MX2015011602A - Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico. - Google Patents

Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico.

Info

Publication number
MX2015011602A
MX2015011602A MX2015011602A MX2015011602A MX2015011602A MX 2015011602 A MX2015011602 A MX 2015011602A MX 2015011602 A MX2015011602 A MX 2015011602A MX 2015011602 A MX2015011602 A MX 2015011602A MX 2015011602 A MX2015011602 A MX 2015011602A
Authority
MX
Mexico
Prior art keywords
control apparatus
electronic control
viscosity
thermal grease
application
Prior art date
Application number
MX2015011602A
Other languages
English (en)
Other versions
MX351312B (es
Inventor
Yoshio Kawai
Yoshiyasu Negishi
Takayuki Fukuzawa
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of MX2015011602A publication Critical patent/MX2015011602A/es
Publication of MX351312B publication Critical patent/MX351312B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

En una configuración en que una grasa térmica se aplica entre una tarjeta de circuito que tiene un componente electrónico montado en la misma y un cuerpo de carcasa que contiene la tarjeta para conectar térmicamente ambos por medio de la grasa térmica, la aplicación no es fácil debido a que la grasa térmica es alta en viscosidad inicial. Una grasa 5 térmica se fabrica de un material que tiene una viscosidad que no impide la aplicabilidad en la etapa inicial (antes de la aplicación) por ejemplo, una viscosidad de aproximadamente 50-400 (Pa•s), y que aumenta a aproximadamente 600-3,000 (Pa•s) en viscosidad después de la aplicación.
MX2015011602A 2013-03-21 2014-01-20 Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico. MX351312B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013058888A JP6141064B2 (ja) 2013-03-21 2013-03-21 回路基板と筐体の接続方法
PCT/JP2014/050985 WO2014148085A1 (ja) 2013-03-21 2014-01-20 電子制御装置及び電子制御装置の基板接続方法

Publications (2)

Publication Number Publication Date
MX2015011602A true MX2015011602A (es) 2016-04-25
MX351312B MX351312B (es) 2017-10-10

Family

ID=51579781

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015011602A MX351312B (es) 2013-03-21 2014-01-20 Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico.

Country Status (6)

Country Link
US (1) US10028412B2 (es)
JP (1) JP6141064B2 (es)
CN (1) CN104871311B (es)
DE (1) DE112014001533B4 (es)
MX (1) MX351312B (es)
WO (1) WO2014148085A1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015209191A1 (de) 2015-02-10 2016-08-11 Conti Temic Microelectronic Gmbh Mechatronische Komponente und Verfahren zu deren Herstellung
JP2016176557A (ja) * 2015-03-20 2016-10-06 キヤノン株式会社 制振構造体及び制振ワッシャ
JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
JP6198998B2 (ja) * 2015-05-14 2017-09-20 三菱電機株式会社 電磁アクチュエータ
JP6453195B2 (ja) 2015-09-29 2019-01-16 日立オートモティブシステムズ株式会社 車載制御装置
JP6129370B1 (ja) * 2016-02-15 2017-05-17 三菱電機株式会社 防水型電子機器ユニット
SE540653C2 (sv) * 2016-03-29 2018-10-09 Atlas Copco Airpower Nv Arrangemang anordnat att innesluta ett kretskort innefattande elektroniska komponenter och ett verktyg innefattande arrangemanget
CN108513495B (zh) * 2016-08-26 2019-07-16 浙江大学 一种板卡散热器导热胶泥压制装置
TWI642348B (zh) * 2017-09-25 2018-11-21 群光電能科技股份有限公司 具有隔熱功能的電源供應器
CN107846102B (zh) * 2017-10-26 2021-12-07 珠海格力节能环保制冷技术研究中心有限公司 多用途机壳和电机
JP7016054B2 (ja) * 2018-01-12 2022-02-04 パナソニックＩｐマネジメント株式会社 電源装置、前照灯、及び移動体
US10779444B2 (en) * 2018-01-19 2020-09-15 Ge Aviation Systems Llc Control boxes and system-on-module circuit boards for unmanned vehicles
US11343942B2 (en) 2018-05-14 2022-05-24 Mitsubishi Electric Corporation Power conversion device including cooling components
JP6948013B2 (ja) * 2018-06-11 2021-10-13 住友電装株式会社 電気接続箱
US10763193B2 (en) 2018-10-30 2020-09-01 Hamilton Sundstrand Corporation Power control modules
CN111211059B (zh) * 2018-11-22 2023-07-04 矽品精密工业股份有限公司 电子封装件及其制法与散热件
DE102019131159A1 (de) * 2019-11-19 2021-05-20 Connaught Electronics Ltd. Kühlkörper zum Halten von Wärmeleitpaste und zur Wärmesenkung für eine Verwendung in einer elektronischen Steuereinheit (Electronic Control Unit - ECU)

