SG11201807340SA - A circuit layer for an integrated circuit card - Google Patents

A circuit layer for an integrated circuit card

Info

Publication number
SG11201807340SA
SG11201807340SA SG11201807340SA SG11201807340SA SG11201807340SA SG 11201807340S A SG11201807340S A SG 11201807340SA SG 11201807340S A SG11201807340S A SG 11201807340SA SG 11201807340S A SG11201807340S A SG 11201807340SA SG 11201807340S A SG11201807340S A SG 11201807340SA
Authority
SG
Singapore
Prior art keywords
international
circuit
pct
substrate
integrated circuit
Prior art date
Application number
SG11201807340SA
Inventor
Finn Nielsen
Original Assignee
Cardlab Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cardlab Aps filed Critical Cardlab Aps
Publication of SG11201807340SA publication Critical patent/SG11201807340SA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -, Organization IIIM141101110101011111 HO 1111101110101111111011110 11111011111110111011# International Bureau 0.. .... .. ..... ..or::,„, (10) International Publication Number (43) International Publication Date WO 2017/148901 Al 8 September 2017 (08.09.2017) WIP0 I PCT (51) (21) (22) (25) Filing Language: (26) Publication Language: (30) (71) (72) (74) (81) International Patent Classification: BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, GOOK 19/077 (2006.01) DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, International Application Number: KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, PCT/EP2017/054576 MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, International Filing Date: NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, 28 February 2017 (28.02.2017) RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, English ZA, ZM, ZW. English (84) Designated States (unless otherwise indicated, for every Priority Data: kind of regional protection available): ARIPO (BW, GH, 16158068.3 1 March 2016 (01.03.2016) EP GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, Applicant: CARDLAB APS [DK/DK]; Lysker 3 EF, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, 2730 Herlev (DK). DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, Inventor: NIELSEN, Finn; Grwkenlandsvej 125, 2300 LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, Copenhagen S (DK). SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Agent: INSPICOS P/S; Kogle All& 2, 2970 Horsholm Declarations under Rule 4.17: (DK). — of inventorship (Rule 4.17(iv)) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, [Continued on next page] Title: A CIRCUIT LAYER FOR AN INTEGRATED CIRCUIT CARD : A circuit layer for the substrate and circuit. To enable larger tolerances of the position of the circuit in the substrate, pads with a quadrangular shape and the contact pads are exposed through the coating by holes having (54) N covering contact a substrate and a coating the electronic circuit has a circular shape. 3 MM .< 1 I MM ,-, 11 © cr, ot 71. IN 1-1 (57) Fig. 1 an integrated circuit card comprising an electronic circuit embedded in WO 2017/148901 Al 1#110HOMMIONOIDEMOMOIDIVIDIMOIROMOVOIMIE Published: — with international search report (Art. 21(3))
SG11201807340SA 2016-03-01 2017-02-28 A circuit layer for an integrated circuit card SG11201807340SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16158068 2016-03-01
PCT/EP2017/054576 WO2017148901A1 (en) 2016-03-01 2017-02-28 A circuit layer for an integrated circuit card

Publications (1)

Publication Number Publication Date
SG11201807340SA true SG11201807340SA (en) 2018-09-27

Family

ID=55456632

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807340SA SG11201807340SA (en) 2016-03-01 2017-02-28 A circuit layer for an integrated circuit card

Country Status (11)

Country Link
US (1) US10963770B2 (en)
EP (1) EP3423993B1 (en)
KR (1) KR102611384B1 (en)
CN (1) CN108701248B (en)
AU (1) AU2017226865B2 (en)
CA (1) CA3015971A1 (en)
MY (1) MY195079A (en)
RU (1) RU2725617C2 (en)
SG (1) SG11201807340SA (en)
WO (1) WO2017148901A1 (en)
ZA (1) ZA201806115B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card
USD1010657S1 (en) * 2020-02-28 2024-01-09 Chad Braswell E-card
CN113806819B (en) * 2021-08-30 2024-02-09 高赵涵 M1 card sector expansion process

