PT1846874E - Método para aplicar uma composição electrónica a um substrato e um dispositivo para aplicar a referida composição - Google Patents
Método para aplicar uma composição electrónica a um substrato e um dispositivo para aplicar a referida composição Download PDFInfo
- Publication number
- PT1846874E PT1846874E PT06707949T PT06707949T PT1846874E PT 1846874 E PT1846874 E PT 1846874E PT 06707949 T PT06707949 T PT 06707949T PT 06707949 T PT06707949 T PT 06707949T PT 1846874 E PT1846874 E PT 1846874E
- Authority
- PT
- Portugal
- Prior art keywords
- applying
- assembly
- substrate
- electronic
- electronic assembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Packaging Frangible Articles (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05100694A EP1686512A1 (fr) | 2005-02-01 | 2005-02-01 | Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble |
| EP05109094 | 2005-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT1846874E true PT1846874E (pt) | 2009-01-29 |
Family
ID=36645615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT06707949T PT1846874E (pt) | 2005-02-01 | 2006-02-01 | Método para aplicar uma composição electrónica a um substrato e um dispositivo para aplicar a referida composição |
Country Status (27)
| Country | Link |
|---|---|
| US (2) | US7785932B2 (pt) |
| EP (1) | EP1846874B1 (pt) |
| JP (1) | JP4838813B2 (pt) |
| KR (1) | KR101145535B1 (pt) |
| CN (1) | CN101111855B (pt) |
| AP (1) | AP2226A (pt) |
| AT (1) | ATE413666T1 (pt) |
| AU (1) | AU2006210245B2 (pt) |
| BR (1) | BRPI0606562A8 (pt) |
| CA (1) | CA2595796C (pt) |
| CY (1) | CY1108717T1 (pt) |
| DE (1) | DE602006003528D1 (pt) |
| DK (1) | DK1846874T3 (pt) |
| EG (1) | EG25336A (pt) |
| ES (1) | ES2318724T3 (pt) |
| HR (1) | HRP20090045T3 (pt) |
| MA (1) | MA29242B1 (pt) |
| ME (1) | ME01052B (pt) |
| MX (1) | MX2007009166A (pt) |
| PL (1) | PL1846874T3 (pt) |
| PT (1) | PT1846874E (pt) |
| RS (1) | RS50718B (pt) |
| RU (1) | RU2398280C2 (pt) |
| SI (1) | SI1846874T1 (pt) |
| TN (1) | TNSN07302A1 (pt) |
| WO (1) | WO2006082199A2 (pt) |
| ZA (1) | ZA200707271B (pt) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008082617A2 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Mailing apparatus for powered cards |
| WO2008082616A1 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Card configured to receive separate battery |
| JP5012896B2 (ja) * | 2007-06-26 | 2012-08-29 | 株式会社村田製作所 | 部品内蔵基板の製造方法 |
| FR2951866B1 (fr) * | 2009-10-27 | 2011-11-25 | Arjowiggins Security | Procede de fabrication d'un support integrant un dispositif electronique |
| DE102010011517A1 (de) * | 2010-03-15 | 2011-09-15 | Smartrac Ip B.V. | Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung |
| US8963313B2 (en) * | 2011-12-22 | 2015-02-24 | Raytheon Company | Heterogeneous chip integration with low loss interconnection through adaptive patterning |
| EP2736001A1 (fr) * | 2012-11-27 | 2014-05-28 | Gemalto SA | Module électronique à interface de communication tridimensionnelle |
| EP2767935A1 (fr) | 2013-02-18 | 2014-08-20 | NagraID S.A. | Couche plastique pour carte électronique |
| CN107567633A (zh) * | 2015-02-20 | 2018-01-09 | 恩爱的有限公司 | 用于制造包括与基底或天线相关联的至少一个电子元件的装置的方法 |
| DE102015220855A1 (de) * | 2015-10-26 | 2017-04-27 | Robert Bosch Gmbh | Sensorvorrichtung zur Erfassung mindestens einer Strömungseigenschaft eines fluiden Mediums |
| US10963770B2 (en) | 2016-03-01 | 2021-03-30 | Cardlab Aps | Circuit layer for an integrated circuit card |
| US10580745B1 (en) * | 2018-08-31 | 2020-03-03 | Globalfoundries Inc. | Wafer level packaging with integrated antenna structures |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2632100B1 (fr) * | 1988-05-25 | 1992-02-21 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede |
| US5234530A (en) * | 1991-05-20 | 1993-08-10 | Eastman Kodak Company | Apparatus for controlling assembly force |
| US5406699A (en) * | 1992-09-18 | 1995-04-18 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing an electronics package |
| FR2701139B1 (fr) | 1993-02-01 | 1995-04-21 | Solaic Sa | Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté. |
| ZA941671B (en) * | 1993-03-11 | 1994-10-12 | Csir | Attaching an electronic circuit to a substrate. |
| JP3409380B2 (ja) * | 1993-07-30 | 2003-05-26 | カシオ計算機株式会社 | プリント基板装置 |
| DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
| KR100355209B1 (ko) * | 1994-09-22 | 2003-02-11 | 로무 가부시키가이샤 | 비접촉형ic카드및그제조방법 |
| DE19602821C1 (de) * | 1996-01-26 | 1997-06-26 | Siemens Ag | Verfahren zur Herstellung einer Datenkarte |
| DE19609636C1 (de) * | 1996-03-12 | 1997-08-14 | Siemens Ag | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
| FR2756955B1 (fr) | 1996-12-11 | 1999-01-08 | Schlumberger Ind Sa | Procede de realisation d'un circuit electronique pour une carte a memoire sans contact |
| FR2761497B1 (fr) | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
| US6038133A (en) * | 1997-11-25 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
| JP3440801B2 (ja) * | 1998-01-12 | 2003-08-25 | セイコーエプソン株式会社 | 電子部品の接合装置 |
| US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
| FR2780534B1 (fr) * | 1998-06-25 | 2002-08-16 | Solaic Sa | Procede de realisation d'objets portatifs a composants electroniques et objets portatifs tels qu'obtenus par ledit procede |
| FR2780500B1 (fr) | 1998-06-25 | 2000-09-08 | Lorraine Laminage | Procede et dispositif de mesure d'un debit de matiere solide a l'etat divise, et application a un haut fourneau siderurgique |
| CN1143373C (zh) * | 1998-07-01 | 2004-03-24 | 精工爱普生株式会社 | 半导体装置及其制造方法、电路基板和电子装置 |
| US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
| US7038310B1 (en) * | 1999-06-09 | 2006-05-02 | Matsushita Electric Industrial Co., Ltd. | Power module with improved heat dissipation |
| US6259408B1 (en) * | 1999-11-19 | 2001-07-10 | Intermec Ip Corp. | RFID transponders with paste antennas and flip-chip attachment |
| JP3451373B2 (ja) * | 1999-11-24 | 2003-09-29 | オムロン株式会社 | 電磁波読み取り可能なデータキャリアの製造方法 |
| DE10016715C1 (de) * | 2000-04-04 | 2001-09-06 | Infineon Technologies Ag | Herstellungsverfahren für laminierte Chipkarten |
| FR2824939B1 (fr) * | 2001-05-16 | 2003-10-10 | A S K | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
| DE10136359C2 (de) * | 2001-07-26 | 2003-06-12 | Muehlbauer Ag | Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders |
| FR2832354B1 (fr) * | 2001-11-20 | 2004-02-20 | Arjo Wiggins Sa | Procede de fabrication d'un article comportant une feuille et au moins un element rapporte sur cette feuille |
| US6838316B2 (en) * | 2002-03-06 | 2005-01-04 | Kabushiki Kaisha Toshiba | Semiconductor device manufacturing method using ultrasonic flip chip bonding technique |
| US7230994B2 (en) | 2002-04-04 | 2007-06-12 | Nec Corporation | Multi-level modulation apparatus, multi-level demodulation apparatus, multi-level modulation/demodulation communication system, program and modulation/demodulation method |
| US6867983B2 (en) * | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
| CN1577819A (zh) * | 2003-07-09 | 2005-02-09 | 松下电器产业株式会社 | 带内置电子部件的电路板及其制造方法 |
| JP4479209B2 (ja) * | 2003-10-10 | 2010-06-09 | パナソニック株式会社 | 電子回路装置およびその製造方法並びに電子回路装置の製造装置 |
| US6974724B2 (en) * | 2004-04-28 | 2005-12-13 | Nokia Corporation | Shielded laminated structure with embedded chips |
| EP1775768A1 (en) * | 2004-06-04 | 2007-04-18 | ZyCube Co., Ltd. | Semiconductor device having three-dimensional stack structure and method for manufacturing the same |
| US7385284B2 (en) * | 2004-11-22 | 2008-06-10 | Alien Technology Corporation | Transponder incorporated into an electronic device |
| US8067253B2 (en) * | 2005-12-21 | 2011-11-29 | Avery Dennison Corporation | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
-
2006
- 2006-01-30 US US11/342,911 patent/US7785932B2/en not_active Expired - Fee Related
- 2006-02-01 ME MEP-2009-40A patent/ME01052B/me unknown
- 2006-02-01 ZA ZA200707271A patent/ZA200707271B/xx unknown
- 2006-02-01 BR BRPI0606562A patent/BRPI0606562A8/pt not_active Application Discontinuation
- 2006-02-01 CN CN2006800037584A patent/CN101111855B/zh not_active Expired - Fee Related
- 2006-02-01 AP AP2007004088A patent/AP2226A/xx active
- 2006-02-01 DE DE602006003528T patent/DE602006003528D1/de active Active
- 2006-02-01 RU RU2007128621/09A patent/RU2398280C2/ru not_active IP Right Cessation
- 2006-02-01 KR KR1020077017628A patent/KR101145535B1/ko active IP Right Grant
- 2006-02-01 AU AU2006210245A patent/AU2006210245B2/en not_active Ceased
- 2006-02-01 EP EP06707949A patent/EP1846874B1/fr active Active
- 2006-02-01 PL PL06707949T patent/PL1846874T3/pl unknown
- 2006-02-01 WO PCT/EP2006/050585 patent/WO2006082199A2/fr active Application Filing
- 2006-02-01 AT AT06707949T patent/ATE413666T1/de active
- 2006-02-01 SI SI200630160T patent/SI1846874T1/sl unknown
- 2006-02-01 CA CA2595796A patent/CA2595796C/en not_active Expired - Fee Related
- 2006-02-01 ES ES06707949T patent/ES2318724T3/es active Active
- 2006-02-01 JP JP2007552664A patent/JP4838813B2/ja not_active Expired - Fee Related
- 2006-02-01 MX MX2007009166A patent/MX2007009166A/es active IP Right Grant
- 2006-02-01 DK DK06707949T patent/DK1846874T3/da active
- 2006-02-01 RS RSP-2009/0051A patent/RS50718B/sr unknown
- 2006-02-01 PT PT06707949T patent/PT1846874E/pt unknown
-
2007
- 2007-07-26 EG EGNA2007000774 patent/EG25336A/xx active
- 2007-07-31 MA MA30119A patent/MA29242B1/fr unknown
- 2007-08-01 TN TNP2007000302A patent/TNSN07302A1/fr unknown
-
2009
- 2009-01-23 HR HR20090045T patent/HRP20090045T3/xx unknown
- 2009-01-27 CY CY20091100088T patent/CY1108717T1/el unknown
-
2010
- 2010-08-30 US US12/871,100 patent/US8218332B2/en not_active Expired - Fee Related
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