DE112014001516T8 - Kontaktbauteil und Halbleitermodul - Google Patents

Kontaktbauteil und Halbleitermodul Download PDF

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Publication number
DE112014001516T8
DE112014001516T8 DE112014001516.4T DE112014001516T DE112014001516T8 DE 112014001516 T8 DE112014001516 T8 DE 112014001516T8 DE 112014001516 T DE112014001516 T DE 112014001516T DE 112014001516 T8 DE112014001516 T8 DE 112014001516T8
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DE
Germany
Prior art keywords
semiconductor module
contact component
component
contact
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112014001516.4T
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English (en)
Other versions
DE112014001516B4 (de
DE112014001516T5 (de
Inventor
Makoto Isozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of DE112014001516T5 publication Critical patent/DE112014001516T5/de
Application granted granted Critical
Publication of DE112014001516T8 publication Critical patent/DE112014001516T8/de
Publication of DE112014001516B4 publication Critical patent/DE112014001516B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13011—Shape comprising apertures or cavities, e.g. hollow bump
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13016—Shape in side view
    • H01L2224/13017—Shape in side view being non uniform along the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE112014001516.4T 2013-03-21 2014-03-11 Kontaktbauteil und Halbleitermodul Active DE112014001516B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-058462 2013-03-21
JP2013058462 2013-03-21
PCT/JP2014/056347 WO2014148319A1 (ja) 2013-03-21 2014-03-11 コンタクト部品、および半導体モジュール

Publications (3)

Publication Number Publication Date
DE112014001516T5 DE112014001516T5 (de) 2016-01-07
DE112014001516T8 true DE112014001516T8 (de) 2016-02-25
DE112014001516B4 DE112014001516B4 (de) 2023-07-06

Family

ID=51580006

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112014001516.4T Active DE112014001516B4 (de) 2013-03-21 2014-03-11 Kontaktbauteil und Halbleitermodul

Country Status (5)

Country Link
US (1) US9406633B2 (de)
JP (1) JP6041043B2 (de)
CN (1) CN105027279B (de)
DE (1) DE112014001516B4 (de)
WO (1) WO2014148319A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014211698A1 (de) * 2014-06-18 2015-12-24 Robert Bosch Gmbh Elektronisches Modul mit einer Kontakthülse
JP2018503264A (ja) * 2015-01-23 2018-02-01 アーベーベー・シュバイツ・アーゲー パワー半導体モジュールの生成方法
JP6481527B2 (ja) * 2015-06-25 2019-03-13 富士電機株式会社 半導体装置
JP6866716B2 (ja) * 2017-03-23 2021-04-28 富士電機株式会社 半導体装置
WO2019176380A1 (ja) * 2018-03-16 2019-09-19 富士電機株式会社 半導体装置
JP7322369B2 (ja) 2018-09-21 2023-08-08 富士電機株式会社 半導体装置の製造方法
JP6680391B2 (ja) * 2019-05-13 2020-04-15 富士電機株式会社 半導体装置、金属部材および半導体装置の製造方法
CN113035790B (zh) * 2019-12-24 2024-04-02 株洲中车时代半导体有限公司 焊接底座及功率半导体模块
EP3859776A1 (de) * 2020-01-31 2021-08-04 Infineon Technologies AG Leistungshalbleiterbauelement und verfahren zur herstellung eines leistungshalbleiterbauelements
DE102020114650B3 (de) * 2020-06-02 2021-06-02 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Baugruppe mit einer elektrisch leitenden Hülse und mit einem Schaltungsträger
EP3951866A1 (de) * 2020-08-06 2022-02-09 Infineon Technologies AG Halbleitersubstratanordnung und verfahren zur herstellung davon
CN114222423A (zh) * 2021-11-09 2022-03-22 联宝(合肥)电子科技有限公司 一种表面贴装器件及其加工方法
TW202326955A (zh) * 2021-12-16 2023-07-01 財團法人工業技術研究院 功率半導體裝置
CN114447656B (zh) * 2022-01-24 2024-05-28 苏州华太电子技术股份有限公司 一种接触元件
WO2024070884A1 (ja) * 2022-09-28 2024-04-04 ニデック株式会社 半導体モジュール

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01315167A (ja) 1988-03-01 1989-12-20 Oki Electric Ind Co Ltd 半導体装置
JPH0644499B2 (ja) * 1988-11-18 1994-06-08 日本電気株式会社 集積回路接続器
US5209681A (en) 1992-03-26 1993-05-11 Amp Incorporated Electrical contact with the anti-solder wicking tab
DE102008005547B4 (de) * 2008-01-23 2013-08-29 Infineon Technologies Ag Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul
JP5334457B2 (ja) * 2008-05-29 2013-11-06 三菱電機株式会社 半導体装置
JP5262793B2 (ja) * 2009-02-13 2013-08-14 三菱電機株式会社 電力用半導体装置とその製造方法
JP5268786B2 (ja) * 2009-06-04 2013-08-21 三菱電機株式会社 半導体モジュール
JP5069758B2 (ja) * 2010-01-04 2012-11-07 三菱電機株式会社 半導体装置
JP5793902B2 (ja) 2011-03-19 2015-10-14 富士通株式会社 電子部品用リード端子、電子部品、電子部品用リード端子の製造方法、および、電子部品用リード端子の製造装置

Also Published As

Publication number Publication date
US20150340333A1 (en) 2015-11-26
CN105027279B (zh) 2018-02-13
CN105027279A (zh) 2015-11-04
DE112014001516B4 (de) 2023-07-06
WO2014148319A1 (ja) 2014-09-25
JPWO2014148319A1 (ja) 2017-02-16
JP6041043B2 (ja) 2016-12-07
DE112014001516T5 (de) 2016-01-07
US9406633B2 (en) 2016-08-02

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R020 Patent grant now final