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2620586A1 (en) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa METHOD FOR MANUFACTURING ELECTRONIC MODULES, IN PARTICULAR FOR MICROCIRCUIT CARDS
JPH07179088A (en) * 1993-12-22 1995-07-18 Ibiden Co Ltd Ic card and its manufacture
FR2735284B1 (en) 1995-06-12 1997-08-29 Solaic Sa CHIP FOR ELECTRONIC CARD COATED WITH A LAYER OF INSULATING MATERIAL AND ELECTRONIC CARD CONTAINING SUCH A CHIP
US9530857B2 (en) * 2003-06-20 2016-12-27 Tessera Advanced Technologies, Inc. Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
US6927498B2 (en) * 2003-11-19 2005-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Bond pad for flip chip package
TWI232072B (en) * 2004-04-05 2005-05-01 Wistron Corp Method and structure for printed circuit board assembly and jig for assembling structure
ATE541312T1 (en) * 2004-05-28 2012-01-15 Nxp Bv CHIP WITH TWO GROUPS OF CHIP CONTACTS
US7785932B2 (en) 2005-02-01 2010-08-31 Nagraid S.A. Placement method of an electronic module on a substrate and device produced by said method
IL178262A (en) * 2006-09-21 2013-06-27 Aser Rich Ltd Device and method for smartcard assisted digital content purchase and storage
JP4945738B2 (en) * 2006-12-27 2012-06-06 日本電産サンキョー株式会社 Medium processing apparatus and control method thereof
JP2008258258A (en) 2007-04-02 2008-10-23 Sanyo Electric Co Ltd Semiconductor device
US20090096076A1 (en) * 2007-10-16 2009-04-16 Jung Young Hy Stacked semiconductor package without reduction in stata storage capacity and method for manufacturing the same
US20110011939A1 (en) * 2007-12-19 2011-01-20 Linda Seah Contact-less and dual interface inlays and methods for producing the same
EP2463809A1 (en) * 2010-12-07 2012-06-13 NagraID S.A. Electronic card with electric contact including an electronic unit and/or an antenna
JP5924017B2 (en) * 2011-02-16 2016-05-25 株式会社リコー Reversible thermosensitive recording medium and method for producing the same
JP2014033389A (en) * 2012-08-06 2014-02-20 Seiko Epson Corp Vibration device, electronic device, electronic apparatus, and movable body
US9224695B2 (en) * 2013-02-28 2015-12-29 Infineon Technologies Ag Chip arrangement and a method for manufacturing a chip arrangement
US20150206047A1 (en) * 2014-01-20 2015-07-23 John Herslow Metal card with radio frequency (rf) transmission capability
DE102014107299B4 (en) * 2014-05-23 2019-03-28 Infineon Technologies Ag Smart card module, smart card, and method of manufacturing a smart card module
CN204069493U (en) * 2014-07-09 2014-12-31 上海卓悠网络科技有限公司 A kind of pcb board project organization and Hall switch, highlighted side-emitting, SIM card
KR102455398B1 (en) * 2015-11-24 2022-10-17 에스케이하이닉스 주식회사 Stretchable semiconductor package and semiconductor device

Also Published As

Publication number Publication date
RU2018133848A (en) 2020-04-01
RU2018133848A3 (en) 2020-04-27
MY195079A (en) 2023-01-09
BR112018067390A2 (en) 2019-01-02
US10963770B2 (en) 2021-03-30
US20190065922A1 (en) 2019-02-28
AU2017226865B2 (en) 2022-08-25
CN108701248B (en) 2022-04-26
EP3423993A1 (en) 2019-01-09
KR20180124892A (en) 2018-11-21
RU2725617C2 (en) 2020-07-03
WO2017148901A1 (en) 2017-09-08
EP3423993B1 (en) 2020-07-01
CN108701248A (en) 2018-10-23
AU2017226865A1 (en) 2018-09-27
KR102611384B1 (en) 2023-12-08
CA3015971A1 (en) 2017-09-08
ZA201806115B (en) 2020-12-23

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