MX2015010995A - Sistema de resina para fundición de epoxi de múltiples funciones. - Google Patents
Sistema de resina para fundición de epoxi de múltiples funciones.Info
- Publication number
- MX2015010995A MX2015010995A MX2015010995A MX2015010995A MX2015010995A MX 2015010995 A MX2015010995 A MX 2015010995A MX 2015010995 A MX2015010995 A MX 2015010995A MX 2015010995 A MX2015010995 A MX 2015010995A MX 2015010995 A MX2015010995 A MX 2015010995A
- Authority
- MX
- Mexico
- Prior art keywords
- casting resin
- epoxy casting
- resin system
- function epoxy
- epoxy
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
La presente invención generalmente se refiere a las modalidades de un sistema de resina de fundición de epoxi que puede utilizarse para cubrir al menos parcialmente un componente o mecanismo electrónico. En alguna modalidades, la resina epoxi tiene una viscosidad baja, mientras mantiene propiedades físicas ventajosas, térmicas y eléctricas. Además se describen métodos para elaborar modalidades de la resina de fundición de epoxi.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361799248P | 2013-03-15 | 2013-03-15 | |
PCT/US2014/025503 WO2014151337A1 (en) | 2013-03-15 | 2014-03-13 | Multi-function epoxy casting resin system |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2015010995A true MX2015010995A (es) | 2016-06-02 |
Family
ID=51528343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015010995A MX2015010995A (es) | 2013-03-15 | 2014-03-13 | Sistema de resina para fundición de epoxi de múltiples funciones. |
Country Status (6)
Country | Link |
---|---|
US (1) | US9629254B2 (es) |
EP (1) | EP2970651A4 (es) |
CN (1) | CN105229078A (es) |
CA (1) | CA2902617C (es) |
MX (1) | MX2015010995A (es) |
WO (1) | WO2014151337A1 (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR112013029221B1 (pt) * | 2011-05-13 | 2021-03-09 | Dow Global Technologies Llc | composição de formulação de resina epóxi curável, processo para preparar uma composição de formulação de resina epóxi curável, processo para preparar um material isolante de epóxi e produto |
WO2016175789A1 (en) * | 2015-04-29 | 2016-11-03 | Hewlett Packard Enterprise Development Lp | Physical barrier to inhibit a penetration attack |
CN113573525B (zh) * | 2021-07-28 | 2023-02-28 | Oppo广东移动通信有限公司 | 壳体组件、其制备方法及电子设备 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0459951A3 (en) * | 1990-05-30 | 1993-09-15 | Ciba-Geigy Ag | Char forming nonhalogenated flame retardant epoxy composition |
AU692890B2 (en) * | 1994-07-01 | 1998-06-18 | Vantico Ag | Epoxy resin casting composition |
US20040143079A1 (en) * | 2003-01-21 | 2004-07-22 | Simion Coca | Compositions containing copolymers of isobutylene type monomers |
US6946503B2 (en) * | 2002-04-12 | 2005-09-20 | Huntsman Petrochemical Corporation | Amine blend accelerators for polyoxyalkylenepolyamine cured epoxy resins |
EP1810985A1 (en) * | 2006-01-24 | 2007-07-25 | Huntsman Advanced Materials (Switzerland) GmbH | Curable composition |
EP2133381A1 (de) * | 2008-06-13 | 2009-12-16 | Sika Technology AG | Wasserverdünnbares Amin und dessen Anwendungen |
JP2012518707A (ja) | 2009-02-24 | 2012-08-16 | ダウ グローバル テクノロジーズ エルエルシー | 硬化性エポキシ樹脂組成物及びその硬化体生成物 |
EP2295487A1 (en) * | 2009-09-11 | 2011-03-16 | Elantas GMBH | Epoxy resin curing indicator composition |
ES2388809T3 (es) * | 2009-12-08 | 2012-10-18 | Sika Technology Ag | Composición de resina epoxídica poco viscosa con bajo " blushing" |
US9840588B2 (en) | 2009-12-18 | 2017-12-12 | Hexion Inc. | Epoxy resin curing compositions and epoxy resin systems including same |
EP2465842A1 (de) * | 2010-12-17 | 2012-06-20 | Sika Technology AG | Amine mit sekundären aliphatischen Aminogruppen |
BR112013029221B1 (pt) | 2011-05-13 | 2021-03-09 | Dow Global Technologies Llc | composição de formulação de resina epóxi curável, processo para preparar uma composição de formulação de resina epóxi curável, processo para preparar um material isolante de epóxi e produto |
US9145488B2 (en) * | 2011-05-19 | 2015-09-29 | Chemtura Corporation | Aluminum phosphorus acid salts as epoxy resin cure inhibitors |
EP2592100A1 (de) * | 2011-11-10 | 2013-05-15 | Sika Technology AG | Härter für epoxidharz-beschichtungen |
EP2592101A1 (de) * | 2011-11-10 | 2013-05-15 | Sika Technology AG | Härter für Epoxidharz-Beschichtungen |
CN102533192A (zh) | 2011-12-28 | 2012-07-04 | 烟台德邦电子材料有限公司 | 一种阻燃的高导热环氧树脂电子粘接胶 |
CN102863936B (zh) * | 2012-10-09 | 2014-07-02 | 株洲时代新材料科技股份有限公司 | 一种加热固化型双组分环氧灌封胶及其制备方法 |
-
2014
- 2014-03-13 CN CN201480027451.2A patent/CN105229078A/zh active Pending
- 2014-03-13 CA CA2902617A patent/CA2902617C/en active Active
- 2014-03-13 WO PCT/US2014/025503 patent/WO2014151337A1/en active Application Filing
- 2014-03-13 MX MX2015010995A patent/MX2015010995A/es unknown
- 2014-03-13 US US14/208,144 patent/US9629254B2/en active Active
- 2014-03-13 EP EP14767704.1A patent/EP2970651A4/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN105229078A (zh) | 2016-01-06 |
WO2014151337A1 (en) | 2014-09-25 |
EP2970651A4 (en) | 2016-09-21 |
CA2902617A1 (en) | 2014-09-25 |
US9629254B2 (en) | 2017-04-18 |
CA2902617C (en) | 2021-03-02 |
US20140272328A1 (en) | 2014-09-18 |
EP2970651A1 (en) | 2016-01-20 |
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