JP6866716B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6866716B2 JP6866716B2 JP2017056844A JP2017056844A JP6866716B2 JP 6866716 B2 JP6866716 B2 JP 6866716B2 JP 2017056844 A JP2017056844 A JP 2017056844A JP 2017056844 A JP2017056844 A JP 2017056844A JP 6866716 B2 JP6866716 B2 JP 6866716B2
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- 239000004065 semiconductor Substances 0.000 title claims description 98
- 239000000758 substrate Substances 0.000 claims description 59
- 238000005304 joining Methods 0.000 claims description 46
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 230000001154 acute effect Effects 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 description 143
- 239000000463 material Substances 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000003892 spreading Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910001096 P alloy Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229910000521 B alloy Inorganic materials 0.000 description 3
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000004631 polybutylene succinate Substances 0.000 description 2
- 229920002961 polybutylene succinate Polymers 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/4814—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate the wire connector connecting to a bonding area protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第1の実施の形態の半導体装置について、図1を用いて説明する。
次に、コンタクト部品17の別の形態について、図7を用いて説明する。
第3の実施の形態では、第2の実施の形態の半導体装置10において基板14の導電パターン13aに形成する凹状の接合領域を図9に示すように開口側を広げることも可能である。
第4の実施の形態では、第1の実施の形態の半導体装置10における導電パターン13aの接合領域13a1の中央部に凸部(突起部)を形成した場合について説明する。なお、以下の導電パターン13aに形成される接合領域33a1は、他の導電パターン13にも同様に形成される。
第5の実施の形態では、第4の実施の形態の半導体装置10における導電パターン13aの接合領域33a1の内壁部13a2を底面部33a3に対して鋭角に傾斜させた場合について説明する。なお、以下の導電パターン13aに形成される接合領域43a1は、他の導電パターン13にも同様に形成される。
11 絶縁板
12 金属板
13a,13b,13c,13d,13e,13f,13 導電パターン
13a1,13d1,13f1,15a 接合領域
13a2 内壁部
13a3 底面部
14 基板
15 半導体素子
16a,16b,16c,16d,16e,16f,16g,16 ボンディングワイヤ
17,27 コンタクト部品
17a 胴体部
17b 中空孔
17b1,17b2 開口端部
17c,17d フランジ
17c1,17c2,17c3,17d1,17d2 凸部
17c4,17d4 側端面
17c5,17d5 底面部
17c6,17d6 段差部
18 外部接続端子
19,19a はんだ
20 放熱板
21 ケース
30,30a,30b マスク
31,31a,31b 開口部
Claims (10)
- 凹状の接合領域が形成された導電パターンと前記導電パターンが形成された絶縁板とを備える基板と、
内部に筒状の中空孔が形成されたコンタクト部品と、
を有し、
前記接合領域の内径が、前記コンタクト部品の一方の開口端部の外径よりも広く、前記コンタクト部品の前記一方の開口端部が接合部材により前記接合領域に接合される、
半導体装置。 - 前記コンタクト部品は、前記中空孔が形成された胴体部と、前記胴体部の両側の開口端部のうち少なくとも前記一方の開口端部に設けられたフランジとを有し、前記一方の開口端部と共に前記フランジが前記接合部材により前記接合領域に接合される、
請求項1に記載の半導体装置。 - 前記接合領域は、前記基板の積層方向に垂直な底面部と、前記底面部に対して垂直であって、前記底面部の外周縁に沿って形成された内壁部とを有している、
請求項1または2に記載の半導体装置。 - 凹状の接合領域が形成された導電パターンと前記導電パターンが形成された絶縁板とを備える基板と、
内部に筒状の中空孔が形成されたコンタクト部品と、
を有し、
前記コンタクト部品の一方の開口端部が接合部材により前記接合領域に接合され、
前記接合領域は、前記基板の積層方向に垂直な底面部と、前記底面部に対して鈍角に傾き、前記底面部の外周縁に沿って形成された内壁部とを有している、
半導体装置。 - 前記接合領域は、前記基板の積層方向に垂直な底面部と、前記底面部に対して鋭角に傾き、前記底面部の外周縁に沿って形成された内壁部とを有している、
請求項1または2に記載の半導体装置。 - 凹状の接合領域が形成された導電パターンと前記導電パターンが形成された絶縁板とを備える基板と、
内部に筒状の中空孔が形成されたコンタクト部品と、
を有し、
前記コンタクト部品の一方の開口端部が接合部材により前記接合領域に接合され、
前記導電パターンは、前記接合領域内に前記コンタクト部品を接合した際に前記コンタクト部品の前記中空孔に入り込む突起部が形成されている、
半導体装置。 - 前記接合領域の前記内径が、前記コンタクト部品の前記一方の開口端部の前記外径の1.05倍以上、1.50倍以下である、
請求項1乃至3、5のいずれか1項に記載の半導体装置。 - 前記突起部の外径が、前記コンタクト部品の前記中空孔の内径の0.5倍以上、1.0倍未満である、
請求項6に記載の半導体装置。 - 前記接合領域の前記内径から、前記コンタクト部品の前記一方の開口端部の前記外径までに接合距離が確保されている、
