MX351312B - Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico. - Google Patents

Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico.

Info

Publication number
MX351312B
MX351312B MX2015011602A MX2015011602A MX351312B MX 351312 B MX351312 B MX 351312B MX 2015011602 A MX2015011602 A MX 2015011602A MX 2015011602 A MX2015011602 A MX 2015011602A MX 351312 B MX351312 B MX 351312B
Authority
MX
Mexico
Prior art keywords
control apparatus
electronic control
viscosity
thermal grease
application
Prior art date
Application number
MX2015011602A
Other languages
English (en)
Other versions
MX2015011602A (es
Inventor
Kawai Yoshio
Negishi Yoshiyasu
Fukuzawa Takayuki
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of MX2015011602A publication Critical patent/MX2015011602A/es
Publication of MX351312B publication Critical patent/MX351312B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

En una configuración en que una grasa térmica se aplica entre una tarjeta de circuito que tiene un componente electrónico montado en la misma y un cuerpo de carcasa que contiene la tarjeta para conectar térmicamente ambos por medio de la grasa térmica, la aplicación no es fácil debido a que la grasa térmica es alta en viscosidad inicial. Una grasa 5 térmica se fabrica de un material que tiene una viscosidad que no impide la aplicabilidad en la etapa inicial (antes de la aplicación) por ejemplo, una viscosidad de aproximadamente 50-400 (Pa•s), y que aumenta a aproximadamente 600-3,000 (Pa•s) en viscosidad después de la aplicación.
MX2015011602A 2013-03-21 2014-01-20 Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico. MX351312B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013058888A JP6141064B2 (ja) 2013-03-21 2013-03-21 回路基板と筐体の接続方法
PCT/JP2014/050985 WO2014148085A1 (ja) 2013-03-21 2014-01-20 電子制御装置及び電子制御装置の基板接続方法

Publications (2)

Publication Number Publication Date
MX2015011602A MX2015011602A (es) 2016-04-25
MX351312B true MX351312B (es) 2017-10-10

Family

ID=51579781

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015011602A MX351312B (es) 2013-03-21 2014-01-20 Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico.

Country Status (6)

Country Link
US (1) US10028412B2 (es)
JP (1) JP6141064B2 (es)
CN (1) CN104871311B (es)
DE (1) DE112014001533B4 (es)
MX (1) MX351312B (es)
WO (1) WO2014148085A1 (es)

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JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
JP6198998B2 (ja) * 2015-05-14 2017-09-20 三菱電機株式会社 電磁アクチュエータ
JP6453195B2 (ja) 2015-09-29 2019-01-16 日立オートモティブシステムズ株式会社 車載制御装置
JP6129370B1 (ja) * 2016-02-15 2017-05-17 三菱電機株式会社 防水型電子機器ユニット
SE540653C2 (sv) * 2016-03-29 2018-10-09 Atlas Copco Airpower Nv Arrangemang anordnat att innesluta ett kretskort innefattande elektroniska komponenter och ett verktyg innefattande arrangemanget
CN106231874B (zh) * 2016-08-26 2018-07-13 浙江众合科技股份有限公司 一种散热器导热胶泥压制工具及板卡散热结构
TWI642348B (zh) * 2017-09-25 2018-11-21 群光電能科技股份有限公司 具有隔熱功能的電源供應器
CN107846102B (zh) * 2017-10-26 2021-12-07 珠海格力节能环保制冷技术研究中心有限公司 多用途机壳和电机
JP7016054B2 (ja) * 2018-01-12 2022-02-04 パナソニックＩｐマネジメント株式会社 電源装置、前照灯、及び移動体
US10779444B2 (en) * 2018-01-19 2020-09-15 Ge Aviation Systems Llc Control boxes and system-on-module circuit boards for unmanned vehicles
US11343942B2 (en) 2018-05-14 2022-05-24 Mitsubishi Electric Corporation Power conversion device including cooling components
JP6948013B2 (ja) 2018-06-11 2021-10-13 住友電装株式会社 電気接続箱
US10763193B2 (en) 2018-10-30 2020-09-01 Hamilton Sundstrand Corporation Power control modules
CN111211059B (zh) * 2018-11-22 2023-07-04 矽品精密工业股份有限公司 电子封装件及其制法与散热件
DE102019131159A1 (de) * 2019-11-19 2021-05-20 Connaught Electronics Ltd. Kühlkörper zum Halten von Wärmeleitpaste und zur Wärmesenkung für eine Verwendung in einer elektronischen Steuereinheit (Electronic Control Unit - ECU)

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JP5474877B2 (ja) * 2011-06-17 2014-04-16 日立オートモティブシステムズ株式会社 電子制御装置
JP5565758B2 (ja) 2011-06-29 2014-08-06 信越化学工業株式会社 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置
JP2013030518A (ja) 2011-07-27 2013-02-07 Hitachi Automotive Systems Ltd 電子制御装置

Also Published As

Publication number Publication date
DE112014001533B4 (de) 2021-09-09
JP6141064B2 (ja) 2017-06-07
CN104871311B (zh) 2018-10-09
JP2014187063A (ja) 2014-10-02
WO2014148085A1 (ja) 2014-09-25
DE112014001533T5 (de) 2015-12-03
MX2015011602A (es) 2016-04-25
US20160021789A1 (en) 2016-01-21
US10028412B2 (en) 2018-07-17
CN104871311A (zh) 2015-08-26

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