MX351312B - Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico. - Google Patents
Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico.Info
- Publication number
- MX351312B MX351312B MX2015011602A MX2015011602A MX351312B MX 351312 B MX351312 B MX 351312B MX 2015011602 A MX2015011602 A MX 2015011602A MX 2015011602 A MX2015011602 A MX 2015011602A MX 351312 B MX351312 B MX 351312B
- Authority
- MX
- Mexico
- Prior art keywords
- control apparatus
- electronic control
- viscosity
- thermal grease
- application
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
En una configuración en que una grasa térmica se aplica entre una tarjeta de circuito que tiene un componente electrónico montado en la misma y un cuerpo de carcasa que contiene la tarjeta para conectar térmicamente ambos por medio de la grasa térmica, la aplicación no es fácil debido a que la grasa térmica es alta en viscosidad inicial. Una grasa 5 térmica se fabrica de un material que tiene una viscosidad que no impide la aplicabilidad en la etapa inicial (antes de la aplicación) por ejemplo, una viscosidad de aproximadamente 50-400 (Pas), y que aumenta a aproximadamente 600-3,000 (Pas) en viscosidad después de la aplicación.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013058888A JP6141064B2 (ja) | 2013-03-21 | 2013-03-21 | 回路基板と筐体の接続方法 |
PCT/JP2014/050985 WO2014148085A1 (ja) | 2013-03-21 | 2014-01-20 | 電子制御装置及び電子制御装置の基板接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2015011602A MX2015011602A (es) | 2016-04-25 |
MX351312B true MX351312B (es) | 2017-10-10 |
Family
ID=51579781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015011602A MX351312B (es) | 2013-03-21 | 2014-01-20 | Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico. |
Country Status (6)
Country | Link |
---|---|
US (1) | US10028412B2 (es) |
JP (1) | JP6141064B2 (es) |
CN (1) | CN104871311B (es) |
DE (1) | DE112014001533B4 (es) |
MX (1) | MX351312B (es) |
WO (1) | WO2014148085A1 (es) |
Families Citing this family (17)
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DE102015209191A1 (de) | 2015-02-10 | 2016-08-11 | Conti Temic Microelectronic Gmbh | Mechatronische Komponente und Verfahren zu deren Herstellung |
JP2016176557A (ja) * | 2015-03-20 | 2016-10-06 | キヤノン株式会社 | 制振構造体及び制振ワッシャ |
JP6693706B2 (ja) * | 2015-04-06 | 2020-05-13 | 株式会社デンソー | 電子制御装置 |
JP6198998B2 (ja) * | 2015-05-14 | 2017-09-20 | 三菱電機株式会社 | 電磁アクチュエータ |
JP6453195B2 (ja) | 2015-09-29 | 2019-01-16 | 日立オートモティブシステムズ株式会社 | 車載制御装置 |
JP6129370B1 (ja) * | 2016-02-15 | 2017-05-17 | 三菱電機株式会社 | 防水型電子機器ユニット |
SE540653C2 (sv) * | 2016-03-29 | 2018-10-09 | Atlas Copco Airpower Nv | Arrangemang anordnat att innesluta ett kretskort innefattande elektroniska komponenter och ett verktyg innefattande arrangemanget |
CN108513495B (zh) * | 2016-08-26 | 2019-07-16 | 浙江大学 | 一种板卡散热器导热胶泥压制装置 |
TWI642348B (zh) * | 2017-09-25 | 2018-11-21 | 群光電能科技股份有限公司 | 具有隔熱功能的電源供應器 |
CN107846102B (zh) * | 2017-10-26 | 2021-12-07 | 珠海格力节能环保制冷技术研究中心有限公司 | 多用途机壳和电机 |
JP7016054B2 (ja) * | 2018-01-12 | 2022-02-04 | パナソニックIpマネジメント株式会社 | 電源装置、前照灯、及び移動体 |
US10779444B2 (en) * | 2018-01-19 | 2020-09-15 | Ge Aviation Systems Llc | Control boxes and system-on-module circuit boards for unmanned vehicles |
US11343942B2 (en) | 2018-05-14 | 2022-05-24 | Mitsubishi Electric Corporation | Power conversion device including cooling components |
JP6948013B2 (ja) * | 2018-06-11 | 2021-10-13 | 住友電装株式会社 | 電気接続箱 |
US10763193B2 (en) | 2018-10-30 | 2020-09-01 | Hamilton Sundstrand Corporation | Power control modules |
CN111211059B (zh) * | 2018-11-22 | 2023-07-04 | 矽品精密工业股份有限公司 | 电子封装件及其制法与散热件 |
DE102019131159A1 (de) * | 2019-11-19 | 2021-05-20 | Connaught Electronics Ltd. | Kühlkörper zum Halten von Wärmeleitpaste und zur Wärmesenkung für eine Verwendung in einer elektronischen Steuereinheit (Electronic Control Unit - ECU) |
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DE19701731A1 (de) | 1997-01-20 | 1998-07-23 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
JP3531048B2 (ja) * | 1997-02-20 | 2004-05-24 | 松下電器産業株式会社 | 液晶表示装置 |
JP3697902B2 (ja) * | 1998-07-06 | 2005-09-21 | 松下電器産業株式会社 | 電子部品の実装方法 |
JP2001168545A (ja) * | 1999-12-03 | 2001-06-22 | Denso Corp | 電子装置及び電子装置のシール方法 |
DE60139533D1 (de) * | 2000-08-01 | 2009-09-24 | Mitsubishi Electric Corp | Elektronisches Gerät mit einem Substrat für die Schaltung |
JP3905363B2 (ja) * | 2001-06-28 | 2007-04-18 | ハリマ化成株式会社 | 封止充填剤用液状エポキシ樹脂組成物 |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
JP3917473B2 (ja) * | 2002-06-21 | 2007-05-23 | 株式会社オートネットワーク技術研究所 | パワーモジュール |
JP4321999B2 (ja) * | 2002-09-19 | 2009-08-26 | 日本特殊塗料株式会社 | ブラックアウトフィルムを含む自動車のシーリング方法 |
US20060067055A1 (en) * | 2004-09-30 | 2006-03-30 | Heffner Kenneth H | Thermally conductive composite and uses for microelectronic packaging |
JP4473141B2 (ja) * | 2005-01-04 | 2010-06-02 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP5166677B2 (ja) | 2005-03-15 | 2013-03-21 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
JP4538359B2 (ja) * | 2005-03-31 | 2010-09-08 | 株式会社日立産機システム | 電気回路モジュール |
JP4593416B2 (ja) * | 2005-09-22 | 2010-12-08 | 株式会社デンソー | 電子制御装置 |
CN1962807A (zh) * | 2005-11-11 | 2007-05-16 | 鸿富锦精密工业(深圳)有限公司 | 热界面材料混合方法及系统 |
JP4897360B2 (ja) * | 2006-06-08 | 2012-03-14 | ポリマテック株式会社 | 熱伝導性成形体及びその製造方法 |
TWI472595B (zh) * | 2006-08-22 | 2015-02-11 | Mitsubishi Chem Corp | Semiconductor component components and semiconductor light emitting components |
JP2008174697A (ja) | 2007-01-16 | 2008-07-31 | Nippon Handa Kk | 熱伝導性オイル組成物、放熱剤及び電子部品又は電子機器 |
JP2009221311A (ja) * | 2008-03-14 | 2009-10-01 | Momentive Performance Materials Inc | 熱伝導性グリース組成物 |
JP2010109293A (ja) * | 2008-10-31 | 2010-05-13 | General Electric Co <Ge> | 配線構造の製造方法及び低温配線部品回収方法 |
JP5155914B2 (ja) * | 2009-03-19 | 2013-03-06 | 日立オートモティブシステムズ株式会社 | 制御ユニット |
CN101887872A (zh) * | 2009-05-12 | 2010-11-17 | 日月光半导体制造股份有限公司 | 半导体芯片的散热封装构造 |
JP2011060927A (ja) * | 2009-09-09 | 2011-03-24 | Hitachi Ltd | 半導体装置 |
JP5759191B2 (ja) * | 2010-01-29 | 2015-08-05 | 日東電工株式会社 | パワーモジュール |
JP5383599B2 (ja) * | 2010-06-21 | 2014-01-08 | 三菱電機株式会社 | 半導体モジュールユニットの製造方法 |
CN102760707B (zh) * | 2011-04-29 | 2017-04-12 | 博世汽车部件(苏州)有限公司 | 电子控制单元组件以及包括所述电子控制单元组件的车辆 |
JP5474877B2 (ja) * | 2011-06-17 | 2014-04-16 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP5565758B2 (ja) | 2011-06-29 | 2014-08-06 | 信越化学工業株式会社 | 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置 |
JP2013030518A (ja) | 2011-07-27 | 2013-02-07 | Hitachi Automotive Systems Ltd | 電子制御装置 |
-
2013
- 2013-03-21 JP JP2013058888A patent/JP6141064B2/ja active Active
-
2014
- 2014-01-20 CN CN201480003697.6A patent/CN104871311B/zh active Active
- 2014-01-20 US US14/772,504 patent/US10028412B2/en active Active
- 2014-01-20 DE DE112014001533.4T patent/DE112014001533B4/de active Active
- 2014-01-20 WO PCT/JP2014/050985 patent/WO2014148085A1/ja active Application Filing
- 2014-01-20 MX MX2015011602A patent/MX351312B/es active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN104871311A (zh) | 2015-08-26 |
JP2014187063A (ja) | 2014-10-02 |
US10028412B2 (en) | 2018-07-17 |
MX2015011602A (es) | 2016-04-25 |
DE112014001533T5 (de) | 2015-12-03 |
JP6141064B2 (ja) | 2017-06-07 |
CN104871311B (zh) | 2018-10-09 |
WO2014148085A1 (ja) | 2014-09-25 |
US20160021789A1 (en) | 2016-01-21 |
DE112014001533B4 (de) | 2021-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |