JP4916300B2 - 多層配線基板 - Google Patents
多層配線基板 Download PDFInfo
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- JP4916300B2 JP4916300B2 JP2006341778A JP2006341778A JP4916300B2 JP 4916300 B2 JP4916300 B2 JP 4916300B2 JP 2006341778 A JP2006341778 A JP 2006341778A JP 2006341778 A JP2006341778 A JP 2006341778A JP 4916300 B2 JP4916300 B2 JP 4916300B2
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- Prior art keywords
- wiring
- electrode
- signal
- layer
- power supply
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
一般に、高周波用半導体素子を搭載する配線基板は多層構造とされており、各層に信号配線,グランド配線,電源配線等が形成されている(以下、多層の配線基板を多層配線基板という)。また、各層間における電気的な接続は、ビアを用いて行う構成とされている。
信号電極を有する信号配線、グランド電極を有するグランド配線、又は電源電極を有する電源配線の内、一又は複数種の配線が形成された配線層と、絶縁層が交互に積層された構造を有する多層配線基板において、前記配線層のなかで最上層となる第1配線層が、信号電極と電源電極とが交互に形成された第1の列と、前記第1の列に隣接して配設されグランド電極が形成された第2の列とを有し、さらに、前記第1配線層には、前記第1の列に形成された信号電極に接続する信号配線と、前記第1の列に形成された電源電極に接続する電源配線とがコプレナー構造となるように形成され、前記第1配線層の下層に第2配線層である、グランド配線のプレーン層が配設された構成としたことを特徴とする多層配線基板である。
図2(C)は第3配線層12Cを示しており、図2(D)は図2(A)におけるA2−A2線に沿う断面を示している。
3列外側電極を構成する信号電極15aが差動対信号配線25aと、信号電極15bが差動対信号配線25bと、更に電源電極16が電源配線26と接続されている。差動対信号配線25aと差動対信号配線25bは、第1配線層12Aと同様に差動対(ディファレンシャルペア)を構成している。また、電源配線26はプレーン層となっており、よって差動対を構成する一対の差動対信号配線25a,25bと電源配線26は実質的に直交方向(Y方向)に交互に形成された構成となっている。
11A 第1絶縁層
11B 第2絶縁層
11C 第3絶縁層
12A 第1配線層
12B 第2配線層
12C 第3配線層
12D 第4配線層
15,15a,15b 信号電極
16 電源電極
17 グランド電極
25 信号配線
25a,25b 差動対信号配線
26 電源配線
27 グランド配線
Claims (1)
- 信号電極を有する信号配線、グランド電極を有するグランド配線、又は電源電極を有する電源配線の内、一又は複数種の配線が形成された配線層と、絶縁層が交互に積層された構造を有する多層配線基板において、
前記配線層のなかで最上層となる第1配線層が、信号電極と電源電極とが交互に形成された第1の列と、前記第1の列に隣接して配設されグランド電極が形成された第2の列とを有し、
さらに、前記第1配線層には、前記第1の列に形成された信号電極に接続する信号配線と、前記第1の列に形成された電源電極に接続する電源配線とがコプレナー構造となるように形成され、
前記第1配線層の下層に第2配線層である、グランド配線のプレーン層が配設された構成としたことを特徴とする多層配線基板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006341778A JP4916300B2 (ja) | 2006-12-19 | 2006-12-19 | 多層配線基板 |
KR1020070129551A KR20080057153A (ko) | 2006-12-19 | 2007-12-13 | 다층 배선 기판 |
US12/000,730 US8076588B2 (en) | 2006-12-19 | 2007-12-17 | Multilayer wiring board |
TW096148386A TWI423753B (zh) | 2006-12-19 | 2007-12-18 | 多層佈線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006341778A JP4916300B2 (ja) | 2006-12-19 | 2006-12-19 | 多層配線基板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008153542A JP2008153542A (ja) | 2008-07-03 |
JP2008153542A5 JP2008153542A5 (ja) | 2009-11-19 |
JP4916300B2 true JP4916300B2 (ja) | 2012-04-11 |
Family
ID=39640156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006341778A Active JP4916300B2 (ja) | 2006-12-19 | 2006-12-19 | 多層配線基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8076588B2 (ja) |
JP (1) | JP4916300B2 (ja) |
KR (1) | KR20080057153A (ja) |
TW (1) | TWI423753B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4586820B2 (ja) | 2007-05-07 | 2010-11-24 | ソニー株式会社 | 巻回型非水電解質二次電池 |
US8350375B2 (en) * | 2008-05-15 | 2013-01-08 | Lsi Logic Corporation | Flipchip bump patterns for efficient I-mesh power distribution schemes |
JP5311653B2 (ja) * | 2009-04-28 | 2013-10-09 | 京セラSlcテクノロジー株式会社 | 配線基板 |
CN103975427B (zh) | 2011-10-07 | 2017-03-01 | 沃尔泰拉半导体公司 | 互连衬底的功率管理应用 |
US20140034363A1 (en) * | 2012-08-01 | 2014-02-06 | Samtec, Inc. | Multi-layer transmission lines |
US9545003B2 (en) * | 2012-12-28 | 2017-01-10 | Fci Americas Technology Llc | Connector footprints in printed circuit board (PCB) |
JP6429647B2 (ja) | 2015-01-26 | 2018-11-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6853774B2 (ja) * | 2017-12-21 | 2021-03-31 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP7145068B2 (ja) * | 2018-12-28 | 2022-09-30 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
US11234325B2 (en) * | 2019-06-20 | 2022-01-25 | Infinera Corporation | Printed circuit board having a differential pair routing topology with negative plane routing and impedance correction structures |
US11950357B2 (en) * | 2019-11-27 | 2024-04-02 | Qing Ding Precision Electronics (Huaian) Co., Ltd | Circuit board for transmitting high-frequency signal and method for manufacturing the same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH023631Y2 (ja) * | 1984-12-28 | 1990-01-29 | ||
JPS63136694A (ja) * | 1986-11-28 | 1988-06-08 | 日本電気株式会社 | 多層配線基板 |
JP3617073B2 (ja) | 1994-03-25 | 2005-02-02 | イビデン株式会社 | 電子部品搭載用基板及びその製造方法 |
JPH1041637A (ja) * | 1996-07-23 | 1998-02-13 | Nec Corp | 高密度多層配線基板 |
JP3201345B2 (ja) * | 1998-05-13 | 2001-08-20 | 日本電気株式会社 | 多層プリント配線板 |
JP3669219B2 (ja) * | 1999-08-10 | 2005-07-06 | 日本電気株式会社 | 多層プリント配線板 |
JP3539331B2 (ja) * | 2000-02-28 | 2004-07-07 | 日本電気株式会社 | 多層プリント配線板 |
JP3792472B2 (ja) | 2000-03-28 | 2006-07-05 | 京セラ株式会社 | 多層配線基板 |
JP2002093940A (ja) | 2000-09-14 | 2002-03-29 | Kyocera Corp | 多層配線基板 |
JP3745276B2 (ja) * | 2001-01-17 | 2006-02-15 | キヤノン株式会社 | 多層プリント配線板 |
US6900992B2 (en) * | 2001-09-18 | 2005-05-31 | Intel Corporation | Printed circuit board routing and power delivery for high frequency integrated circuits |
JP2004140295A (ja) | 2002-10-21 | 2004-05-13 | Shinko Electric Ind Co Ltd | 高周波素子用基板及び電子装置 |
JP4371766B2 (ja) * | 2003-10-20 | 2009-11-25 | Necインフロンティア株式会社 | プリント配線板 |
US7478472B2 (en) * | 2004-03-03 | 2009-01-20 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrate with signal wire shielding |
-
2006
- 2006-12-19 JP JP2006341778A patent/JP4916300B2/ja active Active
-
2007
- 2007-12-13 KR KR1020070129551A patent/KR20080057153A/ko not_active Application Discontinuation
- 2007-12-17 US US12/000,730 patent/US8076588B2/en active Active
- 2007-12-18 TW TW096148386A patent/TWI423753B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2008153542A (ja) | 2008-07-03 |
US8076588B2 (en) | 2011-12-13 |
TW200833213A (en) | 2008-08-01 |
KR20080057153A (ko) | 2008-06-24 |
TWI423753B (zh) | 2014-01-11 |
US20080173469A1 (en) | 2008-07-24 |
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