BR112015029726A2 - mecanismo de luz led ultrafina - Google Patents

mecanismo de luz led ultrafina

Info

Publication number
BR112015029726A2
BR112015029726A2 BR112015029726A BR112015029726A BR112015029726A2 BR 112015029726 A2 BR112015029726 A2 BR 112015029726A2 BR 112015029726 A BR112015029726 A BR 112015029726A BR 112015029726 A BR112015029726 A BR 112015029726A BR 112015029726 A2 BR112015029726 A2 BR 112015029726A2
Authority
BR
Brazil
Prior art keywords
led light
circuit board
aluminum substrate
light mechanism
protective cover
Prior art date
Application number
BR112015029726A
Other languages
English (en)
Inventor
Luo Chao
Tang Chao
Li Dongming
Li Gang
Long Wentao
Zhao Wei
Original Assignee
Sichuan Sunfor Light Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Sunfor Light Co Ltd filed Critical Sichuan Sunfor Light Co Ltd
Publication of BR112015029726A2 publication Critical patent/BR112015029726A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)

Abstract

resumo mecanismo de luz led ultrafina um mecanismo de luz led ultrafina (100) compreende uma tampa de proteção (106), uma placa de circuito de condução (101), um substrato de alumínio (103) e pelo menos um módulo de led (104). a placa condutora de calor de alta viscosidade dupla face (102) cobre a primeira superfície do substrato de alumínio (103) para fixar a placa de circuito de condução (101); o módulo de pelo menos um led (104) é fixado sobre a primeira superfície e isolados a partir do substrato de alumínio (103) por meio de uma camada isolante (200) na primeira superfície; um circuito condutor para ligar eletricamente o módulo de pelo menos um led (104) e a placa de circuito de condução (101) está disposta sobre a camada isolante (200); e o tamanho do substrato de alumínio (103), pelo menos na zona exterior periférica local é maior do que a da placa de circuito de condução (101), de modo que a placa condutora de calor dupla face de alta viscosidade (102) na primeira superfície pelo menos localmente fixa a tampa de proteção (106). o mecanismo de luz led (100) percebe projeto ultrafino e integração “built-in” de dispositivos de acionamento e controle, e percebe a condução de calor e fixação da pcb e a tampa de proteção usando um filme de dupla face de alta viscosidade.
BR112015029726A 2013-06-09 2014-06-06 mecanismo de luz led ultrafina BR112015029726A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201320332617 2013-06-09
CN201310488314.6A CN104235641B (zh) 2013-06-09 2013-10-17 超薄式led光引擎
PCT/CN2014/079381 WO2014198200A1 (zh) 2013-06-09 2014-06-06 超薄式led光引擎

Publications (1)

Publication Number Publication Date
BR112015029726A2 true BR112015029726A2 (pt) 2017-07-25

Family

ID=52021649

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015029726A BR112015029726A2 (pt) 2013-06-09 2014-06-06 mecanismo de luz led ultrafina

Country Status (11)

Country Link
US (1) US9982876B2 (pt)
EP (1) EP3009731A4 (pt)
JP (1) JP6158432B2 (pt)
KR (1) KR20160030096A (pt)
CN (1) CN104235641B (pt)
AU (1) AU2014280699B2 (pt)
BR (1) BR112015029726A2 (pt)
CA (1) CA2914645C (pt)
EA (1) EA201592282A1 (pt)
MY (1) MY194725A (pt)
WO (1) WO2014198200A1 (pt)

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KR102537440B1 (ko) * 2016-03-18 2023-05-30 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
CN106968392A (zh) * 2016-10-27 2017-07-21 厦门腾月光电科技有限公司 发光建材
EP3596388A1 (en) 2017-03-14 2020-01-22 Signify Holding B.V. Light module
WO2018202527A1 (en) 2017-05-01 2018-11-08 Philips Lighting Holding B.V. Retrofit lighting assembly
US10670250B2 (en) 2017-12-22 2020-06-02 Lumileds Llc Chip-on-board modular lighting system and method of manufacture
JP7007180B2 (ja) * 2017-12-26 2022-01-24 シーシーエス株式会社 発光装置
WO2019154993A1 (en) 2018-02-12 2019-08-15 Signify Holding B.V. Lighting arrangement comprising a substrate for light emitting elements
KR102094402B1 (ko) * 2018-08-24 2020-03-27 주식회사 케이티앤지 발광 소자 및 이를 포함하는 에어로졸 생성 장치
KR102154042B1 (ko) 2019-10-10 2020-09-09 주식회사 티앤에스 동결융해저항성이 우수하고, 부착성이 탁월하여 갈라짐이 없는, 내구성이 우수한 투수 골재 포장재용 바인더 조성물
JP7231832B2 (ja) 2019-12-27 2023-03-02 日亜化学工業株式会社 発光装置、液晶表示装置
KR102422045B1 (ko) 2020-06-01 2022-07-19 주식회사 티앤에스 동결융해저항성이 우수하고, 부착성이 탁월하여 갈라짐이 없는, 내구성이 우수한 투수 골재 포장체
JP7532746B2 (ja) 2020-06-30 2024-08-14 日亜化学工業株式会社 発光モジュールおよび発光モジュールの製造方法
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Also Published As

Publication number Publication date
CN104235641B (zh) 2016-04-06
CA2914645A1 (en) 2014-12-18
EP3009731A1 (en) 2016-04-20
MY194725A (en) 2022-12-15
EA201592282A1 (ru) 2016-04-29
US9982876B2 (en) 2018-05-29
EP3009731A4 (en) 2016-12-21
KR20160030096A (ko) 2016-03-16
WO2014198200A1 (zh) 2014-12-18
AU2014280699A1 (en) 2016-01-21
CN104235641A (zh) 2014-12-24
JP6158432B2 (ja) 2017-07-05
AU2014280699B2 (en) 2017-03-30
US20160131350A1 (en) 2016-05-12
JP2016528665A (ja) 2016-09-15
CA2914645C (en) 2018-05-01

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