AR097348A1 - Sistemas de enfriamiento de dispositivos electrónicos - Google Patents

Sistemas de enfriamiento de dispositivos electrónicos

Info

Publication number
AR097348A1
AR097348A1 ARP140103067A ARP140103067A AR097348A1 AR 097348 A1 AR097348 A1 AR 097348A1 AR P140103067 A ARP140103067 A AR P140103067A AR P140103067 A ARP140103067 A AR P140103067A AR 097348 A1 AR097348 A1 AR 097348A1
Authority
AR
Argentina
Prior art keywords
cover
electronic devices
cooling systems
internal surfaces
electrical component
Prior art date
Application number
ARP140103067A
Other languages
English (en)
Inventor
Derovanessian Henry
M Mathews Robin
Original Assignee
Directv Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Directv Group Inc filed Critical Directv Group Inc
Publication of AR097348A1 publication Critical patent/AR097348A1/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un dispositivo electrónico incluye: una cubierta que tiene una o más superficies internas; un circuito electrónico que está dispuesto dentro de la cubierta y que no tiene contacto directo con cualesquiera de una o más de las superficies internas de dicha cubierta; y que incluye por lo menos un componente eléctrico que consume energía eléctrica; y un material térmicamente conductor que rodea al circuito electrónico dentro de la cubierta; que hace contacto directo tanto con por lo menos un componente eléctrico y una o más de las superficies internas de la cubierta; que absorbe calor desde por lo menos un componente eléctrico; y que transfiere calor a la cubierta.
ARP140103067A 2013-08-14 2014-08-14 Sistemas de enfriamiento de dispositivos electrónicos AR097348A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/967,011 US9247676B2 (en) 2013-08-14 2013-08-14 Electronic device cooling systems

Publications (1)

Publication Number Publication Date
AR097348A1 true AR097348A1 (es) 2016-03-09

Family

ID=51399776

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP140103067A AR097348A1 (es) 2013-08-14 2014-08-14 Sistemas de enfriamiento de dispositivos electrónicos

Country Status (3)

Country Link
US (1) US9247676B2 (es)
AR (1) AR097348A1 (es)
WO (1) WO2015023628A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3035266B1 (fr) * 2015-04-17 2017-03-31 Sagemcom Broadband Sas Equipement electronique
KR102290036B1 (ko) * 2019-05-15 2021-08-18 주식회사 케이엠더블유 안테나 장치
US11558981B2 (en) * 2020-03-27 2023-01-17 Mercury Mission Systems, Llc Thermal nanoparticles encapsulation for heat transfer
EP3923687B1 (en) * 2020-06-09 2024-04-03 Samsung Electronics Co., Ltd. Memory device and electronic device including the same
CN112261836B (zh) * 2020-10-15 2023-03-28 甘肃尔美科技有限公司 一种消防物联网数据采集模块装置
USD986901S1 (en) * 2021-08-30 2023-05-23 Samsung Electronics Co., Ltd. Solid state drive memory device
CN113873852A (zh) * 2021-10-14 2021-12-31 北京锐安科技有限公司 散热设备和散热结构参数确定方法、装置、设备、介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3699394A (en) * 1971-11-01 1972-10-17 Powercube Corp Modular circuit package with enhanced heat dissipation
US4471407A (en) * 1982-09-27 1984-09-11 Kohler Company Combination heat sink for a semiconductor
US5880933A (en) 1997-08-18 1999-03-09 Daimlerchrysler Corporation Heat sinking module cover
US5932839A (en) * 1997-11-04 1999-08-03 Ren; Jane Method for dissipating heat away from a heat sensitive device using bicarbonate compositions
CN1146988C (zh) * 1997-12-08 2004-04-21 东芝株式会社 半导体功率器件的封装及其组装方法
US6549409B1 (en) * 2000-08-21 2003-04-15 Vlt Corporation Power converter assembly
US6821816B1 (en) * 2003-06-13 2004-11-23 Delphi Technologies, Inc. Relaxed tolerance flip chip assembly
US7595468B2 (en) * 2005-11-07 2009-09-29 Intel Corporation Passive thermal solution for hand-held devices
US20100202111A1 (en) 2007-10-29 2010-08-12 Chien-Kuo Liang Hermetic modular power supply
US8130496B2 (en) * 2009-04-01 2012-03-06 Intel Corporation Device and method for mitigating radio frequency interference
US8966747B2 (en) * 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
CN102892277B (zh) * 2011-07-20 2016-08-03 光宝电子(广州)有限公司 电路板装置及其制造方法及具有该电路板装置的电源供应器
US20140254800A1 (en) * 2011-09-08 2014-09-11 AvaLAN Wireless Systems, Inc. High-Security Outdoor Wireless Communications Bridge

Also Published As

Publication number Publication date
WO2015023628A1 (en) 2015-02-19
US9247676B2 (en) 2016-01-26
US20150049438A1 (en) 2015-02-19

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