FI10729U1 - Jäähdytysjärjestely puolijohdemoduulin jäähdyttämiseen ja sähkölaite - Google Patents

Jäähdytysjärjestely puolijohdemoduulin jäähdyttämiseen ja sähkölaite

Info

Publication number
FI10729U1
FI10729U1 FIU20144251U FIU20144251U FI10729U1 FI 10729 U1 FI10729 U1 FI 10729U1 FI U20144251 U FIU20144251 U FI U20144251U FI U20144251 U FIU20144251 U FI U20144251U FI 10729 U1 FI10729 U1 FI 10729U1
Authority
FI
Finland
Prior art keywords
cooling
electrical device
semiconductor module
arrangement
cooling arrangement
Prior art date
Application number
FIU20144251U
Other languages
English (en)
Swedish (sv)
Inventor
Pertti Seväkivi
Niko Björkman
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Priority to FIU20144251U priority Critical patent/FI10729U1/fi
Application granted granted Critical
Publication of FI10729U1 publication Critical patent/FI10729U1/fi
Priority to DE202015100342.0U priority patent/DE202015100342U1/de
Priority to CN201520508089.2U priority patent/CN204792759U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FIU20144251U 2014-11-25 2014-11-25 Jäähdytysjärjestely puolijohdemoduulin jäähdyttämiseen ja sähkölaite FI10729U1 (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FIU20144251U FI10729U1 (fi) 2014-11-25 2014-11-25 Jäähdytysjärjestely puolijohdemoduulin jäähdyttämiseen ja sähkölaite
DE202015100342.0U DE202015100342U1 (de) 2014-11-25 2015-01-26 Kühlanordnung zur Kühlung eines Halbleitermoduls und elektrisches Gerät
CN201520508089.2U CN204792759U (zh) 2014-11-25 2015-07-14 用于冷却半导体模块的冷却装置和电设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FIU20144251U FI10729U1 (fi) 2014-11-25 2014-11-25 Jäähdytysjärjestely puolijohdemoduulin jäähdyttämiseen ja sähkölaite

Publications (1)

Publication Number Publication Date
FI10729U1 true FI10729U1 (fi) 2014-12-17

Family

ID=52281685

Family Applications (1)

Application Number Title Priority Date Filing Date
FIU20144251U FI10729U1 (fi) 2014-11-25 2014-11-25 Jäähdytysjärjestely puolijohdemoduulin jäähdyttämiseen ja sähkölaite

Country Status (3)

Country Link
CN (1) CN204792759U (fi)
DE (1) DE202015100342U1 (fi)
FI (1) FI10729U1 (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108806930B (zh) * 2018-04-27 2020-06-23 山特电子（深圳）有限公司 散热器及包括其的散热装置、自冷却电感器套件和电设备

Also Published As

Publication number Publication date
DE202015100342U1 (de) 2015-02-06
CN204792759U (zh) 2015-11-18

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