BR112016023615A2 - capacitor de pacote comutável para conservação de carga e resistência em série - Google Patents
capacitor de pacote comutável para conservação de carga e resistência em sérieInfo
- Publication number
- BR112016023615A2 BR112016023615A2 BR112016023615A BR112016023615A BR112016023615A2 BR 112016023615 A2 BR112016023615 A2 BR 112016023615A2 BR 112016023615 A BR112016023615 A BR 112016023615A BR 112016023615 A BR112016023615 A BR 112016023615A BR 112016023615 A2 BR112016023615 A2 BR 112016023615A2
- Authority
- BR
- Brazil
- Prior art keywords
- resistance
- switchable
- conservation
- series
- capacitor
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 4
- 239000011159 matrix material Substances 0.000 abstract 4
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F3/00—Non-retroactive systems for regulating electric variables by using an uncontrolled element, or an uncontrolled combination of elements, such element or such combination having self-regulating properties
- G05F3/02—Regulating voltage or current
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
- G06F1/3234—Power saving characterised by the action undertaken
- G06F1/3287—Power saving characterised by the action undertaken by switching off individual functional units in the computer system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/647—Resistive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Electromagnetism (AREA)
- Radar, Positioning & Navigation (AREA)
- Automation & Control Theory (AREA)
- Computing Systems (AREA)
- Semiconductor Integrated Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Direct Current Feeding And Distribution (AREA)
- Attenuators (AREA)
- Measurement Of Current Or Voltage (AREA)
Abstract
trata-se, em uma modalidade, de um aparelho que compreende um capacitor e uma matriz. a matriz compreende um comutador de resistor acoplado entre uma linha de potência e o capacitor, em que o comutador de resistor tem uma resistência ajustável, e a linha de potência e o capacitor são ambos externos em relação à matriz. a matriz também compreende um circuito configurado para receber potência a partir da linha de potência.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/250,150 US9377804B2 (en) | 2014-04-10 | 2014-04-10 | Switchable package capacitor for charge conservation and series resistance |
PCT/US2015/019526 WO2015156940A2 (en) | 2014-04-10 | 2015-03-09 | Switchable package capacitor for charge conservation and series resistance |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112016023615A2 true BR112016023615A2 (pt) | 2017-08-15 |
Family
ID=52697567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112016023615A BR112016023615A2 (pt) | 2014-04-10 | 2015-03-09 | capacitor de pacote comutável para conservação de carga e resistência em série |
Country Status (7)
Country | Link |
---|---|
US (2) | US9377804B2 (pt) |
EP (1) | EP3130008B1 (pt) |
JP (2) | JP6509904B2 (pt) |
KR (1) | KR102154089B1 (pt) |
CN (1) | CN106170739B (pt) |
BR (1) | BR112016023615A2 (pt) |
WO (1) | WO2015156940A2 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9377804B2 (en) | 2014-04-10 | 2016-06-28 | Qualcomm Incorporated | Switchable package capacitor for charge conservation and series resistance |
US20160173082A1 (en) * | 2014-12-12 | 2016-06-16 | Mediatek Inc. | Method for performing impedance profile control of a power delivery network in an electronic device, and associated apparatus |
US10581414B2 (en) * | 2015-10-14 | 2020-03-03 | Mediatek Inc. | Semiconductor integrated circuit device |
US10664035B2 (en) * | 2017-08-31 | 2020-05-26 | Qualcomm Incorporated | Reconfigurable power delivery networks |
US11437366B2 (en) * | 2017-09-29 | 2022-09-06 | Intel Corporation | Tunable passive semiconductor elements |
JP6652998B1 (ja) * | 2018-09-03 | 2020-02-26 | レノボ・シンガポール・プライベート・リミテッド | 情報処理装置および制御方法 |
CN117219145A (zh) * | 2020-08-06 | 2023-12-12 | 长江存储科技有限责任公司 | 用于三维存储器的多管芯峰值功率管理 |
EP4147238A4 (en) | 2020-11-26 | 2023-11-01 | Yangtze Memory Technologies Co., Ltd. | DYNAMIC PEAK POWER MANAGEMENT FOR MULTIPLE CHIP OPERATIONS |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6072690A (en) | 1998-01-15 | 2000-06-06 | International Business Machines Corporation | High k dielectric capacitor with low k sheathed signal vias |
