DE29511775U1 - Anordnung mit einer Leiterplatte - Google Patents

Anordnung mit einer Leiterplatte

Info

Publication number
DE29511775U1
DE29511775U1 DE29511775U DE29511775U DE29511775U1 DE 29511775 U1 DE29511775 U1 DE 29511775U1 DE 29511775 U DE29511775 U DE 29511775U DE 29511775 U DE29511775 U DE 29511775U DE 29511775 U1 DE29511775 U1 DE 29511775U1
Authority
DE
Germany
Prior art keywords
arrangement
circuit board
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29511775U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebm Papst St Georgen GmbH and Co KG
Original Assignee
Papst Motoren GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Papst Motoren GmbH and Co KG filed Critical Papst Motoren GmbH and Co KG
Priority to DE29511775U priority Critical patent/DE29511775U1/de
Publication of DE29511775U1 publication Critical patent/DE29511775U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10606—Permanent holder for component or auxiliary PCB mounted on a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
DE29511775U 1994-07-26 1995-07-21 Anordnung mit einer Leiterplatte Expired - Lifetime DE29511775U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29511775U DE29511775U1 (de) 1994-07-26 1995-07-21 Anordnung mit einer Leiterplatte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE9412041 1994-07-26
DE29511775U DE29511775U1 (de) 1994-07-26 1995-07-21 Anordnung mit einer Leiterplatte

Publications (1)

Publication Number Publication Date
DE29511775U1 true DE29511775U1 (de) 1995-09-21

Family

ID=6911606

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29511775U Expired - Lifetime DE29511775U1 (de) 1994-07-26 1995-07-21 Anordnung mit einer Leiterplatte

Country Status (1)

Country Link
DE (1) DE29511775U1 (de)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19832450A1 (de) * 1998-07-18 2000-01-20 Frankl & Kirchner Halbleiter-Kühl-Anordnung
DE19829920C2 (de) * 1997-10-11 2000-11-02 Telefunken Microelectron Gehäuse zur Aufnahme elektronischer Bauelemente
DE10154878A1 (de) * 2001-11-06 2003-05-22 Motion Ges Fuer Antriebstechni Halteelement zur Fixierung eines elektronischen Leistungsbauteils an einem Kühlkörper und Schaltungsanordnung
DE102007052593B4 (de) * 2007-01-09 2011-02-03 Sew-Eurodrive Gmbh & Co. Kg Kühlanordnung und elektrisches Gerät mit einer solchen
DE102009047703A1 (de) * 2009-12-09 2011-06-16 Robert Bosch Gmbh Befestigungsanordnung für leiterplattenmontierte Bauteile mit verbessertem Kühlkonzept
DE102011005890A1 (de) * 2011-03-22 2012-09-27 Robert Bosch Gmbh Elektronikgerät mit Schaltungsträger in einem Einschubgehäuse
DE102022005120A1 (de) 2022-09-15 2024-03-21 Eberspächer Catem Gmbh & Co. Kg Steuervorrichtung
DE102022123568A1 (de) 2022-09-15 2024-03-21 Eberspächer Catem Gmbh & Co. Kg Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19829920C2 (de) * 1997-10-11 2000-11-02 Telefunken Microelectron Gehäuse zur Aufnahme elektronischer Bauelemente
DE19832450A1 (de) * 1998-07-18 2000-01-20 Frankl & Kirchner Halbleiter-Kühl-Anordnung
DE10154878A1 (de) * 2001-11-06 2003-05-22 Motion Ges Fuer Antriebstechni Halteelement zur Fixierung eines elektronischen Leistungsbauteils an einem Kühlkörper und Schaltungsanordnung
DE10154878B4 (de) * 2001-11-06 2006-01-26 e-motion Gesellschaft für Antriebstechnik mbH Halteelement zur Fixierung eines elektronischen Leistungsbauteils an einem Kühlkörper
DE102007052593B4 (de) * 2007-01-09 2011-02-03 Sew-Eurodrive Gmbh & Co. Kg Kühlanordnung und elektrisches Gerät mit einer solchen
DE102009047703A1 (de) * 2009-12-09 2011-06-16 Robert Bosch Gmbh Befestigungsanordnung für leiterplattenmontierte Bauteile mit verbessertem Kühlkonzept
DE102011005890A1 (de) * 2011-03-22 2012-09-27 Robert Bosch Gmbh Elektronikgerät mit Schaltungsträger in einem Einschubgehäuse
DE102022005120A1 (de) 2022-09-15 2024-03-21 Eberspächer Catem Gmbh & Co. Kg Steuervorrichtung
DE102022123568A1 (de) 2022-09-15 2024-03-21 Eberspächer Catem Gmbh & Co. Kg Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19951102

R150 Term of protection extended to 6 years

Effective date: 19980723

R151 Term of protection extended to 8 years

Effective date: 20010730

R152 Term of protection extended to 10 years

Effective date: 20030721

R071 Expiry of right