JP4593416B2 - 電子制御装置 - Google Patents
電子制御装置 Download PDFInfo
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- JP4593416B2 JP4593416B2 JP2005275453A JP2005275453A JP4593416B2 JP 4593416 B2 JP4593416 B2 JP 4593416B2 JP 2005275453 A JP2005275453 A JP 2005275453A JP 2005275453 A JP2005275453 A JP 2005275453A JP 4593416 B2 JP4593416 B2 JP 4593416B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Description
また本発明では、基板をケースとカバーとによって挟んだ状態で筐体に固定するようにしており、基板とカバーの前記突出部分との間の熱伝導材の配置される間隔の寸法精度を容易に確保することができる。
尚、熱伝導材は、柔軟性を有する例えば半固体(又はゲル状)であり、押圧されるとその形状が容易に変形するものである。熱伝導材としては、その熱伝導材の熱伝導率が、例えば基板材料のエポキシ樹脂等の樹脂よりも高いシリコン系の材料など使用できるが、この熱伝導率としては、1〜3W/m・K程度のものを採用できる。
また熱伝導薄膜層としては、熱伝導率が例えば基板材料であるエポキシ樹脂等の樹脂よりも高い例えば銅箔からなる薄膜層を用いることができるが、この熱伝導率としては、銅の398W/m・K程度のものを採用できる。
尚、放熱部材(例えばヒートシンク)としては、熱伝導率が例えばモールド材料の樹脂より高い固体の金属材料を使用できるが、この熱伝導率としては、一般的な合金や金属材料から20〜400W/m・Kのものを採用できる。
尚、固体の熱伝導部材としては、熱伝導率が例えば基板材料のエポキシ樹脂等の樹脂より高い金属材料を使用できるが、この熱伝導率としては、一般的な合金や金属材料から20〜400W/m・Kのものを採用できる。
3、39、111、161、199、221・・電子部品
5、33、79、99、115、131、151、179、193、213・・プリント基板
7・・筐体
9、35・・ケース
13、37、71、91、119、135、155、175、197、216・・カバー
27、59、73、93、123、137、181、195・・突出部
77、81、127、205、227・・移動防止部
25、55、97、113、133、153、171、191、211・・モールド部品
17a、17b、17c、41a、41b、141、161、201、223・・熱伝導薄膜層
29、61、105、125、145、159、183、203、219・・熱伝導材
157、217・・熱伝導部材
Claims (6)
- 発熱する電子部品がモールドされたモールド部品を配置する搭載面及び当該搭載面と反対側の反搭載面を有する基板を筐体内に収容した電子制御装置において、
前記筐体を、開口部を有する箱状のケースと当該ケースの前記開口部を閉塞するカバーとから構成し、
前記基板を、その搭載面が前記カバー側に対向するようにして前記筐体内に収容し、
前記モールド部品を、前記電子部品と一体に放熱部材がモールドされたものとして、当該放熱部材側において前記カバーに対向するようにして前記基板の前記搭載面に配置し、
前記基板の前記搭載面に対向するとともに前記モールド部品の配置位置に対応する位置の前記カバーの一部を、前記モールド部品に向けて突出させるとともに、
当該カバーの突出部分と当該突出部分と対向する前記モールド部品の対向面との間に、前記突出部分側及び前記モールド部品の前記放熱部材側と接するように、柔軟性を有する熱伝導材を配置し、
前記基板と前記カバーの前記突出部分との間の前記熱伝導材の配置される間隔の寸法精度を確保するようにして、前記基板を前記ケースと前記カバーとによって挟まれた状態で前記筐体に固定したことを特徴とする電子制御装置。 - 前記熱伝導材と接する前記カバーの前記突出部分側の表面を、凹凸形状にしたことを特徴とする請求項1に記載の電子制御装置。
- 前記凹凸形状を、前記カバーと一体に成形したことを特徴とする請求項2に記載の電子制御装置。
- 前記モールド部品及び前記カバーの前記突出部分のうち前記熱伝導材に接する少なくとも一方の表面に、前記熱伝導材側に突出して熱伝導材の移動を防止する移動防止部を設けたことを特徴とする請求項1に記載の電子制御装置。
- 前記移動防止部を、前記カバーと一体に成形したことを特徴とする請求項4に記載の電子制御装置。
- 前記移動防止部として前記熱伝導材の周囲を囲むように枠部を凸状に形成したことを特徴とする請求項4または5に記載の電子制御装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005275453A JP4593416B2 (ja) | 2005-09-22 | 2005-09-22 | 電子制御装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005275453A JP4593416B2 (ja) | 2005-09-22 | 2005-09-22 | 電子制御装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002092495A Division JP2003289191A (ja) | 2002-03-28 | 2002-03-28 | 電子制御装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010173320A Division JP2010258474A (ja) | 2010-08-02 | 2010-08-02 | 電子制御装置 |
Publications (2)
Publication Number | Publication Date |
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JP2006086536A JP2006086536A (ja) | 2006-03-30 |
JP4593416B2 true JP4593416B2 (ja) | 2010-12-08 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005275453A Expired - Lifetime JP4593416B2 (ja) | 2005-09-22 | 2005-09-22 | 電子制御装置 |
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JP (1) | JP4593416B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4830807B2 (ja) * | 2006-11-22 | 2011-12-07 | 株式会社デンソー | 電子装置 |
JP5160354B2 (ja) * | 2008-09-16 | 2013-03-13 | タカタ株式会社 | シートベルトリトラクタおよびこれを備えたシートベルト装置 |
JP5261736B2 (ja) * | 2008-09-16 | 2013-08-14 | タカタ株式会社 | シートベルトリトラクタおよびこれを備えたシートベルト装置 |
JP5358347B2 (ja) * | 2009-08-25 | 2013-12-04 | 富士電機株式会社 | 回路遮断器及び回路遮断器の調整方法 |
JP2011165903A (ja) * | 2010-02-10 | 2011-08-25 | Rohm Co Ltd | 半導体モジュールおよび半導体モジュールの製造方法 |
JP2014063930A (ja) | 2012-09-21 | 2014-04-10 | Hitachi Automotive Systems Ltd | 電子制御装置 |
JP6141064B2 (ja) | 2013-03-21 | 2017-06-07 | 日立オートモティブシステムズ株式会社 | 回路基板と筐体の接続方法 |
JP6076872B2 (ja) * | 2013-09-19 | 2017-02-08 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
-
2005
- 2005-09-22 JP JP2005275453A patent/JP4593416B2/ja not_active Expired - Lifetime
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