BR112018067390A2 - camada de circuito para um cartão de circuito integrado, e método de produção de uma camada de circuito para um cartão de circuito integrado - Google Patents
camada de circuito para um cartão de circuito integrado, e método de produção de uma camada de circuito para um cartão de circuito integradoInfo
- Publication number
- BR112018067390A2 BR112018067390A2 BR112018067390A BR112018067390A BR112018067390A2 BR 112018067390 A2 BR112018067390 A2 BR 112018067390A2 BR 112018067390 A BR112018067390 A BR 112018067390A BR 112018067390 A BR112018067390 A BR 112018067390A BR 112018067390 A2 BR112018067390 A2 BR 112018067390A2
- Authority
- BR
- Brazil
- Prior art keywords
- circuit
- integrated circuit
- card
- layer
- circuit layer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
uma camada de circuito (4) para um cartão de circuito integrado (1) compreendendo um circuito eletrônico embutido em um substrato (5) e um revestimento (10) que cobre o substrato e circuito (3). para capacitar grandes tolerâncias da posição do circuito no substrato, o circuito eletrônico tem almofadas de contato (9) com uma forma quadrangular, e as almofadas de contato são expostas através do revesti-mento por furos tendo uma forma circular.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16158068 | 2016-03-01 | ||
PCT/EP2017/054576 WO2017148901A1 (en) | 2016-03-01 | 2017-02-28 | A circuit layer for an integrated circuit card |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112018067390A2 true BR112018067390A2 (pt) | 2019-01-02 |
Family
ID=55456632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112018067390A BR112018067390A2 (pt) | 2016-03-01 | 2017-02-28 | camada de circuito para um cartão de circuito integrado, e método de produção de uma camada de circuito para um cartão de circuito integrado |
Country Status (12)
Country | Link |
---|---|
US (1) | US10963770B2 (pt) |
EP (1) | EP3423993B1 (pt) |
KR (1) | KR102611384B1 (pt) |
CN (1) | CN108701248B (pt) |
AU (1) | AU2017226865B2 (pt) |
BR (1) | BR112018067390A2 (pt) |
CA (1) | CA3015971A1 (pt) |
MY (1) | MY195079A (pt) |
RU (1) | RU2725617C2 (pt) |
SG (1) | SG11201807340SA (pt) |
WO (1) | WO2017148901A1 (pt) |
ZA (1) | ZA201806115B (pt) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10984304B2 (en) | 2017-02-02 | 2021-04-20 | Jonny B. Vu | Methods for placing an EMV chip onto a metal card |
USD956760S1 (en) * | 2018-07-30 | 2022-07-05 | Lion Credit Card Inc. | Multi EMV chip card |
USD1010657S1 (en) * | 2020-02-28 | 2024-01-09 | Chad Braswell | E-card |
CN113806819B (zh) * | 2021-08-30 | 2024-02-09 | 高赵涵 | 一种m1卡扇区扩展工艺 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2620586A1 (fr) * | 1987-09-14 | 1989-03-17 | Em Microelectronic Marin Sa | Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits |
JPH07179088A (ja) * | 1993-12-22 | 1995-07-18 | Ibiden Co Ltd | Icカード及びその製造方法 |
FR2735284B1 (fr) * | 1995-06-12 | 1997-08-29 | Solaic Sa | Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce |
KR101086520B1 (ko) * | 2003-06-20 | 2011-11-23 | 엔엑스피 비 브이 | 전자 장치, 조립체 및 전자 장치 제조 방법 |
US6927498B2 (en) * | 2003-11-19 | 2005-08-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bond pad for flip chip package |
TWI232072B (en) * | 2004-04-05 | 2005-05-01 | Wistron Corp | Method and structure for printed circuit board assembly and jig for assembling structure |
ATE541312T1 (de) * | 2004-05-28 | 2012-01-15 | Nxp Bv | Chip mit zwei gruppen von chipkontakten |
