BR112013023980A2 - aparelho eletrônico com substrato em uma carcaça de inserção - Google Patents

aparelho eletrônico com substrato em uma carcaça de inserção

Info

Publication number
BR112013023980A2
BR112013023980A2 BR112013023980A BR112013023980A BR112013023980A2 BR 112013023980 A2 BR112013023980 A2 BR 112013023980A2 BR 112013023980 A BR112013023980 A BR 112013023980A BR 112013023980 A BR112013023980 A BR 112013023980A BR 112013023980 A2 BR112013023980 A2 BR 112013023980A2
Authority
BR
Brazil
Prior art keywords
substrate
housing
module
insert housing
arrangement
Prior art date
Application number
BR112013023980A
Other languages
English (en)
Inventor
Andreas Otto
Rainer Holz
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of BR112013023980A2 publication Critical patent/BR112013023980A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

aparelho eletrônico com substrato em uma carcaça de inserção a presente invenção refere-se a um arranjo do circuito eletrônico (102) com um substrato (106) e um módulo (108) para a recepção em uma carcaça de inserção (104). um arranjo do circuito eletrônico (102) de acordo com a invenção compreende, ao lado do substrato (106) e do módulo eletrônico (108) mantido pelo substrato (106), pelo menos, um elemento de mola (116, 118), sendo que o arranjo do circuito (102) está previsto para a inserção em uma carcaça (104), após a inserção, o módulo (108) contata uma área da carcaça (110, 136) para o resfriamento térmico, e o contato é realizado através de, pelo menos, um elemento de mola (116, 118); e compreende pelo menos, um espaçador (126, 128) no módulo ou na carcaça (108) para o impedimento de dados durante a inserção do arranjo do circuito (102) na carcaça (104).
BR112013023980A 2011-03-22 2012-03-09 aparelho eletrônico com substrato em uma carcaça de inserção BR112013023980A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201110005890 DE102011005890A1 (de) 2011-03-22 2011-03-22 Elektronikgerät mit Schaltungsträger in einem Einschubgehäuse
PCT/EP2012/054147 WO2012126748A1 (de) 2011-03-22 2012-03-09 Elektronikgerät mit schaltungsträger in einem einschubgehäuse

Publications (1)

Publication Number Publication Date
BR112013023980A2 true BR112013023980A2 (pt) 2016-12-13

Family

ID=45926531

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013023980A BR112013023980A2 (pt) 2011-03-22 2012-03-09 aparelho eletrônico com substrato em uma carcaça de inserção

Country Status (5)

Country Link
EP (1) EP2689646A1 (pt)
CN (1) CN107852837A (pt)
BR (1) BR112013023980A2 (pt)
DE (1) DE102011005890A1 (pt)
WO (1) WO2012126748A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104661487B (zh) * 2013-11-20 2017-06-20 华为技术有限公司 光模块散热结构及电子产品
DE102015219851B4 (de) * 2015-10-13 2018-05-17 Zf Friedrichshafen Ag Steuergerät
US10980151B2 (en) * 2018-07-31 2021-04-13 Hewlett Packard Enterprise Development Lp Flexible heat transfer mechanism configurations
EP3964040B1 (en) * 2019-06-13 2024-05-15 Huawei Technologies Co., Ltd. A cooling device for securing a first module and a second module in a space
CN211641771U (zh) * 2019-12-12 2020-10-09 法雷奥汽车空调湖北有限公司 一种控制盒和风机组件
DE102021002237A1 (de) 2020-05-15 2021-11-18 Sew-Eurodrive Gmbh & Co Kg Antrieb mit Anschlusskasten
WO2023046278A1 (en) * 2021-09-22 2023-03-30 Volkswagen Aktiengesellschaft A spacer, an electronic module, a vehicle and a manufacturing method
DE102022208951A1 (de) * 2022-08-29 2024-02-29 Inventronics Gmbh Gehäuse für eine elektronische Vorrichtung sowie Verfahren zum Herstellen desselben

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3502584A1 (de) * 1985-01-26 1986-07-31 Hans-Dieter 7121 Gemmrigheim Layh Elektronisches geraet
DE9112371U1 (pt) * 1991-10-04 1993-02-11 E.G.O. Elektro-Geraete Blanc U. Fischer, 7519 Oberderdingen, De
DE29511775U1 (de) * 1994-07-26 1995-09-21 Papst Motoren Gmbh & Co Kg Anordnung mit einer Leiterplatte
US5801330A (en) 1995-02-09 1998-09-01 Robert Bosch Gmbh Housing for an electrical device having spring means
DE19701854C1 (de) * 1997-01-21 1998-05-14 Telefunken Microelectron Gehäuse für den Einbau in Kraftfahrzeugen
DE19722602C2 (de) * 1997-05-30 2001-03-29 Lenze Gmbh & Co Kg Aerzen Wärmeableitendes Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauteilen
DE19924344C2 (de) * 1999-05-27 2002-10-31 Siemens Ag Gehäuse für ein elektrisches oder elektronisches Gerät zum Einbau in ein Kraftfahrzeug
DE10064194B4 (de) * 2000-12-22 2006-12-07 Infineon Technologies Ag Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls
US6580613B2 (en) 2001-07-17 2003-06-17 Infineon Technologies Ag Solder-free PCB assembly
DE10154878B4 (de) * 2001-11-06 2006-01-26 e-motion Gesellschaft für Antriebstechnik mbH Halteelement zur Fixierung eines elektronischen Leistungsbauteils an einem Kühlkörper
ITTO20030777A1 (it) * 2003-10-03 2005-04-04 Fiat Ricerche Unita' di controllo particolarmente per autoveicoli
DE102004021122B4 (de) * 2004-04-29 2007-10-11 Semikron Elektronik Gmbh & Co. Kg Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul
JP4379288B2 (ja) * 2004-06-02 2009-12-09 株式会社デンソー 電子装置の筐体構造
DE102004037656B4 (de) * 2004-08-03 2009-06-18 Infineon Technologies Ag Elektronikmodul mit optimierter Montagefähigkeit und Bauteilanordnung mit einem Elektronikmodul
DE102005043880B4 (de) * 2005-09-14 2014-10-02 Continental Automotive Gmbh Befestigungssystem für Leiterplatten
EP2071911B1 (en) * 2007-12-11 2011-12-21 Denso Corporation Electric control device and manufacturing method thereof
CN201234409Y (zh) * 2008-05-27 2009-05-06 天津市松正电动科技有限公司 电动车控制器
DE102008051547A1 (de) * 2008-10-14 2010-04-15 Continental Automotive Gmbh Elektronisches Gerät mit Bechergehäuse und Verfahren zur Herstellung desselben

Also Published As

Publication number Publication date
EP2689646A1 (de) 2014-01-29
CN107852837A (zh) 2018-03-27
WO2012126748A1 (de) 2012-09-27
DE102011005890A1 (de) 2012-09-27

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according art. 34 industrial property law
B06U Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements