Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
  • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
  • H05K7/2049—Pressing means used to urge contact, e.g. springs
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
  • H01L23/4093—Snap-on arrangements, e.g. clips
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/14—Structural association of two or more printed circuits
  • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
  • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
  • H01L2924/191—Disposition
  • H01L2924/19101—Disposition of discrete passive components
  • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0302—Properties and characteristics in general
  • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10234—Metallic balls
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Definitions

• the invention relates to an electronic circuit arrangement with circuit carrier and module for receiving in a plug-in housing.
• Automotive sector is the arrangement in a housing according to the tub-lid principle, the use of an extruded profile as a housing, or the direct encapsulation of the electronic circuit arrangement known.
• Heatsink can serve to hold the chip in the mounted position, so that the resilient terminals press the chip against the heat sink.
• Power component is pressed by spring means to a heat-dissipating housing part.
• a cooling of the device through the housing can be done.
• Entigennden modules / components and housing can be avoided.
• an electronic circuit arrangement with a circuit carrier, an electronic module held by the circuit carrier and at least one spring element are proposed.
• the circuit arrangement is provided for insertion into a housing. For cooling, the module contacts after insertion
• the circuit carrier for example, as a printed circuit board or PCB ("Printed Circuit Board") and / or other, even three-dimensional structure for holding circuits,
• the module may also include a printed circuit board or similar support structure, and / or may include one or more electronic components, including electronic circuits (ICs), circuit elements such as capacitors or resistors, control elements such as Transistors, etc. include.
• ICs electronic circuits
• Such a device may either itself be a device to be heat-treated and / or may carry a device to be heat-treated.
• the fastening means preferably comprises at least one spacer and / or at least one locking element.
• the fastening means can be provided at any points on the circuit arrangement.
• the attachment means is configured so that the circuitry can be mounted in a housing.
• the fastening means on the circuit arrangement can be complementary to the
• Fixing means to be designed on a housing into which the circuit arrangement is to be inserted. Furthermore, a complementarily designed
• Circuit arrangement in a housing fixed means that for the fastening means to the circuit arrangement, a matching counterpart is provided on a housing, in which the circuit arrangement
• Circuitry a locking element provided on a housing to secure the circuit arrangement when inserted into a housing in a desired position.
• the at least one spacer can be galvanically built up on the module
• Element include, such as a ball, hemisphere or other, raised element. Additionally or alternatively, the module may be equipped with a pre-formed element as a spacer. This component may be, for example, a ball, a rivet, a press-in pin, and / or a stamped grid.
• the at least one spacer may include floating points, sliding lines or sliding surfaces, and may include, for example, three or more sliding points.
• the at least one locking element can serve for locking the circuit arrangement to be inserted in an end position in a housing.
• Locking element may for example comprise one or more latching points.
• a latching point on the circuit arrangement may be provided for the engagement of a spacer on a housing.
• the spring element can serve in the inserted state for defining the distance between circuit carrier and module.
• the module can also be held directly or rigidly by the circuit carrier.
• the at least one spring element can be the electrical contact of the
• Circuit carrier serve. Additionally or alternatively, this or another
• At least one spring element can be provided for the electrical contacting of circuit carrier and module with one another. In a particular variant of this
• At least one spring element is formed from an outgoing from the circuit board electrical conductor.
• the electrical conductor can be, for example, a copper track led out of the circuit carrier (such as a printed circuit board), which is used for electrical purposes
• This electrical conductor can be electrically connected, for example, by means of plated-through holes with conductor tracks or further electrical conductors of the circuit carrier.
• the led out of the circuit board contacting can be formed, for example, in a separate processing step to a spring element, in particular be formed.
• This leaf springs all types of compression springs, torsion springs, bending springs or similar spring elements can be formed.
• An electronic circuit arrangement with at least one spring element led out of the circuit carrier can also be independent of those described here
• the invention further proposes a housing for receiving one of the electronic circuit arrangements outlined here.
• the housing includes a
• the fastening means for locking the circuit to be inserted in an end position in the housing.
• the fastening means preferably comprises at least one spacer and / or at least one locking element.
