CY1108717T1 - Διαδικασια τοποθετησης ενος ηλεκτρονικου συνολου σε ενα υποστρωμα και διαταξη τοποθετησης ενος τετοιου συνολου - Google Patents

Διαδικασια τοποθετησης ενος ηλεκτρονικου συνολου σε ενα υποστρωμα και διαταξη τοποθετησης ενος τετοιου συνολου

Info

Publication number
CY1108717T1
CY1108717T1 CY20091100088T CY091100088T CY1108717T1 CY 1108717 T1 CY1108717 T1 CY 1108717T1 CY 20091100088 T CY20091100088 T CY 20091100088T CY 091100088 T CY091100088 T CY 091100088T CY 1108717 T1 CY1108717 T1 CY 1108717T1
Authority
CY
Cyprus
Prior art keywords
substrate
chip
install
computer
mounting
Prior art date
Application number
CY20091100088T
Other languages
English (en)
Inventor
François Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP05100694A external-priority patent/EP1686512A1/fr
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of CY1108717T1 publication Critical patent/CY1108717T1/el

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Packaging Frangible Articles (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Σκοπός της εν λόγω εφεύρεσης είναι η εξασφάλιση της μέγιστης ακρίβειας για τη δημιουργία ενός ηλεκτρονικού συνόλου βάσει ενός πλινθίου μικρών διαστάσεων και για την τοποθέτηση του εν λόγω συνόλου σε ένα μονωτικό υπόστρωμα. Ο εν λόγω σκοπός υποστηρίζεται από μια μέθοδο για την τοποθέτηση ενός τουλάχιστον ηλεκτρονικού συνόλου που αποτελείται από ένα πλινθίο (4), που διαθέτει μια τουλάχιστον ηλεκτρική επαφή (5, 5') στην επιφάνεια του, σε ένα μέσο που αποκαλείται υπόστρωμα (7), όπου η εν λόγω επαφή συνδέεται με ένα τμήμα (3, 3') ταινιογραμμής, ενώ η τοποθέτηση αυτή γίνεται με μια διάταξη τοποθέτησης (6) που συγκρατεί και τοποθετεί το εν λόγω υπόστρωμα (7). Η μέθοδος της εφεύρεσης συνίσταται στη δημιουργία του τμήματος (3, 3') με προκαθορισμένο περίγραμμα, στη μεταφορά του εν λόγω τμήματος (3, 3') στη διάταξη τοποθέτησης (6), στη λήψη του πλινθίου (4) από τη διάταξη τοποθέτησης (6) για τη μεταφορά του τμήματος ταινιογραμμής (3, 3') ούτως ώστε το εν λόγω τμήμα (3, 3') να ακουμπά σε μια τουλάχιστον επαφή (5, 5') του πλινθίου (4), στην τοποθέτηση του ηλεκτρονικού συνόλου που αποτελείται από το πλινθίο (4) και το τμήμα ταινιογραμμής (3, 3') στο υπόστρωμα (7) σε προκαθορισμένη θέση και στη βύθιση του εν λόγω πλινθίου (4) και τμήματος ταινιογραμμής (3, 3') στο υπόστρωμα (7). Αναλύεται επίσης η διάταξη τοποθέτησης που χρησιμοποιείται για την υλοποίηση της μεθόδου αυτής, καθώς και ένα φορητό αντικείμενο που περιλαμβάνει το ηλεκτρονικό σύνολο που δημιουργήθηκε σύμφωνα με τη μέθοδο της εφεύρεσης.
CY20091100088T 2005-02-01 2009-01-27 Διαδικασια τοποθετησης ενος ηλεκτρονικου συνολου σε ενα υποστρωμα και διαταξη τοποθετησης ενος τετοιου συνολου CY1108717T1 (el)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05100694A EP1686512A1 (fr) 2005-02-01 2005-02-01 Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble
EP05109094 2005-09-30
EP06707949A EP1846874B1 (fr) 2005-02-01 2006-02-01 Procede de placement d'un ensemble electronique sur un substrat et dispositif de placement d'un tel ensemble

Publications (1)

Publication Number Publication Date
CY1108717T1 true CY1108717T1 (el) 2014-04-09

Family

ID=36645615

Family Applications (1)

Application Number Title Priority Date Filing Date
CY20091100088T CY1108717T1 (el) 2005-02-01 2009-01-27 Διαδικασια τοποθετησης ενος ηλεκτρονικου συνολου σε ενα υποστρωμα και διαταξη τοποθετησης ενος τετοιου συνολου

Country Status (27)

Country Link
US (2) US7785932B2 (el)
EP (1) EP1846874B1 (el)
JP (1) JP4838813B2 (el)
KR (1) KR101145535B1 (el)
CN (1) CN101111855B (el)
AP (1) AP2226A (el)
AT (1) ATE413666T1 (el)
AU (1) AU2006210245B2 (el)
BR (1) BRPI0606562A8 (el)
CA (1) CA2595796C (el)
CY (1) CY1108717T1 (el)
DE (1) DE602006003528D1 (el)
DK (1) DK1846874T3 (el)
EG (1) EG25336A (el)
ES (1) ES2318724T3 (el)
HR (1) HRP20090045T3 (el)
MA (1) MA29242B1 (el)
ME (1) ME01052B (el)
MX (1) MX2007009166A (el)
PL (1) PL1846874T3 (el)
PT (1) PT1846874E (el)
RS (1) RS50718B (el)
RU (1) RU2398280C2 (el)
SI (1) SI1846874T1 (el)
TN (1) TNSN07302A1 (el)
WO (1) WO2006082199A2 (el)
ZA (1) ZA200707271B (el)

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Also Published As

Publication number Publication date
KR101145535B1 (ko) 2012-05-15
US20100328914A1 (en) 2010-12-30
TNSN07302A1 (fr) 2008-12-31
AP2226A (en) 2011-03-29
RS50718B (sr) 2010-06-30
BRPI0606562A8 (pt) 2016-08-02
US20060172458A1 (en) 2006-08-03
AP2007004088A0 (en) 2007-08-31
PT1846874E (pt) 2009-01-29
EP1846874A2 (fr) 2007-10-24
ATE413666T1 (de) 2008-11-15
AU2006210245A1 (en) 2006-08-10
CA2595796A1 (en) 2006-08-10
ES2318724T3 (es) 2009-05-01
CN101111855B (zh) 2012-04-18
CA2595796C (en) 2013-04-02
RU2007128621A (ru) 2009-03-10
BRPI0606562A2 (pt) 2010-07-06
AU2006210245B2 (en) 2011-04-14
MA29242B1 (fr) 2008-02-01
SI1846874T1 (sl) 2009-04-30
HRP20090045T3 (en) 2009-02-28
DE602006003528D1 (de) 2008-12-18
JP2008529292A (ja) 2008-07-31
WO2006082199A3 (fr) 2006-11-23
JP4838813B2 (ja) 2011-12-14
ZA200707271B (en) 2009-05-27
RU2398280C2 (ru) 2010-08-27
MX2007009166A (es) 2007-09-12
KR20070103745A (ko) 2007-10-24
DK1846874T3 (da) 2009-03-09
US8218332B2 (en) 2012-07-10
US7785932B2 (en) 2010-08-31
PL1846874T3 (pl) 2009-04-30
EP1846874B1 (fr) 2008-11-05
WO2006082199A2 (fr) 2006-08-10
EG25336A (en) 2011-12-14
ME01052B (me) 2012-10-20
CN101111855A (zh) 2008-01-23

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