請求項1に記載の半導体装置。 - 前記接合領域は、前記基板の積層方向に垂直な底面部と、前記底面部に対して前記底面部の外周縁に沿って形成された内壁部とを有し、
平面視で、前記接合部材は、前記コンタクト部品の前記一方の開口端部の表面と前記内壁部との間に設けられている、
請求項1に記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017056844A JP6866716B2 (ja) | 2017-03-23 | 2017-03-23 | 半導体装置 |
DE102018200830.2A DE102018200830A1 (de) | 2017-03-23 | 2018-01-19 | Halbleitervorrichtung |
US15/885,057 US10398036B2 (en) | 2017-03-23 | 2018-01-31 | Semiconductor device |
CN201810093644.8A CN108630618B (zh) | 2017-03-23 | 2018-01-31 | 半导体装置 |
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JP2017056844A JP6866716B2 (ja) | 2017-03-23 | 2017-03-23 | 半導体装置 |
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Publication Number | Publication Date |
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JP2018160554A JP2018160554A (ja) | 2018-10-11 |
JP6866716B2 true JP6866716B2 (ja) | 2021-04-28 |
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US (1) | US10398036B2 (ja) |
JP (1) | JP6866716B2 (ja) |
CN (1) | CN108630618B (ja) |
DE (1) | DE102018200830A1 (ja) |
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JP7322369B2 (ja) | 2018-09-21 | 2023-08-08 | 富士電機株式会社 | 半導体装置の製造方法 |
CN109300872A (zh) * | 2018-11-06 | 2019-02-01 | 杭州中好蔚莱电子有限公司 | 一种功率半导体接触元件 |
CN113035790B (zh) * | 2019-12-24 | 2024-04-02 | 株洲中车时代半导体有限公司 | 焊接底座及功率半导体模块 |
EP3951866A1 (en) * | 2020-08-06 | 2022-02-09 | Infineon Technologies AG | Semiconductor substrate arrangement and method for producing the same |
CN117425962A (zh) * | 2021-06-08 | 2024-01-19 | 罗姆股份有限公司 | 接合构造以及半导体装置 |
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DE102008005547B4 (de) | 2008-01-23 | 2013-08-29 | Infineon Technologies Ag | Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul |
JP4567773B2 (ja) * | 2008-07-18 | 2010-10-20 | 三菱電機株式会社 | 電力用半導体装置 |
JP4613237B2 (ja) * | 2008-12-10 | 2011-01-12 | 新光電気工業株式会社 | リードピン付配線基板及びリードピン |
JP5069758B2 (ja) * | 2010-01-04 | 2012-11-07 | 三菱電機株式会社 | 半導体装置 |
JP5445344B2 (ja) * | 2010-06-15 | 2014-03-19 | 三菱電機株式会社 | 電力用半導体装置 |
JP5579148B2 (ja) * | 2011-10-11 | 2014-08-27 | 三菱電機株式会社 | 電力用半導体装置 |
CN105027279B (zh) * | 2013-03-21 | 2018-02-13 | 富士电机株式会社 | 接触部件以及半导体模块 |
JP6217101B2 (ja) * | 2013-03-22 | 2017-10-25 | 富士電機株式会社 | 半導体装置の製造方法及び取り付け治具 |
JP2016006806A (ja) * | 2013-06-05 | 2016-01-14 | 富士電機株式会社 | 半導体装置 |
DE102014107241B4 (de) * | 2014-05-22 | 2017-05-04 | Infineon Technologies Ag | Verfahren zur herstellung einer eine kontakthülse aufweisenden elektronikbaugruppe |
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2017
- 2017-03-23 JP JP2017056844A patent/JP6866716B2/ja active Active
-
2018
- 2018-01-19 DE DE102018200830.2A patent/DE102018200830A1/de active Pending
- 2018-01-31 CN CN201810093644.8A patent/CN108630618B/zh active Active
- 2018-01-31 US US15/885,057 patent/US10398036B2/en active Active
Also Published As
Publication number | Publication date |
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JP2018160554A (ja) | 2018-10-11 |
CN108630618B (zh) | 2024-02-27 |
DE102018200830A1 (de) | 2018-09-27 |
US10398036B2 (en) | 2019-08-27 |
CN108630618A (zh) | 2018-10-09 |
US20180279484A1 (en) | 2018-09-27 |
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