US7785932B2 (en) * | 2005-02-01 | 2010-08-31 | Nagraid S.A. | Placement method of an electronic module on a substrate and device produced by said method |
IL178262A (en) * | 2006-09-21 | 2013-06-27 | Aser Rich Ltd | Install and method of purchasing and storing digital content on a smart card |
JP4945738B2 (ja) * | 2006-12-27 | 2012-06-06 | 日本電産サンキョー株式会社 | 媒体処理装置及びその制御方法 |
JP2008258258A (ja) * | 2007-04-02 | 2008-10-23 | Sanyo Electric Co Ltd | 半導体装置 |
US20090096076A1 (en) * | 2007-10-16 | 2009-04-16 | Jung Young Hy | Stacked semiconductor package without reduction in stata storage capacity and method for manufacturing the same |
EP2232414A4 (en) * | 2007-12-19 | 2011-05-04 | Linda Seah | INLAYS WITHOUT CONTACT AND WITH DOUBLE INTERFACE AND METHOD OF MANUFACTURING THE SAME |
EP2463809A1 (fr) * | 2010-12-07 | 2012-06-13 | NagraID S.A. | Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne |
JP5924017B2 (ja) * | 2011-02-16 | 2016-05-25 | 株式会社リコー | 可逆性感熱記録媒体及びその製造方法 |
JP2014033389A (ja) * | 2012-08-06 | 2014-02-20 | Seiko Epson Corp | 振動デバイス、電子デバイス、電子機器、および移動体 |
US9224695B2 (en) * | 2013-02-28 | 2015-12-29 | Infineon Technologies Ag | Chip arrangement and a method for manufacturing a chip arrangement |
US20150206047A1 (en) * | 2014-01-20 | 2015-07-23 | John Herslow | Metal card with radio frequency (rf) transmission capability |
DE102014107299B4 (de) * | 2014-05-23 | 2019-03-28 | Infineon Technologies Ag | Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls |
CN204069493U (zh) * | 2014-07-09 | 2014-12-31 | 上海卓悠网络科技有限公司 | 一种pcb板设计结构及霍尔开关、高亮侧发光灯、sim卡 |
KR102455398B1 (ko) * | 2015-11-24 | 2022-10-17 | 에스케이하이닉스 주식회사 | 신축성을 갖는 반도체 패키지 및 이를 이용한 반도체 장치 |
-
2017
- 2017-02-28 MY MYPI2018703082A patent/MY195079A/en unknown
- 2017-02-28 AU AU2017226865A patent/AU2017226865B2/en not_active Expired - Fee Related
- 2017-02-28 CN CN201780014471.XA patent/CN108701248B/zh not_active Expired - Fee Related
- 2017-02-28 US US16/080,085 patent/US10963770B2/en active Active
- 2017-02-28 SG SG11201807340SA patent/SG11201807340SA/en unknown
- 2017-02-28 CA CA3015971A patent/CA3015971A1/en not_active Abandoned
- 2017-02-28 BR BR112018067390A patent/BR112018067390A2/pt active Search and Examination
- 2017-02-28 KR KR1020187027942A patent/KR102611384B1/ko active IP Right Grant
- 2017-02-28 WO PCT/EP2017/054576 patent/WO2017148901A1/en active Application Filing
- 2017-02-28 EP EP17707048.9A patent/EP3423993B1/en active Active
- 2017-02-28 RU RU2018133848A patent/RU2725617C2/ru active
-
2018
- 2018-09-12 ZA ZA2018/06115A patent/ZA201806115B/en unknown
Also Published As
Publication number | Publication date |
---|---|
AU2017226865A1 (en) | 2018-09-27 |
SG11201807340SA (en) | 2018-09-27 |
MY195079A (en) | 2023-01-09 |
KR20180124892A (ko) | 2018-11-21 |
WO2017148901A1 (en) | 2017-09-08 |
CN108701248A (zh) | 2018-10-23 |
ZA201806115B (en) | 2020-12-23 |
US20190065922A1 (en) | 2019-02-28 |
RU2725617C2 (ru) | 2020-07-03 |
CN108701248B (zh) | 2022-04-26 |
AU2017226865B2 (en) | 2022-08-25 |
EP3423993B1 (en) | 2020-07-01 |
CA3015971A1 (en) | 2017-09-08 |
KR102611384B1 (ko) | 2023-12-08 |
US10963770B2 (en) | 2021-03-30 |
RU2018133848A3 (pt) | 2020-04-27 |
EP3423993A1 (en) | 2019-01-09 |
RU2018133848A (ru) | 2020-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B350 | Update of information on the portal [chapter 15.35 patent gazette] | ||
B06W | Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] |