US6806569B2 (en) | 2001-09-28 | 2004-10-19 | Intel Corporation | Multi-frequency power delivery system |
US6700390B2 (en) | 2002-05-31 | 2004-03-02 | Sun Microsystems, Inc. | Adjustment and calibration system to store resistance settings to control chip/package resonance |
JP4107052B2 (ja) * | 2002-10-30 | 2008-06-25 | 株式会社デンソー | 多出力電源装置 |
US6949810B2 (en) | 2003-10-14 | 2005-09-27 | Intel Corporation | Active phase cancellation for power delivery |
JP2006271182A (ja) * | 2005-02-25 | 2006-10-05 | Rohm Co Ltd | 昇降圧レギュレータ回路及びこれを用いた液晶表示装置 |
JP2007304698A (ja) * | 2006-05-09 | 2007-11-22 | Nec Electronics Corp | 電源回路及び液晶表示装置 |
JP2008251571A (ja) * | 2007-03-29 | 2008-10-16 | Fujitsu Microelectronics Ltd | 半導体集積回路の設計方法および設計用プログラム |
US7701277B2 (en) * | 2007-12-12 | 2010-04-20 | Synopsys, Inc. | Variable-impedance gated decoupling cell |
US8164916B1 (en) | 2008-01-10 | 2012-04-24 | Altera Corportation | Techniques for attenuating resonance induced impedance in integrated circuits |
JP5579369B2 (ja) | 2008-01-24 | 2014-08-27 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置 |
JP5139171B2 (ja) * | 2008-02-05 | 2013-02-06 | 日本特殊陶業株式会社 | ビアアレイ型積層セラミックコンデンサ及びその製造方法、コンデンサ内蔵配線基板 |
KR100974213B1 (ko) | 2008-08-12 | 2010-08-06 | 주식회사 하이닉스반도체 | 전원 잡음 검출 장치 및 이를 이용한 전원 잡음 제어 장치 |
CN101807105B (zh) * | 2009-02-17 | 2014-12-10 | 国家电网公司 | 时序控制电路 |
JP2010226224A (ja) * | 2009-03-19 | 2010-10-07 | Toshiba Corp | 半導体装置 |
JP2011014629A (ja) * | 2009-06-30 | 2011-01-20 | Yamaha Corp | 半導体装置 |
JP2011155144A (ja) * | 2010-01-27 | 2011-08-11 | Toshiba Corp | 半導体装置 |
US20130124890A1 (en) | 2010-07-27 | 2013-05-16 | Michael Priel | Multi-core processor and method of power management of a multi-core processor |
US20120105129A1 (en) * | 2010-10-28 | 2012-05-03 | Naffziger Samuel D | Apparatus for monolithic power gating on an integrated circuit |
JP5691670B2 (ja) | 2011-03-09 | 2015-04-01 | 日本電気株式会社 | 半導体集積回路の電源制御システムおよび電源制御方法 |
US8531194B2 (en) * | 2011-03-24 | 2013-09-10 | Freescale Semiconductor, Inc. | Selectable threshold reset circuit |
JP2012205408A (ja) * | 2011-03-25 | 2012-10-22 | Denso Corp | 電源回路 |
WO2013038511A1 (ja) * | 2011-09-13 | 2013-03-21 | 富士通株式会社 | 半導体集積回路の設計方法及び半導体集積回路の設計プログラム |
US9337722B2 (en) * | 2012-01-27 | 2016-05-10 | Invensense, Inc. | Fast power-up bias voltage circuit |
JP6065480B2 (ja) * | 2012-09-14 | 2017-01-25 | 株式会社リコー | 半導体集積回路および電子回路 |
US9377804B2 (en) | 2014-04-10 | 2016-06-28 | Qualcomm Incorporated | Switchable package capacitor for charge conservation and series resistance |
-
2014
- 2014-04-10 US US14/250,150 patent/US9377804B2/en active Active
-
2015
- 2015-03-09 CN CN201580018580.XA patent/CN106170739B/zh active Active
- 2015-03-09 JP JP2016561718A patent/JP6509904B2/ja active Active
- 2015-03-09 EP EP15711387.9A patent/EP3130008B1/en active Active
- 2015-03-09 WO PCT/US2015/019526 patent/WO2015156940A2/en active Application Filing
- 2015-03-09 KR KR1020167028011A patent/KR102154089B1/ko active IP Right Grant
- 2015-03-09 BR BR112016023615A patent/BR112016023615A2/pt active Search and Examination
-
2016
- 2016-05-25 US US15/164,130 patent/US9618957B2/en active Active
-
2019
- 2019-04-03 JP JP2019071181A patent/JP2019145814A/ja not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
US20160266596A1 (en) | 2016-09-15 |
WO2015156940A3 (en) | 2015-12-23 |
EP3130008A2 (en) | 2017-02-15 |
JP2019145814A (ja) | 2019-08-29 |
EP3130008B1 (en) | 2020-04-29 |
US20150293551A1 (en) | 2015-10-15 |
US9377804B2 (en) | 2016-06-28 |
CN106170739A (zh) | 2016-11-30 |
US9618957B2 (en) | 2017-04-11 |
CN106170739B (zh) | 2017-10-13 |
JP6509904B2 (ja) | 2019-05-08 |
WO2015156940A2 (en) | 2015-10-15 |
KR20160140712A (ko) | 2016-12-07 |
KR102154089B1 (ko) | 2020-09-09 |
JP2017520104A (ja) | 2017-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B350 | Update of information on the portal [chapter 15.35 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B11D | Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time |