HK1224080A1 - 半導體器件 - Google Patents
半導體器件Info
- Publication number
- HK1224080A1 HK1224080A1 HK16111168.5A HK16111168A HK1224080A1 HK 1224080 A1 HK1224080 A1 HK 1224080A1 HK 16111168 A HK16111168 A HK 16111168A HK 1224080 A1 HK1224080 A1 HK 1224080A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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US10978869B2 (en) * | 2016-08-23 | 2021-04-13 | Alpha And Omega Semiconductor Incorporated | USB type-C load switch ESD protection |
US10283475B2 (en) * | 2016-12-14 | 2019-05-07 | GM Global Technology Operations LLC | Power module assembly with dual substrates and reduced inductance |
JP6743728B2 (ja) * | 2017-03-02 | 2020-08-19 | 三菱電機株式会社 | 半導体パワーモジュール及び電力変換装置 |
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US8018056B2 (en) * | 2005-12-21 | 2011-09-13 | International Rectifier Corporation | Package for high power density devices |
JP5056325B2 (ja) | 2007-10-04 | 2012-10-24 | 富士電機株式会社 | 半導体装置の製造方法および半田ペースト塗布用のメタルマスク |
JP5550225B2 (ja) * | 2008-09-29 | 2014-07-16 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置 |
JP5863234B2 (ja) * | 2010-12-01 | 2016-02-16 | デンカ株式会社 | セラミックス回路基板およびこれを用いたモジュール |
JP5796956B2 (ja) * | 2010-12-24 | 2015-10-21 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
WO2013046824A1 (ja) * | 2011-09-30 | 2013-04-04 | ローム株式会社 | 半導体装置 |
JP2013258387A (ja) * | 2012-05-15 | 2013-12-26 | Rohm Co Ltd | パワーモジュール半導体装置 |
US20140110833A1 (en) * | 2012-10-24 | 2014-04-24 | Samsung Electro-Mechanics Co., Ltd. | Power module package |
KR101443985B1 (ko) * | 2012-12-14 | 2014-11-03 | 삼성전기주식회사 | 전력 모듈 패키지 |
JP6183166B2 (ja) * | 2013-01-30 | 2017-08-23 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板及びその製造方法 |
JP2014207430A (ja) * | 2013-03-21 | 2014-10-30 | ローム株式会社 | 半導体装置 |
KR102143890B1 (ko) * | 2013-10-15 | 2020-08-12 | 온세미컨덕터코리아 주식회사 | 파워 모듈 패키지 및 이의 제조 방법 |
KR20150078911A (ko) * | 2013-12-31 | 2015-07-08 | 삼성전기주식회사 | 반도체 패키지 및 그 제조방법 |
US9397017B2 (en) * | 2014-11-06 | 2016-07-19 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
-
2014
- 2014-09-30 JP JP2014199822A patent/JP6333693B2/ja active Active
-
2015
- 2015-09-15 TW TW104130364A patent/TW201624659A/zh unknown
- 2015-09-23 KR KR1020150134463A patent/KR20160038770A/ko unknown
- 2015-09-24 US US14/863,894 patent/US9576885B2/en active Active
- 2015-09-29 CN CN201510632177.8A patent/CN105470226B/zh active Active
- 2015-09-29 CN CN201520762772.9U patent/CN205081110U/zh not_active Expired - Fee Related
- 2015-09-29 EP EP15187405.4A patent/EP3002785B1/en active Active
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2016
- 2016-09-22 HK HK16111168.5A patent/HK1224080A1/zh unknown
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2017
- 2017-01-31 US US15/420,410 patent/US9666518B1/en active Active
Also Published As
Publication number | Publication date |
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EP3002785B1 (en) | 2020-11-11 |
CN105470226B (zh) | 2020-05-19 |
JP6333693B2 (ja) | 2018-05-30 |
JP2016072417A (ja) | 2016-05-09 |
EP3002785A1 (en) | 2016-04-06 |
US20160093594A1 (en) | 2016-03-31 |
CN105470226A (zh) | 2016-04-06 |
TW201624659A (zh) | 2016-07-01 |
US20170141086A1 (en) | 2017-05-18 |
US9576885B2 (en) | 2017-02-21 |
CN205081110U (zh) | 2016-03-09 |
US9666518B1 (en) | 2017-05-30 |
KR20160038770A (ko) | 2016-04-07 |
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