ATE413666T1 - Verfahren zur anbringung einer elektronischen baugruppe an einem substrat und einrichtung zur anbringung der baugruppe - Google Patents

Verfahren zur anbringung einer elektronischen baugruppe an einem substrat und einrichtung zur anbringung der baugruppe

Info

Publication number
ATE413666T1
ATE413666T1 AT06707949T AT06707949T ATE413666T1 AT E413666 T1 ATE413666 T1 AT E413666T1 AT 06707949 T AT06707949 T AT 06707949T AT 06707949 T AT06707949 T AT 06707949T AT E413666 T1 ATE413666 T1 AT E413666T1
Authority
AT
Austria
Prior art keywords
attaching
assembly
substrate
electronic
electronic assembly
Prior art date
Application number
AT06707949T
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP05100694A external-priority patent/EP1686512A1/de
Application filed by Nagraid Sa filed Critical Nagraid Sa
Application granted granted Critical
Publication of ATE413666T1 publication Critical patent/ATE413666T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Packaging Frangible Articles (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
AT06707949T 2005-02-01 2006-02-01 Verfahren zur anbringung einer elektronischen baugruppe an einem substrat und einrichtung zur anbringung der baugruppe ATE413666T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05100694A EP1686512A1 (de) 2005-02-01 2005-02-01 Verfahren zur Plazierung einer elektonischen Vorrichtung auf ein Substrat und Plaziervorrichtung
EP05109094 2005-09-30

Publications (1)

Publication Number Publication Date
ATE413666T1 true ATE413666T1 (de) 2008-11-15

Family

ID=36645615

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06707949T ATE413666T1 (de) 2005-02-01 2006-02-01 Verfahren zur anbringung einer elektronischen baugruppe an einem substrat und einrichtung zur anbringung der baugruppe

Country Status (27)

Country Link
US (2) US7785932B2 (de)
EP (1) EP1846874B1 (de)
JP (1) JP4838813B2 (de)
KR (1) KR101145535B1 (de)
CN (1) CN101111855B (de)
AP (1) AP2226A (de)
AT (1) ATE413666T1 (de)
AU (1) AU2006210245B2 (de)
BR (1) BRPI0606562A8 (de)
CA (1) CA2595796C (de)
CY (1) CY1108717T1 (de)
DE (1) DE602006003528D1 (de)
DK (1) DK1846874T3 (de)
EG (1) EG25336A (de)
ES (1) ES2318724T3 (de)
HR (1) HRP20090045T3 (de)
MA (1) MA29242B1 (de)
ME (1) ME01052B (de)
MX (1) MX2007009166A (de)
PL (1) PL1846874T3 (de)
PT (1) PT1846874E (de)
RS (1) RS50718B (de)
RU (1) RU2398280C2 (de)
SI (1) SI1846874T1 (de)
TN (1) TNSN07302A1 (de)
WO (1) WO2006082199A2 (de)
ZA (1) ZA200707271B (de)

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US7967214B2 (en) 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
US8181879B2 (en) 2006-12-29 2012-05-22 Solicore, Inc. Mailing apparatus for powered cards
JP5012896B2 (ja) * 2007-06-26 2012-08-29 株式会社村田製作所 部品内蔵基板の製造方法
FR2951866B1 (fr) * 2009-10-27 2011-11-25 Arjowiggins Security Procede de fabrication d'un support integrant un dispositif electronique
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
US8963313B2 (en) * 2011-12-22 2015-02-24 Raytheon Company Heterogeneous chip integration with low loss interconnection through adaptive patterning
EP2736001A1 (de) * 2012-11-27 2014-05-28 Gemalto SA Elektronisches Modul mit dreidimensionaler Kommunikationsschnittstelle
EP2767935A1 (de) 2013-02-18 2014-08-20 NagraID S.A. Plastikschicht für elektronische Karte
RU2685973C2 (ru) * 2015-02-20 2019-04-23 Нид Са Способ изготовления устройства, содержащего по меньшей мере один электронный элемент, связанный с подложкой и антенной
DE102015220855A1 (de) * 2015-10-26 2017-04-27 Robert Bosch Gmbh Sensorvorrichtung zur Erfassung mindestens einer Strömungseigenschaft eines fluiden Mediums
AU2017226865B2 (en) 2016-03-01 2022-08-25 Cardlab Aps A circuit layer for an integrated circuit card
US10580745B1 (en) * 2018-08-31 2020-03-03 Globalfoundries Inc. Wafer level packaging with integrated antenna structures

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Also Published As

Publication number Publication date
JP4838813B2 (ja) 2011-12-14
AU2006210245B2 (en) 2011-04-14
AP2226A (en) 2011-03-29
CA2595796A1 (en) 2006-08-10
WO2006082199A3 (fr) 2006-11-23
US7785932B2 (en) 2010-08-31
KR101145535B1 (ko) 2012-05-15
RU2398280C2 (ru) 2010-08-27
ME01052B (me) 2012-10-20
CA2595796C (en) 2013-04-02
US20100328914A1 (en) 2010-12-30
EP1846874B1 (de) 2008-11-05
US8218332B2 (en) 2012-07-10
EP1846874A2 (de) 2007-10-24
ES2318724T3 (es) 2009-05-01
RS50718B (sr) 2010-06-30
HRP20090045T3 (en) 2009-02-28
AP2007004088A0 (en) 2007-08-31
CY1108717T1 (el) 2014-04-09
CN101111855B (zh) 2012-04-18
US20060172458A1 (en) 2006-08-03
AU2006210245A1 (en) 2006-08-10
SI1846874T1 (sl) 2009-04-30
EG25336A (en) 2011-12-14
BRPI0606562A2 (pt) 2010-07-06
MX2007009166A (es) 2007-09-12
WO2006082199A2 (fr) 2006-08-10
PL1846874T3 (pl) 2009-04-30
PT1846874E (pt) 2009-01-29
TNSN07302A1 (fr) 2008-12-31
JP2008529292A (ja) 2008-07-31
RU2007128621A (ru) 2009-03-10
MA29242B1 (fr) 2008-02-01
BRPI0606562A8 (pt) 2016-08-02
ZA200707271B (en) 2009-05-27
CN101111855A (zh) 2008-01-23
DE602006003528D1 (de) 2008-12-18
KR20070103745A (ko) 2007-10-24
DK1846874T3 (da) 2009-03-09

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