• the attachment means may be provided at any location on the housing.
• the fastening means is designed so that the housing receives a circuit arrangement. The fastener on the
• Housing may be designed to be complementary to the fastening means on a circuit arrangement which is to be received in the housing.
• Circuitry the position of a circuit arrangement in the housing firmly.
• a matching counterpart to a circuit arrangement which is to be received in the housing for the fastening means the housing is provided a matching counterpart to a circuit arrangement which is to be received in the housing.
• a locking element is provided on a circuit arrangement for a spacer on the housing in order to fasten a circuit arrangement when inserted into the housing in a desired position.
• the at least one spacer may comprise an element galvanically mounted on the housing, such as a ball, hemisphere or other raised element. Additionally or alternatively, the housing may be equipped with a pre-formed element as a spacer. This component may be, for example, a ball, a rivet, a press-in pin, and / or a stamped grid.
• the at least one spacer may include floating points, sliding lines or sliding surfaces, and may include, for example, three or more sliding points.
• the at least one locking element can be used to lock a
• the locking element may for example comprise one or more latching points.
• a locking point on the housing may be provided for the engagement of a spacer on a circuit arrangement.
• the housing may comprise approximately an extruded profile. Alternatively, it is also possible to use profiles which are produced by means of other shaping methods, such as e.g. Deep drawing are made. Additionally or alternatively, the housing may be constructed according to the tub-lid principle.
• an electronic device which comprises one of the electronic circuit arrangements sketched here and a housing into which the Circuit arrangement is inserted, wherein a fastening means on the circuit arrangement is designed to be complementary to a fastening means on the housing.
• the housing and the circuit arrangement may be formed as outlined above, wherein the circuit arrangement is locked in the housing.
• a direct contact between module to be EntRSAndem and housing can also be established if an extruded profile or other housing is used, in which the circuit arrangement is inserted.
• the electronics i.e., the module or modules to be heat-treated
• the lossy power electronics can be applied directly to cooling surfaces of the housing, so as to realize optimal heat dissipation.
• An approximately existing gap between the Entracermungs vom of the module and the housing can by at least a partial use of a corresponding
• the invention thus extends the capabilities of a housing concept based on extruded profiles or on profiles made by similar processes (e.g., deep drawing).
• the advantages resulting from this concept in particular also cost advantages, can be used for electronic devices, but compared to the conventional concept, the cooling can be optimized because a direct cooling of modules / components is possible through the housing.
• the invention enables the development of optimized cooling concepts based on, for example, slug-up cooling, modular partitioning and suitable intermodule connection techniques.
• Optimized cooling concepts based on the invention make it possible, for example, to use cost-effective extruded profiles or other plug-in housings not only for logic modules but also for power modules.
• the thermal / mechanical contact between the component to be heated and the housing can over the desired life of the device by the
• Spring element can be held with a correspondingly adapted spring constant.
• Spring element allows safe contact, for example, with expansions or other movements of the housing, the module, or the circuit substrate, as may occur for example in temperature changes or shocks, e.g. at a
• Control unit in the vehicle area In the vehicle area.
• Module / component provided, a two-sided assembly of the module is possible.
• the circuit carrier for example a base circuit board
• the circuit carrier can be equipped on two sides. In all these cases, additional space can be gained for equipping.
• Optimized cooling concepts based on the invention also enable a further miniaturization of the (power) electronics installed in the electronic device.
• the spacers protect the electronics as well as the heat dissipation surfaces of the module and the housing from assembly damage.
• the spacers for example, sliding points and / or lines can additionally be formed as a guide element for guiding the electronic circuit arrangement when inserted into the housing.
• FIG. 1 shows a section through an exemplary embodiment of an electronic device according to the invention
• FIGS. 2A, 2B are schematic sectional views through a circuit carrier of a
• FIG. 3 shows a section through a further embodiment of a
• FIG. 1 shows in the form of a schematic sectional view of an embodiment 100 of an electronic device according to the invention with an electronic circuit arrangement 102 which is accommodated in a plug-in housing 104, but is not yet in a locked end position.
• the circuit arrangement 102 includes a circuit board as a circuit board 106 and a module 108. Of the designed as an extruded housing 104 a top 1 10 and a bottom 1 12 are indicated.
• the printed circuit board 106 carries on its side facing the module 108 elements of which a component 1 14 and spring elements 1 16, 1 18 are shown.
• the spring elements 1 16, 1 18 serve for the spaced positioning of the module 108 and for electrical contacting of printed circuit board 106 and module 108.
• the module 108 is at its the
• Printed circuit board 106 side facing electronic components 120, 122 equipped. On its side facing the housing 104, 110, the module 108 is provided with a thermal contacting element 124 as well as with spacers, of which sliding points 126, 128 are shown.
• the components 120, 122 are insulated via a printed circuit board 130 of the module 108 and the contacting element 124 to the top 1 10 of the housing 104.
• the housing top 1 10 is provided with cooling fins 132.
• the Module 108 In the (not shown here) fully inserted and locked state of the electronic circuitry 102 in the housing 104 is the Module 108 with its contacting element 124 by means of the force exerted by the spring elements 1 16, 1 18 spring force to the top 1 10 of the housing pressed.
• a thermal compound which is possibly required for optimum thermal contacting or a comparable thermally conductive medium is not shown in FIG. 1 for reasons of clarity.
• the circuit arrangement 102 is inserted into the housing 104 in the direction indicated by the arrow 134.
• the circuit board 106 slides over the bottom 1 12 of the housing 104, while the sliding points 126 and 128 along the inner surface 136 of the top 10 of the housing 104 slide.
• the sliding points 126, 128 are raised above the thermal contact 124 and optionally further components present on the upper side of the base circuit board 130 of the module 108, so that only the sliding points 126, 128 engage mechanically when the arrangement 102 is inserted with the inner surface 136 of the housing top 1 10 stand. In this way, upon insertion, damage to the structures on the circuit board 130, e.g.
• the thermal contacting element 124 (more generally the Entracermungs Colour of the module 108), but also the inner surface 136 of the top 1 10 of the housing 104 avoided. Also, an optionally on the top of the element 124 or the inner surface 136 of the housing top 1 10 previously applied heat transfer medium is not abraded or impaired in any other way.
• the sliding points 126, 128 are formed in the example of Figure 1 as balls that are either populated as a prefabricated components on top of the base circuit board 130 of the module 108, or are built up galvanically on the circuit board 130.
• Other embodiments of the sliding points 126, 128 are also conceivable, for example in the form of
• Hemispheres or pyramids In addition to floating points, others can be more general
• Variants of spacers are used, such as sliding surfaces such as
• the balls 126, 128 shown in FIG. 1 can be produced, for example, in a standard SMD ("Surface Mounted Device") process, for example via a balling method. For this purpose, neither special machines nor screwing or riveting processes are required. Thus, in principle, the complete module 108 can be manufactured in a standard SMT ("Surface Mounted Technology") process.
• SMT Surface Mounted Technology
• latching points or recesses 138, 140 are prepared as detents. When inserting the arrangement 102, the ball 126 reaches the position of the latching point 138 and the ball 128, the position of the latching point 140.
• the module 108 engages with the balls 126, 128 in one the latching points 138, 140 predetermined position in the interior of the housing 104 a.
• the circuit arrangement 102 remains fixed in the housing 104, as long as the spring elements 1 16, 1 18 exert a sufficient spring force, which must be designed accordingly for a certain life of the device 100.
• sliding points 126, 128 While only two sliding points 126, 128 are indicated in FIG. 1, it is advantageous in the exclusive use of sliding points as spacers to provide in particular at least three sliding points on the side of the module facing the housing, in order to be able to insert the module optimally, without components as the thermal contacting or Entracermungselement 124, a thermal paste, or the inner surface 136 of the top 1 10 to damage.
• the at least three sliding points should preferably not be located on a line parallel to the insertion direction 134.
• a corresponding number Einrastconsists can be provided on the inner surface 136 of the housing.
• Inner surface 136 of the housing 104 only a minimum distance 142, which may be filled by a heat transfer medium.
• the heat-conducting medium does not have to cover the entire contact surface of the contacting element 124; it is sufficient that the medium is partially present at least where a thermal contact must be optimized for a heat dissipation of a device.
• the components 120, 122 so for example.
• the element 122 an efficient Entskyrmungspfad, so must a
• Heat transfer medium for bridging the remaining gap 142 in particular be applied over the device 122 on the surface of the contacting element 124.
• the spacing of printed circuit board 106 and module 108 maintained by the spring elements 16, 18 enables loading of both the upper surface of the printed circuit board 106 and the lower surface of the printed circuit board 130 of the module 108 (ie, two-sided mounting of the module 108). This allows for a suitable partitioning of the components to be accommodated, a minimization of the design of the device 100.
• the module 108 may be processed in a standard SMD process in which, for example, first a solder paste pressure is applied to the circuit board 130, then a loading of the module, and then a soldering.
• the spring contacts 1 16, 1 18 can be attached to the module 108 as prefabricated components during the manufacturing process of the module 108.
