JP2008258258A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2008258258A JP2008258258A JP2007096327A JP2007096327A JP2008258258A JP 2008258258 A JP2008258258 A JP 2008258258A JP 2007096327 A JP2007096327 A JP 2007096327A JP 2007096327 A JP2007096327 A JP 2007096327A JP 2008258258 A JP2008258258 A JP 2008258258A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 239000010410 layer Substances 0.000 claims abstract description 166
- 239000011229 interlayer Substances 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000009413 insulation Methods 0.000 abstract 5
- 239000000523 sample Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
【解決手段】第2層間絶縁膜9上には、ビアホール12を有する第3層間絶縁膜13が第3配線層11を被覆して形成されている。ビアホール12内には第3導電層14が形成されている。第3層間絶縁膜13は、平面形状が六角形である複数の柱状層間絶縁膜13aが集合して構成されている。そして、各柱状層間絶縁膜13aの周囲を取り囲むようにしてビアホール12及び第3導電層14が形成されている。第3導電層14を介して第3配線層11と電気的に接続された第4配線層15が形成されている。第4配線層15が本実施形態における最上の配線層であり、ボンディングパッドとして機能する層である。
【選択図】図1
Description
5a,5b ビアホール 6 第1層間絶縁膜 7 第1導電層
8 第2配線層 9 第2層間絶縁膜 10 第2導電層
11 第3配線層 12 ビアホール 13 第3層間絶縁膜
14 第3導電層 15 第4配線層 16 パッド開口部 17 保護膜
100 半導体基板 101 デバイス素子 102 第1配線層
103 絶縁膜 104 ビアホール 105 第1層間絶縁膜
106 導電層 107 第2配線層 108 第2層間絶縁膜
109 第3配線層 110 第3層間絶縁膜 111 第4配線層
112 パッド開口部 113 保護膜 114 クラック
115 第3配線層 116 導電層 117 導電層
Claims (4)
- 半導体基板と、
前記半導体基板の表面上に形成された配線層と、
前記配線層を被覆するようにして形成された層間絶縁膜と、
前記層間絶縁膜内に形成され、且つ前記配線層と電気的に接続された導電層と、
前記層間絶縁膜上に形成され、且つ前記導電層を介して前記配線層と電気的に接続された最上配線層とを備え、
前記層間絶縁膜は、その平面形状が六角形である柱状層間絶縁膜が複数個蜂の巣状に配置された構成から成り、
前記導電層は前記柱状層間絶縁膜の周囲を囲むようにして形成されていることを特徴とする半導体装置。 - 前記配線層下に形成された、前記層間絶縁膜とは別の層間絶縁膜と、
前記半導体基板の表面上に形成されたデバイス素子とを備え、
前記デバイス素子と前記最上配線層とが重畳して配置されていることを特徴とする請求項1に記載の半導体装置。 - 前記最上配線層はボンディングパッドであることを特徴とする請求項1または請求項2に記載の半導体装置。
- 前記最上配線層の一部を露出させる開口部を有する保護膜を備え、
前記配線層は、前記開口部のサイズよりもパターン面積が大きく形成されていることを特徴とする請求項1乃至請求項3のいずれかに記載の半導体装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007096327A JP2008258258A (ja) | 2007-04-02 | 2007-04-02 | 半導体装置 |
TW097107998A TWI370500B (en) | 2007-04-02 | 2008-03-07 | Semiconductor device |
US12/060,673 US7741724B2 (en) | 2007-04-02 | 2008-04-01 | Semiconductor device |
KR1020080030277A KR20080090304A (ko) | 2007-04-02 | 2008-04-01 | 반도체 장치 |
RU2008112657/28A RU2447540C2 (ru) | 2007-04-02 | 2008-04-01 | Полупроводниковое устройство |
CN2008100889477A CN101281893B (zh) | 2007-04-02 | 2008-04-01 | 半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007096327A JP2008258258A (ja) | 2007-04-02 | 2007-04-02 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008258258A true JP2008258258A (ja) | 2008-10-23 |
Family
ID=39792847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007096327A Pending JP2008258258A (ja) | 2007-04-02 | 2007-04-02 | 半導体装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7741724B2 (ja) |
JP (1) | JP2008258258A (ja) |
KR (1) | KR20080090304A (ja) |
CN (1) | CN101281893B (ja) |
RU (1) | RU2447540C2 (ja) |
TW (1) | TWI370500B (ja) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8310036B2 (en) | 2007-03-05 | 2012-11-13 | DigitalOptics Corporation Europe Limited | Chips having rear contacts connected by through vias to front contacts |
US8432045B2 (en) | 2010-11-15 | 2013-04-30 | Tessera, Inc. | Conductive pads defined by embedded traces |
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KR20220058757A (ko) | 2020-10-30 | 2022-05-10 | 삼성디스플레이 주식회사 | 표시 장치 |
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US8772908B2 (en) | 2010-11-15 | 2014-07-08 | Tessera, Inc. | Conductive pads defined by embedded traces |
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US8587126B2 (en) | 2010-12-02 | 2013-11-19 | Tessera, Inc. | Stacked microelectronic assembly with TSVs formed in stages with plural active chips |
US8610264B2 (en) | 2010-12-08 | 2013-12-17 | Tessera, Inc. | Compliant interconnects in wafers |
US9224649B2 (en) | 2010-12-08 | 2015-12-29 | Tessera, Inc. | Compliant interconnects in wafers |
US8796828B2 (en) | 2010-12-08 | 2014-08-05 | Tessera, Inc. | Compliant interconnects in wafers |
WO2017106650A1 (en) * | 2015-12-18 | 2017-06-22 | Ziptronix, Inc. | Increased contact alignment tolerance for direct bonding |
US9852988B2 (en) | 2015-12-18 | 2017-12-26 | Invensas Bonding Technologies, Inc. | Increased contact alignment tolerance for direct bonding |
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US11881454B2 (en) | 2016-10-07 | 2024-01-23 | Adeia Semiconductor Inc. | Stacked IC structure with orthogonal interconnect layers |
US11626363B2 (en) | 2016-12-29 | 2023-04-11 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structures with integrated passive component |
US10276909B2 (en) | 2016-12-30 | 2019-04-30 | Invensas Bonding Technologies, Inc. | Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein |
US11715730B2 (en) | 2017-03-16 | 2023-08-01 | Adeia Semiconductor Technologies Llc | Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements |
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US11169326B2 (en) | 2018-02-26 | 2021-11-09 | Invensas Bonding Technologies, Inc. | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects |
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Also Published As
Publication number | Publication date |
---|---|
CN101281893B (zh) | 2010-06-16 |
RU2447540C2 (ru) | 2012-04-10 |
CN101281893A (zh) | 2008-10-08 |
US7741724B2 (en) | 2010-06-22 |
KR20080090304A (ko) | 2008-10-08 |
RU2008112657A (ru) | 2009-10-10 |
US20080237877A1 (en) | 2008-10-02 |
TW200845252A (en) | 2008-11-16 |
TWI370500B (en) | 2012-08-11 |
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