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19701731A1 (de) 1997-01-20 1998-07-23 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
JP3531048B2 (ja) * 1997-02-20 2004-05-24 松下電器産業株式会社 液晶表示装置
JP3697902B2 (ja) * 1998-07-06 2005-09-21 松下電器産業株式会社 電子部品の実装方法
JP2001168545A (ja) * 1999-12-03 2001-06-22 Denso Corp 電子装置及び電子装置のシール方法
DE60139533D1 (de) * 2000-08-01 2009-09-24 Mitsubishi Electric Corp Elektronisches Gerät mit einem Substrat für die Schaltung
JP3905363B2 (ja) * 2001-06-28 2007-04-18 ハリマ化成株式会社 封止充填剤用液状エポキシ樹脂組成物
JP2003289191A (ja) * 2002-03-28 2003-10-10 Denso Corp 電子制御装置
JP3917473B2 (ja) * 2002-06-21 2007-05-23 株式会社オートネットワーク技術研究所 パワーモジュール
JP4321999B2 (ja) * 2002-09-19 2009-08-26 日本特殊塗料株式会社 ブラックアウトフィルムを含む自動車のシーリング方法
US20060067055A1 (en) * 2004-09-30 2006-03-30 Heffner Kenneth H Thermally conductive composite and uses for microelectronic packaging
JP4473141B2 (ja) * 2005-01-04 2010-06-02 日立オートモティブシステムズ株式会社 電子制御装置
JP5166677B2 (ja) 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP4538359B2 (ja) * 2005-03-31 2010-09-08 株式会社日立産機システム 電気回路モジュール
JP4593416B2 (ja) * 2005-09-22 2010-12-08 株式会社デンソー 電子制御装置
CN1962807A (zh) * 2005-11-11 2007-05-16 鸿富锦精密工业（深圳）有限公司 热界面材料混合方法及系统
JP4897360B2 (ja) * 2006-06-08 2012-03-14 ポリマテック株式会社 熱伝導性成形体及びその製造方法
TWI472595B (zh) * 2006-08-22 2015-02-11 Mitsubishi Chem Corp Semiconductor component components and semiconductor light emitting components
JP2008174697A (ja) 2007-01-16 2008-07-31 Nippon Handa Kk 熱伝導性オイル組成物、放熱剤及び電子部品又は電子機器
JP2009221311A (ja) * 2008-03-14 2009-10-01 Momentive Performance Materials Inc 熱伝導性グリース組成物
JP2010109293A (ja) * 2008-10-31 2010-05-13 General Electric Co <Ge> 配線構造の製造方法及び低温配線部品回収方法
JP5155914B2 (ja) * 2009-03-19 2013-03-06 日立オートモティブシステムズ株式会社 制御ユニット
CN101887872A (zh) * 2009-05-12 2010-11-17 日月光半导体制造股份有限公司 半导体芯片的散热封装构造
JP2011060927A (ja) * 2009-09-09 2011-03-24 Hitachi Ltd 半導体装置
JP5759191B2 (ja) * 2010-01-29 2015-08-05 日東電工株式会社 パワーモジュール
JP5383599B2 (ja) * 2010-06-21 2014-01-08 三菱電機株式会社 半導体モジュールユニットの製造方法
CN102760707B (zh) * 2011-04-29 2017-04-12 博世汽车部件(苏州)有限公司 电子控制单元组件以及包括所述电子控制单元组件的车辆
JP5474877B2 (ja) * 2011-06-17 2014-04-16 日立オートモティブシステムズ株式会社 電子制御装置
JP5565758B2 (ja) 2011-06-29 2014-08-06 信越化学工業株式会社 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置
JP2013030518A (ja) 2011-07-27 2013-02-07 Hitachi Automotive Systems Ltd 電子制御装置

Also Published As

Publication number Publication date
CN104871311A (zh) 2015-08-26
JP2014187063A (ja) 2014-10-02
US10028412B2 (en) 2018-07-17
DE112014001533T5 (de) 2015-12-03
JP6141064B2 (ja) 2017-06-07
CN104871311B (zh) 2018-10-09
WO2014148085A1 (ja) 2014-09-25
US20160021789A1 (en) 2016-01-21
DE112014001533B4 (de) 2021-09-09
MX351312B (es) 2017-10-10

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