• finished springs could be used, as shown in FIG. for the element 1 18 a C-spring and for the element 1 16 an S-spring.
• coil springs and the like spring designs more can be fitted to the module 108 and soldered. If such springs are used, which are standard components, falls a special or additional
• An electrical contact of the module 108 can via at least one of
• spring 1 16 could be made of spring bronze for electrical contacting, while spring element 18 is not required for electrical contacting and can reliably produce a spring force over the desired service life of device 100, for example, spring steel.
• Controllers for more robust applications such as being optimized in a vehicle.
• Fign. 2A, 2B an embodiment of a module 200 according to the invention is shown.
• a base circuit board holding the module 200 as well as other elements such as spacers or a housing for accommodating a circuit arrangement consisting of module 200 and base circuit board have been omitted for reasons of clarity.
• An electrical conductor 204 for example a copper track, serves the electrical
• FIGS. 2A and 2B illustrate a state before and after a process step for processing the module 200, in which the external
• Terminals 210 are processed (for example, bent or deformed), so that areas 212 of the conductor 204 can be used as spring elements.
• the areas 212 are thus comparable after processing to the spring elements 1 16, 1 18 of the embodiment 100 of Figure 1 and can space the module 200 of a base printed circuit board and at the same time press for heat dissipation to an inner surface of a housing side.
• the regions 212 represent C-springs
• any resilient design form can be produced, for example an S-shape or even a simple leaf spring (the latter being sufficient for this purpose on the base printed circuit board or in the electronic device) Space is available). Is used as a housing
• Housing according to the tub-lid principle may also be a plurality of
• Spacers are provided against, for example, provided in a lid latching positions, or it is dispensed spacers and / or locking.
• FIG. 3 shows an alternative sectional view in the form of a schematic sectional view
• Figure 3 corresponds to the embodiment of Figure 1.
• FIG 1 is a further embodiment of the fastening means in Figure 3 126, 128, 138, 140 are shown on the slide-in housing 104 and the circuit arrangement 102.
• the circuit arrangement 102 includes a circuit board as a circuit board 106 and a module 108. Of the designed as an extruded housing 104 a top 1 10 and a bottom 1 12 are indicated. The circuit arrangement 102 is inserted into the housing 104 in the direction indicated by the arrow 134. In this case, the circuit board 106 slides over the bottom 1 12 of the housing 104, while the sliding points 126 and 128 along the inner surface 136 of the top 10 of the housing 104 slide.
• Circuit arrangement 102 formed by two locking elements 138, 140. These locking elements 138, 140 are on the side facing the housing
• Printed circuit board 130 of the module 108 are designed as latching points or recesses 138, 140. As counterparts to the locking elements 138, 140 on the
• Module 108 the fastening means 126, 128 realized on the housing by two spacers 126, 128. These are raised as sliding points 126, 128 via the thermal contact 124 and optionally further, on the top of the base circuit board 130 of the module 108 components so that when inserting the assembly 102, only the sliding points 126, 128 in mechanical engagement with the circuit board 130 of Module 108 stand.
• damage to the structures on the circuit board 130 e.g. the thermal contacting element 124 (more generally the Entracermungs Colour of the module 108), but also the inner surface 136 of the top 1 10 of the housing 104 avoided.
• an optionally on the top of the element 124 or the inner surface 136 of the housing top 1 10 previously applied heat transfer medium is not abraded or impaired in any other way.
• the locking point 138 When inserting the arrangement 102, the locking point 138 reaches the position of the ball 126 and the locking point 140, the position of the ball 128. Mediated by the force exerted by the elements 1 16, 1 18 spring force engages the module 108 with the locking points 138, 140 in one the balls 126, 128 predetermined position in the interior of the housing 104 a.
• the circuit arrangement 102 remains fixed in the housing 104 as long as the
• Spring elements 1 16, 1 18 exert a sufficient spring force, which must be designed accordingly for a certain life of the device 100.
• the invention is not limited to the embodiments described herein and the aspects highlighted therein; Rather, within the scope given by the appended claims a variety of modifications are possible, which are within the scope of expert action.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

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ID=45926531

Family Applications (1)

Country Status (5)

Cited By (3)

Families Citing this family (5)

Citations (6)

Family Cites Families (12)

• 2011
  • 2011-03-22 DE DE201110005890 patent/DE102011005890A1/de not_active Withdrawn
• 2012
  • 2012-03-09 CN CN201280078262.9A patent/CN107852837A/zh active Pending
  • 2012-03-09 EP EP12711594.7A patent/EP2689646A1/de not_active Withdrawn
  • 2012-03-09 WO PCT/EP2012/054147 patent/WO2012126748A1/de active Application Filing
  • 2012-03-09 BR BR112013023980A patent/BR112013023980A2/pt not_active Application Discontinuation

Patent Citations (6)

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