) * 1999-10-26 2008-05-29 이비덴 가부시키가이샤 다층프린트배선판 및 다층프린트배선판의 제조 방법
TW498707B (en) * 1999-11-26 2002-08-11 Matsushita Electric Ind Co Ltd Wiring substrate and production method thereof
JP3431556B2 (ja) 1999-12-07 2003-07-28 松下電器産業株式会社 転写媒体及びその製造方法、転写媒体を用いた配線基板の製造方法
JP4486196B2 (ja) * 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法
JP2001177248A (ja) 1999-12-15 2001-06-29 Hitachi Ltd 配線基板及びその製造方法並びに電子機器
JP2001284797A (ja) 2000-03-28 2001-10-12 Kyocera Corp 多層配線基板及びその製造方法

Also Published As

Publication number Publication date
JP2003152333A (ja) 2003-05-23
EP1357775A4 (de) 2008-05-21
CN100563407C (zh) 2009-11-25
EP1357775A1 (de) 2003-10-29
CN1547875A (zh) 2004-11-17
EP1357775B1 (de) 2009-12-09
US20040045738A1 (en) 2004-03-11
JP4062907B2 (ja) 2008-03-19
US7197820B2 (en) 2007-04-03
WO2003043393A1 (fr) 2003-05-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition