BRPI0606562A8 - Método para aplicar uma composição eletrônica a um substrato e um dispositivo para aplicar a referida composição - Google Patents
Método para aplicar uma composição eletrônica a um substrato e um dispositivo para aplicar a referida composiçãoInfo
- Publication number
- BRPI0606562A8 BRPI0606562A8 BRPI0606562A BRPI0606562A BRPI0606562A8 BR PI0606562 A8 BRPI0606562 A8 BR PI0606562A8 BR PI0606562 A BRPI0606562 A BR PI0606562A BR PI0606562 A BRPI0606562 A BR PI0606562A BR PI0606562 A8 BRPI0606562 A8 BR PI0606562A8
- Authority
- BR
- Brazil
- Prior art keywords
- composition
- substrate
- positioning
- chip
- segment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Packaging Frangible Articles (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
MÉTODO PARA APLICAR UMA COMPOSIÇÃO ELETRÔNICA A UM SUBSTRATO E UM DISPOSITIVO PARA APLICAR A REFERIDA COMPOSIÇÃO. O objetivo da presente invenção é assegurar uma máxima precisão tanto na etapa da fabricação de uma composição eletrônica de um chip com dimensões pequenas como na etapa de posicionamento de tal composição em um substrato isolante. O objetivo é alcançado por meio de um processo de posicionamento em um suporte, chamado substrato (7), de pelo menos uma composição eletrônica consistindo de um chip (4) incluindo pelo menos um contato elétrico (5, 5') em uma de suas faces, dito contato (5, 5') sendo conectado a um segmento (3, 3') de trilhas condutivas, e dito posicionamento sendo realizado por meio de um dispositivo de posicionamento (6) retendo e posicionando dita composição no substrato (7), caracterizado pelo fato de incluir as seguintes etapas: - formação de um segmento (3, 3') de trilhas condutivas tendo um contorno pré-determinado. - transferência do segmento de trilhas (3, 3') ao dispositivo de posicionamento (6). - captura do chip (4) com o dispositivo de posicionamento (6) contendo o segmento de trilhas (3, 3') de tal modo que dito segmento de trilhas (3, 3') é posicionado em pelo menos um contato (5, 5') do chip (4). - posicionamento da composição eletrônica consistindo do chip (4) e do segmento de trilhas (3, 3') em uma posição pré-determinada no substrato (7). - encaixe do chip (4) e do segmento de trilhas (3, 3') no substrato. A invenção também se refere ao dispositivo de posicionamento usado no processo e a um objeto portátil incluindo uma composição eletrônica posicionada de acordo com o processo.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05100694A EP1686512A1 (fr) | 2005-02-01 | 2005-02-01 | Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble |
EP05100694.8 | 2005-02-01 | ||
EP05109094 | 2005-09-30 | ||
EP05109094.2 | 2005-09-30 | ||
PCT/EP2006/050585 WO2006082199A2 (fr) | 2005-02-01 | 2006-02-01 | Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0606562A2 BRPI0606562A2 (pt) | 2010-07-06 |
BRPI0606562A8 true BRPI0606562A8 (pt) | 2016-08-02 |
Family
ID=36645615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0606562A BRPI0606562A8 (pt) | 2005-02-01 | 2006-02-01 | Método para aplicar uma composição eletrônica a um substrato e um dispositivo para aplicar a referida composição |
Country Status (27)
Country | Link |
---|---|
US (2) | US7785932B2 (pt) |
EP (1) | EP1846874B1 (pt) |
JP (1) | JP4838813B2 (pt) |
KR (1) | KR101145535B1 (pt) |
CN (1) | CN101111855B (pt) |
AP (1) | AP2226A (pt) |
AT (1) | ATE413666T1 (pt) |
AU (1) | AU2006210245B2 (pt) |
BR (1) | BRPI0606562A8 (pt) |
CA (1) | CA2595796C (pt) |
CY (1) | CY1108717T1 (pt) |
DE (1) | DE602006003528D1 (pt) |
DK (1) | DK1846874T3 (pt) |
EG (1) | EG25336A (pt) |
ES (1) | ES2318724T3 (pt) |
HR (1) | HRP20090045T3 (pt) |
MA (1) | MA29242B1 (pt) |
ME (1) | ME01052B (pt) |
MX (1) | MX2007009166A (pt) |
PL (1) | PL1846874T3 (pt) |
PT (1) | PT1846874E (pt) |
RS (1) | RS50718B (pt) |
RU (1) | RU2398280C2 (pt) |
SI (1) | SI1846874T1 (pt) |
TN (1) | TNSN07302A1 (pt) |
WO (1) | WO2006082199A2 (pt) |
ZA (1) | ZA200707271B (pt) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8181879B2 (en) | 2006-12-29 | 2012-05-22 | Solicore, Inc. | Mailing apparatus for powered cards |
US7967214B2 (en) | 2006-12-29 | 2011-06-28 | Solicore, Inc. | Card configured to receive separate battery |
CN101690434B (zh) * | 2007-06-26 | 2011-08-17 | 株式会社村田制作所 | 元器件内置基板的制造方法 |
FR2951866B1 (fr) * | 2009-10-27 | 2011-11-25 | Arjowiggins Security | Procede de fabrication d'un support integrant un dispositif electronique |
DE102010011517A1 (de) * | 2010-03-15 | 2011-09-15 | Smartrac Ip B.V. | Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung |
US8963313B2 (en) * | 2011-12-22 | 2015-02-24 | Raytheon Company | Heterogeneous chip integration with low loss interconnection through adaptive patterning |
EP2736001A1 (fr) * | 2012-11-27 | 2014-05-28 | Gemalto SA | Module électronique à interface de communication tridimensionnelle |
EP2767935A1 (fr) * | 2013-02-18 | 2014-08-20 | NagraID S.A. | Couche plastique pour carte électronique |
MX2017010502A (es) * | 2015-02-20 | 2018-03-14 | Nid Sa | Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena. |
DE102015220855A1 (de) * | 2015-10-26 | 2017-04-27 | Robert Bosch Gmbh | Sensorvorrichtung zur Erfassung mindestens einer Strömungseigenschaft eines fluiden Mediums |
BR112018067390A2 (pt) * | 2016-03-01 | 2019-01-02 | Cardlab Aps | camada de circuito para um cartão de circuito integrado, e método de produção de uma camada de circuito para um cartão de circuito integrado |
US10580745B1 (en) * | 2018-08-31 | 2020-03-03 | Globalfoundries Inc. | Wafer level packaging with integrated antenna structures |
Family Cites Families (35)
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FR2632100B1 (fr) * | 1988-05-25 | 1992-02-21 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede |
US5234530A (en) * | 1991-05-20 | 1993-08-10 | Eastman Kodak Company | Apparatus for controlling assembly force |
US5406699A (en) * | 1992-09-18 | 1995-04-18 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing an electronics package |
FR2701139B1 (fr) | 1993-02-01 | 1995-04-21 | Solaic Sa | Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté. |
ZA941671B (en) * | 1993-03-11 | 1994-10-12 | Csir | Attaching an electronic circuit to a substrate. |
JP3409380B2 (ja) * | 1993-07-30 | 2003-05-26 | カシオ計算機株式会社 | プリント基板装置 |
DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
KR100355209B1 (ko) * | 1994-09-22 | 2003-02-11 | 로무 가부시키가이샤 | 비접촉형ic카드및그제조방법 |
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DE19609636C1 (de) * | 1996-03-12 | 1997-08-14 | Siemens Ag | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
FR2756955B1 (fr) | 1996-12-11 | 1999-01-08 | Schlumberger Ind Sa | Procede de realisation d'un circuit electronique pour une carte a memoire sans contact |
FR2761497B1 (fr) | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
US6038133A (en) * | 1997-11-25 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
JP3440801B2 (ja) * | 1998-01-12 | 2003-08-25 | セイコーエプソン株式会社 | 電子部品の接合装置 |
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FR2780534B1 (fr) * | 1998-06-25 | 2002-08-16 | Solaic Sa | Procede de realisation d'objets portatifs a composants electroniques et objets portatifs tels qu'obtenus par ledit procede |
FR2780500B1 (fr) | 1998-06-25 | 2000-09-08 | Lorraine Laminage | Procede et dispositif de mesure d'un debit de matiere solide a l'etat divise, et application a un haut fourneau siderurgique |
JP3702788B2 (ja) * | 1998-07-01 | 2005-10-05 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
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DE10016715C1 (de) * | 2000-04-04 | 2001-09-06 | Infineon Technologies Ag | Herstellungsverfahren für laminierte Chipkarten |
FR2824939B1 (fr) * | 2001-05-16 | 2003-10-10 | A S K | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
DE10136359C2 (de) | 2001-07-26 | 2003-06-12 | Muehlbauer Ag | Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders |
FR2832354B1 (fr) * | 2001-11-20 | 2004-02-20 | Arjo Wiggins Sa | Procede de fabrication d'un article comportant une feuille et au moins un element rapporte sur cette feuille |
US6838316B2 (en) * | 2002-03-06 | 2005-01-04 | Kabushiki Kaisha Toshiba | Semiconductor device manufacturing method using ultrasonic flip chip bonding technique |
US7230994B2 (en) * | 2002-04-04 | 2007-06-12 | Nec Corporation | Multi-level modulation apparatus, multi-level demodulation apparatus, multi-level modulation/demodulation communication system, program and modulation/demodulation method |
US6867983B2 (en) * | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
CN1577819A (zh) * | 2003-07-09 | 2005-02-09 | 松下电器产业株式会社 | 带内置电子部件的电路板及其制造方法 |
JP4479209B2 (ja) * | 2003-10-10 | 2010-06-09 | パナソニック株式会社 | 電子回路装置およびその製造方法並びに電子回路装置の製造装置 |
US6974724B2 (en) * | 2004-04-28 | 2005-12-13 | Nokia Corporation | Shielded laminated structure with embedded chips |
EP1775768A1 (en) * | 2004-06-04 | 2007-04-18 | ZyCube Co., Ltd. | Semiconductor device having three-dimensional stack structure and method for manufacturing the same |
US7385284B2 (en) * | 2004-11-22 | 2008-06-10 | Alien Technology Corporation | Transponder incorporated into an electronic device |
US8067253B2 (en) * | 2005-12-21 | 2011-11-29 | Avery Dennison Corporation | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
-
2006
- 2006-01-30 US US11/342,911 patent/US7785932B2/en not_active Expired - Fee Related
- 2006-02-01 AU AU2006210245A patent/AU2006210245B2/en not_active Ceased
- 2006-02-01 ZA ZA200707271A patent/ZA200707271B/xx unknown
- 2006-02-01 AT AT06707949T patent/ATE413666T1/de active
- 2006-02-01 RU RU2007128621/09A patent/RU2398280C2/ru not_active IP Right Cessation
- 2006-02-01 ME MEP-2009-40A patent/ME01052B/me unknown
- 2006-02-01 SI SI200630160T patent/SI1846874T1/sl unknown
- 2006-02-01 MX MX2007009166A patent/MX2007009166A/es active IP Right Grant
- 2006-02-01 KR KR1020077017628A patent/KR101145535B1/ko active IP Right Grant
- 2006-02-01 DE DE602006003528T patent/DE602006003528D1/de active Active
- 2006-02-01 EP EP06707949A patent/EP1846874B1/fr active Active
- 2006-02-01 PL PL06707949T patent/PL1846874T3/pl unknown
- 2006-02-01 CA CA2595796A patent/CA2595796C/en not_active Expired - Fee Related
- 2006-02-01 CN CN2006800037584A patent/CN101111855B/zh not_active Expired - Fee Related
- 2006-02-01 ES ES06707949T patent/ES2318724T3/es active Active
- 2006-02-01 AP AP2007004088A patent/AP2226A/xx active
- 2006-02-01 BR BRPI0606562A patent/BRPI0606562A8/pt not_active Application Discontinuation
- 2006-02-01 PT PT06707949T patent/PT1846874E/pt unknown
- 2006-02-01 WO PCT/EP2006/050585 patent/WO2006082199A2/fr active Application Filing
- 2006-02-01 JP JP2007552664A patent/JP4838813B2/ja not_active Expired - Fee Related
- 2006-02-01 DK DK06707949T patent/DK1846874T3/da active
- 2006-02-01 RS RSP-2009/0051A patent/RS50718B/sr unknown
-
2007
- 2007-07-26 EG EGNA2007000774 patent/EG25336A/xx active
- 2007-07-31 MA MA30119A patent/MA29242B1/fr unknown
- 2007-08-01 TN TNP2007000302A patent/TNSN07302A1/fr unknown
-
2009
- 2009-01-23 HR HR20090045T patent/HRP20090045T3/xx unknown
- 2009-01-27 CY CY20091100088T patent/CY1108717T1/el unknown
-
2010
- 2010-08-30 US US12/871,100 patent/US8218332B2/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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