BR112016001796A2 - módulo eletrônico - Google Patents
módulo eletrônicoInfo
- Publication number
- BR112016001796A2 BR112016001796A2 BR112016001796A BR112016001796A BR112016001796A2 BR 112016001796 A2 BR112016001796 A2 BR 112016001796A2 BR 112016001796 A BR112016001796 A BR 112016001796A BR 112016001796 A BR112016001796 A BR 112016001796A BR 112016001796 A2 BR112016001796 A2 BR 112016001796A2
- Authority
- BR
- Brazil
- Prior art keywords
- circuit board
- multilayer circuit
- electronic module
- pair
- heat pump
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10219—Thermoelectric component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
um módulo eletrônico (40) é fornecido que inclui uma placa de circuito multicamada (41), e um componente eletrônico (62), e uma bomba de calor peltier (60). o componente eletrônico é montado sobre uma superfície principal da placa de circuito multicamada e é eletricamente acoplado a pelo menos uma matriz de memória (48). a pelo menos uma matriz de memória é pelo menos parcialmente incorporada dentro da placa de circuito multicamada. o dispositivo de bomba de calor peltier tem pelo menos um par de membros semicondutores termoelétricos (68, 69) dispostos termicamente em paralelo e eletricamente em série, e o pelo menos um par de membros semicondutores são pelo menos parcialmente incorporados na placa de circuito.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13178585 | 2013-07-30 | ||
PCT/EP2014/064129 WO2015014563A1 (en) | 2013-07-30 | 2014-07-03 | Electronic module |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112016001796A2 true BR112016001796A2 (pt) | 2017-08-01 |
Family
ID=48900833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112016001796A BR112016001796A2 (pt) | 2013-07-30 | 2014-07-03 | módulo eletrônico |
Country Status (7)
Country | Link |
---|---|
US (1) | US9907181B2 (pt) |
EP (1) | EP3028547B1 (pt) |
JP (1) | JP2016527727A (pt) |
KR (1) | KR20160037846A (pt) |
CN (1) | CN105340372A (pt) |
BR (1) | BR112016001796A2 (pt) |
WO (1) | WO2015014563A1 (pt) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102659959B1 (ko) * | 2016-02-12 | 2024-04-23 | 예일 유니버시티 | 양자 시스템을 제어하는 기술 그리고 관련 시스템 및 방법 |
EP3249686A1 (en) * | 2016-05-24 | 2017-11-29 | Mitsubishi Electric R&D Centre Europe B.V. | A power module |
WO2018063414A1 (en) * | 2016-10-01 | 2018-04-05 | Intel Corporation | Module installation on printed circuit boards with embedded trace technology |
EP3735711A4 (en) | 2018-01-05 | 2021-10-06 | Yale University | MATERIAL EFFICIENT FAILURE TOLERANCE OPERATIONS WITH SUPPRACONDUCTOR CIRCUITS |
CN112087860A (zh) * | 2020-09-16 | 2020-12-15 | 广州小鹏汽车科技有限公司 | 印制电路板及其制造方法、电子设备和车辆 |
CN117241466B (zh) * | 2023-11-13 | 2024-01-26 | 信丰迅捷兴电路科技有限公司 | 一种内埋器件的液冷电路板及其制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5921087A (en) * | 1997-04-22 | 1999-07-13 | Intel Corporation | Method and apparatus for cooling integrated circuits using a thermoelectric module |
US6094919A (en) * | 1999-01-04 | 2000-08-01 | Intel Corporation | Package with integrated thermoelectric module for cooling of integrated circuits |
US6461895B1 (en) * | 1999-01-05 | 2002-10-08 | Intel Corporation | Process for making active interposer for high performance packaging applications |
US20030057544A1 (en) * | 2001-09-13 | 2003-03-27 | Nathan Richard J. | Integrated assembly protocol |
US7034394B2 (en) * | 2003-10-08 | 2006-04-25 | Intel Corporation | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
US7299639B2 (en) * | 2004-06-22 | 2007-11-27 | Intel Corporation | Thermoelectric module |
TW200605169A (en) * | 2004-06-29 | 2006-02-01 | Sanyo Electric Co | Circuit device and process for manufacture thereof |
JP2006013367A (ja) * | 2004-06-29 | 2006-01-12 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
US7250327B2 (en) * | 2004-06-30 | 2007-07-31 | Intel Corporation | Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism |
TWI260056B (en) | 2005-02-01 | 2006-08-11 | Phoenix Prec Technology Corp | Module structure having an embedded chip |
US20060179849A1 (en) * | 2005-02-14 | 2006-08-17 | Abramov Vladimir S | Peltier based heat transfer systems |
US7592202B2 (en) | 2006-03-31 | 2009-09-22 | Intel Corporation | Embedding device in substrate cavity |
DE102009003934A1 (de) * | 2009-01-05 | 2010-07-08 | Siemens Aktiengesellschaft | Anordnung zur Kühlung einer Wärmequelle einer elektronischen Schaltung |
JP5367413B2 (ja) * | 2009-03-02 | 2013-12-11 | ラピスセミコンダクタ株式会社 | 半導体装置 |
KR101928005B1 (ko) * | 2011-12-01 | 2019-03-13 | 삼성전자주식회사 | 열전 냉각 패키지 및 이의 열관리 방법 |
EP2790474B1 (en) * | 2013-04-09 | 2016-03-16 | Harman Becker Automotive Systems GmbH | Thermoelectric cooler/heater integrated in printed circuit board |
US9837595B2 (en) * | 2015-05-20 | 2017-12-05 | Mediatek Inc. | Semiconductor package assembly with thermal recycling function |
-
2014
- 2014-07-03 BR BR112016001796A patent/BR112016001796A2/pt not_active IP Right Cessation
- 2014-07-03 WO PCT/EP2014/064129 patent/WO2015014563A1/en active Application Filing
- 2014-07-03 CN CN201480035622.6A patent/CN105340372A/zh active Pending
- 2014-07-03 JP JP2016530400A patent/JP2016527727A/ja active Pending
- 2014-07-03 US US14/909,180 patent/US9907181B2/en active Active
- 2014-07-03 KR KR1020157036536A patent/KR20160037846A/ko not_active Application Discontinuation
- 2014-07-03 EP EP14735942.6A patent/EP3028547B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20160174382A1 (en) | 2016-06-16 |
CN105340372A (zh) | 2016-02-17 |
EP3028547B1 (en) | 2019-12-11 |
US9907181B2 (en) | 2018-02-27 |
KR20160037846A (ko) | 2016-04-06 |
EP3028547A1 (en) | 2016-06-08 |
WO2015014563A1 (en) | 2015-02-05 |
JP2016527727A (ja) | 2016-09-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: dismissal - article 86 of industrial property law | ||
B08K | Lapse as no evidence of payment of the annual fee has been furnished to inpi (acc. art. 87) |