PL1890887T3 - Sposób i urządzenie do nanoszenia wzoru z pieczęci na podłoże - Google Patents

Sposób i urządzenie do nanoszenia wzoru z pieczęci na podłoże

Info

Publication number
PL1890887T3
PL1890887T3 PL06728092T PL06728092T PL1890887T3 PL 1890887 T3 PL1890887 T3 PL 1890887T3 PL 06728092 T PL06728092 T PL 06728092T PL 06728092 T PL06728092 T PL 06728092T PL 1890887 T3 PL1890887 T3 PL 1890887T3
Authority
PL
Poland
Prior art keywords
stamp
transferring
pattern
substrate
Prior art date
Application number
PL06728092T
Other languages
English (en)
Inventor
Ronald M Schneider
Marinus J J Dona
Michel M J Decre
Original Assignee
Koninklijke Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Nv filed Critical Koninklijke Philips Nv
Publication of PL1890887T3 publication Critical patent/PL1890887T3/pl

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/02—Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/02—Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface
    • B41K3/12—Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface with curved stamping surface for stamping by rolling contact
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/36—Apparatus for stamping articles having integral means for supporting the articles to be stamped with means for deforming or punching the copy matter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Printing Methods (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PL06728092T 2005-05-03 2006-05-01 Sposób i urządzenie do nanoszenia wzoru z pieczęci na podłoże PL1890887T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05103706 2005-05-03
EP06728092.5A EP1890887B1 (en) 2005-05-03 2006-05-01 Method and device for transferring a pattern from a stamp to a substrate
PCT/IB2006/051352 WO2006117745A2 (en) 2005-05-03 2006-05-01 Method and device for transferring a pattern from a stamp to a substrate

Publications (1)

Publication Number Publication Date
PL1890887T3 true PL1890887T3 (pl) 2016-04-29

Family

ID=37308378

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06728092T PL1890887T3 (pl) 2005-05-03 2006-05-01 Sposób i urządzenie do nanoszenia wzoru z pieczęci na podłoże

Country Status (8)

Country Link
US (1) US8166876B2 (pl)
EP (1) EP1890887B1 (pl)
JP (1) JP5180820B2 (pl)
KR (1) KR101256383B1 (pl)
CN (1) CN100559271C (pl)
PL (1) PL1890887T3 (pl)
TW (1) TWI377132B (pl)
WO (1) WO2006117745A2 (pl)

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KR102100669B1 (ko) * 2016-09-27 2020-05-27 (주)엘지하우시스 차량용 내장재의 제조방법 및 차량용 내장재
JP2017130678A (ja) * 2017-03-09 2017-07-27 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 型押し加工のための構造体スタンプ、装置および方法
CN107215111B (zh) * 2017-06-14 2023-03-28 浙江大学 一种磁控转印印章及磁控转移印刷方法
CN109696799B (zh) * 2017-10-20 2023-11-28 长春工业大学 一种辊型紫外纳米压印装置
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Also Published As

Publication number Publication date
EP1890887B1 (en) 2015-10-28
WO2006117745A3 (en) 2007-10-11
KR101256383B1 (ko) 2013-04-25
WO2006117745A2 (en) 2006-11-09
CN100559271C (zh) 2009-11-11
CN101171142A (zh) 2008-04-30
TW200709937A (en) 2007-03-16
JP2008540164A (ja) 2008-11-20
JP5180820B2 (ja) 2013-04-10
US8166876B2 (en) 2012-05-01
EP1890887A2 (en) 2008-02-27
US20080202365A1 (en) 2008-08-28
KR20080005391A (ko) 2008-01-11
TWI377132B (en) 2012-11-21

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