JP2006080424A - 配線基板およびその製造方法 - Google Patents
配線基板およびその製造方法 Download PDFInfo
- Publication number
- JP2006080424A JP2006080424A JP2004265105A JP2004265105A JP2006080424A JP 2006080424 A JP2006080424 A JP 2006080424A JP 2004265105 A JP2004265105 A JP 2004265105A JP 2004265105 A JP2004265105 A JP 2004265105A JP 2006080424 A JP2006080424 A JP 2006080424A
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- Prior art keywords
- conductive layer
- layer
- insulating substrate
- conductive
- forming
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-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
Abstract
【解決手段】絶縁性基板1上に、第1の導電層7および第2の導電層9を形成し、前記第1の導電層7と第2の導電層9との境界部断面において、少なくとも前記第1の導電層7の表面は前記絶縁性基板1と接する側より小さくなっており、第3の導電層11は、前記第1及び第2の導電層表面を被覆するように形成した配線基板である。
【選択図】図7
Description
以下、本発明の実施の形態について、本発明の特に請求項1〜6の発明について、図面を参照しながら説明する。
以下、本発明の実施の形態について、本発明の特に請求項7の発明について、図面を参照しながら説明する。なお、実施の形態1と同様の構成を有するものについては、同一符号を付し、その説明を省略する。
2 ガラスクロス
3 エポキシ層
4 貫通孔
5 導電性材料
6 粗化層
7 第1の導電層
8 感光性樹脂
9 第2の導電層
10 くびれ部
11 第3の導電層
12 金めっき
Claims (7)
- 絶縁性基板の少なくとも1面に第1、第2、第3の導電層を形成した配線基板であって、前記第1の導電層上面に第2の導電層を形成し、前記第1の導電層と前記第2の導電層との境界部の幅は、少なくとも前記第1の導電層表面が前記絶縁性基板との幅より小さくなっており、前記第3の導電層は前記第1、第2の導電層表面を被覆するように形成することを特徴とする配線基板。
- 第1の導電層または第2の導電層のいずれか一方が側壁部から内部にくびれて形成され、且つ少なくとも第3の導電層は第1、第2の導電層表面を被覆して形成することを特徴とする請求項1に記載の配線基板。
- 絶縁性基板は導電性材料を充填した貫通孔を有し、前記導電性材料と第1の導電性層とが電気的に接続されていることを特徴とする請求項1に記載の配線基板。
- 絶縁性基板に貫通孔を形成する工程と、前記貫通孔に導電性材料を充填する工程と、前記貫通孔を含む絶縁性基板表面に第1の導電層を形成する工程と、この第1の導電層表面に所望パターンの配線と反転するめっきマスク層を形成する工程と、めっきにより前記第1の導電層表面の所望パターン領域に第2の導電層を形成する工程と、前記めっきマスク層を除去する工程と、少なくとも前記第2の導電層との界面のパターン幅が前記絶縁性基板と接する面のパターン幅より小さくなる様に前記第1の導電層をエッチングする工程と、前記第1、第2の導電層表面を被覆するように第3の導電層を形成する工程とを有する配線基板の製造方法。
- 絶縁性基板に貫通孔を形成する工程と、前記貫通孔に導電性材料を充填する工程と、前記貫通孔を含む絶縁性基板表面に第1の導電層を形成する工程と、この第1の導電層表面に所望パターンの配線と反転するめっきマスク層を形成する工程と、めっきにより前記第1の導電層表面の所望パターン領域に第2の導電層を形成する工程と、前記めっきマスク層を除去する工程と、前記第1、第2の導電層を側壁部から内部にエッチングすることによりくびれ部を形成する工程と、前記第1、第2の導電層表面に第3の導電層を形成する工程とを有する配線基板の製造方法。
- 第1の導電層を形成する工程において、この第1の導電層の少なくとも一方の面に粗化層を設け、この粗化層を絶縁性基板にプレスする請求項4に記載の配線基板の製造方法。
- 第1の導電層を形成する工程において、貫通孔を含む絶縁性基板の表面を粗化し、この絶縁性基板の表面に無電解めっきにより前記第1の導電層を形成する請求項4に記載の配線基板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004265105A JP2006080424A (ja) | 2004-09-13 | 2004-09-13 | 配線基板およびその製造方法 |
TW094124104A TW200610463A (en) | 2004-09-13 | 2005-07-15 | Circuit board and method of manufacturing the same |
US11/203,124 US7291915B2 (en) | 2004-09-13 | 2005-08-15 | Circuit board and method of manufacturing the same |
CN200510099546.8A CN1750734B (zh) | 2004-09-13 | 2005-09-13 | 配线基板及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004265105A JP2006080424A (ja) | 2004-09-13 | 2004-09-13 | 配線基板およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006080424A true JP2006080424A (ja) | 2006-03-23 |
Family
ID=36032649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004265105A Pending JP2006080424A (ja) | 2004-09-13 | 2004-09-13 | 配線基板およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7291915B2 (ja) |
JP (1) | JP2006080424A (ja) |
CN (1) | CN1750734B (ja) |
TW (1) | TW200610463A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014103367A (ja) * | 2012-11-22 | 2014-06-05 | Kyocera Corp | 配線基板および電子装置 |
CN115697069A (zh) * | 2020-02-19 | 2023-02-03 | 完美日股份有限公司 | 低变应原性重组乳蛋白和包含其的组合物 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7969005B2 (en) * | 2007-04-27 | 2011-06-28 | Sanyo Electric Co., Ltd. | Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor |
JP5310743B2 (ja) * | 2008-12-22 | 2013-10-09 | 富士通株式会社 | 電子部品の製造方法 |
US8426959B2 (en) * | 2009-08-19 | 2013-04-23 | Samsung Electronics Co., Ltd. | Semiconductor package and method of manufacturing the same |
KR101216864B1 (ko) | 2010-12-29 | 2012-12-28 | 한국이엔에쓰 주식회사 | 인쇄회로기판 및 그 제조방법 |
TWI440228B (zh) * | 2011-09-29 | 2014-06-01 | Viking Tech Corp | Light emitting diode package structure and manufacturing method thereof |
US8916448B2 (en) | 2013-01-09 | 2014-12-23 | International Business Machines Corporation | Metal to metal bonding for stacked (3D) integrated circuits |
CN113891569A (zh) * | 2021-10-26 | 2022-01-04 | 广东工业大学 | 一种基于半加成法的线路保型蚀刻的制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0715113A (ja) * | 1993-06-24 | 1995-01-17 | Hitachi Ltd | プリント配線パターン形成方法 |
JP2001068828A (ja) * | 1999-08-27 | 2001-03-16 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
JP2001217543A (ja) * | 1999-11-26 | 2001-08-10 | Ibiden Co Ltd | 多層回路基板 |
JP2003152333A (ja) * | 2001-11-12 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 回路基板およびその製造方法 |
JP2003338676A (ja) * | 2002-05-20 | 2003-11-28 | Mec Kk | 銅配線基板の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4442137A (en) * | 1982-03-18 | 1984-04-10 | International Business Machines Corporation | Maskless coating of metallurgical features of a dielectric substrate |
US4700473A (en) * | 1986-01-03 | 1987-10-20 | Motorola Inc. | Method of making an ultra high density pad array chip carrier |
US6175161B1 (en) * | 1998-05-22 | 2001-01-16 | Alpine Microsystems, Inc. | System and method for packaging integrated circuits |
WO1999034654A1 (fr) * | 1997-12-29 | 1999-07-08 | Ibiden Co., Ltd. | Plaquette a circuits imprimes multicouche |
JP2001251040A (ja) * | 2000-03-06 | 2001-09-14 | Stanley Electric Co Ltd | 高周波用回路基板及びその製造方法 |
JP2004095983A (ja) | 2002-09-03 | 2004-03-25 | Toppan Printing Co Ltd | プリント配線板の製造方法 |
US20040099961A1 (en) * | 2002-11-25 | 2004-05-27 | Chih-Liang Chu | Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same |
-
2004
- 2004-09-13 JP JP2004265105A patent/JP2006080424A/ja active Pending
-
2005
- 2005-07-15 TW TW094124104A patent/TW200610463A/zh unknown
- 2005-08-15 US US11/203,124 patent/US7291915B2/en not_active Expired - Fee Related
- 2005-09-13 CN CN200510099546.8A patent/CN1750734B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0715113A (ja) * | 1993-06-24 | 1995-01-17 | Hitachi Ltd | プリント配線パターン形成方法 |
JP2001068828A (ja) * | 1999-08-27 | 2001-03-16 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
JP2001217543A (ja) * | 1999-11-26 | 2001-08-10 | Ibiden Co Ltd | 多層回路基板 |
JP2003152333A (ja) * | 2001-11-12 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 回路基板およびその製造方法 |
JP2003338676A (ja) * | 2002-05-20 | 2003-11-28 | Mec Kk | 銅配線基板の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014103367A (ja) * | 2012-11-22 | 2014-06-05 | Kyocera Corp | 配線基板および電子装置 |
CN115697069A (zh) * | 2020-02-19 | 2023-02-03 | 完美日股份有限公司 | 低变应原性重组乳蛋白和包含其的组合物 |
Also Published As
Publication number | Publication date |
---|---|
US20060054350A1 (en) | 2006-03-16 |
CN1750734A (zh) | 2006-03-22 |
US7291915B2 (en) | 2007-11-06 |
TW200610463A (en) | 2006-03-16 |
CN1750734B (zh) | 2010-10-13 |
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