HK1222476A1 - 半導體器件 - Google Patents
半導體器件Info
- Publication number
- HK1222476A1 HK1222476A1 HK16110482.6A HK16110482A HK1222476A1 HK 1222476 A1 HK1222476 A1 HK 1222476A1 HK 16110482 A HK16110482 A HK 16110482A HK 1222476 A1 HK1222476 A1 HK 1222476A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/147—Semiconductor insulating substrates
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/161—Disposition
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- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L2924/15192—Resurf arrangement of the internal vias
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015012482A JP6429647B2 (ja) | 2015-01-26 | 2015-01-26 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
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HK1222476A1 true HK1222476A1 (zh) | 2017-06-30 |
Family
ID=56434197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16110482.6A HK1222476A1 (zh) | 2015-01-26 | 2016-09-02 | 半導體器件 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9461016B2 (zh) |
JP (1) | JP6429647B2 (zh) |
KR (1) | KR20160091831A (zh) |
CN (1) | CN105826300B (zh) |
HK (1) | HK1222476A1 (zh) |
TW (1) | TW201639113A (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018037465A (ja) * | 2016-08-29 | 2018-03-08 | ウシオ電機株式会社 | 半導体パッケージおよびその製造方法 |
US10403599B2 (en) * | 2017-04-27 | 2019-09-03 | Invensas Corporation | Embedded organic interposers for high bandwidth |
CN109087905B (zh) | 2017-06-14 | 2020-09-29 | 创意电子股份有限公司 | 半导体封装装置及其半导体配线基板 |
TWI621237B (zh) * | 2017-06-14 | 2018-04-11 | 創意電子股份有限公司 | 半導體封裝裝置及其半導體配線基板 |
DE102018125018A1 (de) * | 2017-11-15 | 2019-05-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Zweidimensionale Durchkontaktierungssäulenstrukturen |
JP2019114675A (ja) * | 2017-12-25 | 2019-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2019129181A (ja) * | 2018-01-22 | 2019-08-01 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2019176008A (ja) * | 2018-03-28 | 2019-10-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US10580720B1 (en) * | 2018-10-22 | 2020-03-03 | Micron Technology, Inc. | Silicon interposer with fuse-selectable routing array |
KR102412292B1 (ko) * | 2019-03-07 | 2022-06-22 | 앱솔릭스 인코포레이티드 | 패키징 기판 및 이를 포함하는 반도체 장치 |
WO2020227033A1 (en) * | 2019-05-07 | 2020-11-12 | Rambus Inc. | Crosstalk cancelation structures in semiconductor packages |
US20210407966A1 (en) * | 2020-06-29 | 2021-12-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4373531B2 (ja) * | 1999-06-18 | 2009-11-25 | パナソニック株式会社 | 差動平衡信号伝送基板 |
TWI251313B (en) * | 2003-09-26 | 2006-03-11 | Seiko Epson Corp | Intermediate chip module, semiconductor device, circuit board, and electronic device |
JP4916300B2 (ja) | 2006-12-19 | 2012-04-11 | 新光電気工業株式会社 | 多層配線基板 |
JP4474431B2 (ja) * | 2007-03-26 | 2010-06-02 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 半導体パッケージおよび該製造方法 |
US7623365B2 (en) | 2007-08-29 | 2009-11-24 | Micron Technology, Inc. | Memory device interface methods, apparatus, and systems |
JP4405537B2 (ja) * | 2007-08-30 | 2010-01-27 | 富士通株式会社 | キャパシタ内蔵インタポーザ、それを備えた半導体装置及びキャパシタ内蔵インタポーザの製造方法 |
JP2011009514A (ja) * | 2009-06-26 | 2011-01-13 | Renesas Electronics Corp | 半導体装置の製造方法 |
KR101906408B1 (ko) | 2011-10-04 | 2018-10-11 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
JP2013138177A (ja) | 2011-11-28 | 2013-07-11 | Elpida Memory Inc | 半導体装置の製造方法 |
JP2014011169A (ja) | 2012-06-27 | 2014-01-20 | Ps4 Luxco S A R L | シリコンインターポーザ及びこれを備える半導体装置 |
JP5852929B2 (ja) | 2012-06-29 | 2016-02-03 | 株式会社日立製作所 | インターポーザ、プリント基板及び半導体装置 |
-
2015
- 2015-01-26 JP JP2015012482A patent/JP6429647B2/ja active Active
- 2015-11-23 TW TW104138771A patent/TW201639113A/zh unknown
- 2015-12-14 US US14/967,463 patent/US9461016B2/en active Active
-
2016
- 2016-01-07 CN CN201610008571.9A patent/CN105826300B/zh active Active
- 2016-01-21 KR KR1020160007562A patent/KR20160091831A/ko unknown
- 2016-09-02 HK HK16110482.6A patent/HK1222476A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US9461016B2 (en) | 2016-10-04 |
TW201639113A (zh) | 2016-11-01 |
JP2016139659A (ja) | 2016-08-04 |
CN105826300B (zh) | 2019-10-18 |
US20160218083A1 (en) | 2016-07-28 |
JP6429647B2 (ja) | 2018-11-28 |
KR20160091831A (ko) | 2016-08-03 |
CN105826300A (zh) | 2016-08-03 |
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