HK1223193A1 - 半導體器件 - Google Patents

半導體器件

Info

Publication number
HK1223193A1
HK1223193A1 HK16111166.7A HK16111166A HK1223193A1 HK 1223193 A1 HK1223193 A1 HK 1223193A1 HK 16111166 A HK16111166 A HK 16111166A HK 1223193 A1 HK1223193 A1 HK 1223193A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
HK16111166.7A
Other languages
English (en)
Inventor
錦澤篤志
團野忠敏
中村弘幸
相馬治
上村聖
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1223193A1 publication Critical patent/HK1223193A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
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    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
HK16111166.7A 2014-09-30 2016-09-22 半導體器件 HK1223193A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014202416A JP6420617B2 (ja) 2014-09-30 2014-09-30 半導体装置

Publications (1)

Publication Number Publication Date
HK1223193A1 true HK1223193A1 (zh) 2017-07-21

Family

ID=54199590

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16111166.7A HK1223193A1 (zh) 2014-09-30 2016-09-22 半導體器件

Country Status (7)

Country Link
US (1) US9530721B2 (zh)
EP (1) EP3002784B1 (zh)
JP (1) JP6420617B2 (zh)
KR (1) KR20160038784A (zh)
CN (2) CN105470245B (zh)
HK (1) HK1223193A1 (zh)
TW (1) TWI670805B (zh)

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JP2019153752A (ja) * 2018-03-06 2019-09-12 トヨタ自動車株式会社 半導体装置
US11694898B2 (en) * 2019-03-25 2023-07-04 Intel Corporation Hybrid fine line spacing architecture for bump pitch scaling
US11908947B2 (en) * 2019-08-08 2024-02-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2022034947A (ja) * 2020-08-19 2022-03-04 キオクシア株式会社 半導体装置およびその製造方法
US11289437B1 (en) * 2020-10-28 2022-03-29 Renesas Electronics Corporation Semiconductor device

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CN105470245B (zh) 2019-10-18
TWI670805B (zh) 2019-09-01
EP3002784A1 (en) 2016-04-06
TW201613041A (en) 2016-04-01
KR20160038784A (ko) 2016-04-07
JP6420617B2 (ja) 2018-11-07
US20160093557A1 (en) 2016-03-31
EP3002784B1 (en) 2018-08-15
US9530721B2 (en) 2016-12-27
JP2016072520A (ja) 2016-05-09
CN105470245A (zh) 2016-04-06
CN205039149U (zh) 2016-02-17

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