JP5408320B2 - 電子制御装置 - Google Patents
電子制御装置 Download PDFInfo
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- JP5408320B2 JP5408320B2 JP2012221344A JP2012221344A JP5408320B2 JP 5408320 B2 JP5408320 B2 JP 5408320B2 JP 2012221344 A JP2012221344 A JP 2012221344A JP 2012221344 A JP2012221344 A JP 2012221344A JP 5408320 B2 JP5408320 B2 JP 5408320B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
(E)前記基板は、前記ケースと前記カバーとの間で挟み込まれており、かつ、前記熱伝導材の配置される前記隙間の間隔の寸法精度を確保するように、前記カバーの前記突出部を含まない一部によって、所定の厚みを有するスペーサを介して押圧されるようにして、当該カバー及び前記ケースと固定されており、前記スペーサは、前記カバーの一部と、前記基板における前記カバーの一部と対向する対向領域との間にのみ配置されて前記隙間の間隔を確保することを特徴とする。
a)実施例1の電子制御装置を、図1に基づいて説明する。
次に、実施例2の電子制御装置について説明するが、図1の実施例と同様な内容の説明は省略する。
次に、実施例3の電子制御装置について説明するが、図2に示す実施例2と同様な内容の説明は省略する。
次に、実施例4の電子制御装置について説明するが、実施例3と同様な内容の説明は省略する。
次に、実施例5の電子制御装置について説明するが、実施例1乃至3と同様な内容の説明は省略する。
次に、実施例6の電子制御装置について説明するが、実施例1と同様な内容の説明は省略する。
次に、実施例7の電子制御装置について説明するが、実施例1と同様な内容の説明は省略する。
次に、実施例8の電子制御装置について説明するが、実施例5と同様な内容の説明は省略する。
次に、実施例9の電子制御装置について説明するが、実施例4と同様な内容の説明は省略する。
次に、実施例10の電子制御装置について説明するが、実施例6と同様な内容の説明は省略する。
3、39、111、161、199、221・・電子部品
5、33、79、99、115、131、151、179、193、213・・プリント基板
7・・筐体
9、35・・ケース
13、37、71、91、119、135、155、175、197、216・・カバー
27、59、73、93、123、137、181、195・・突出部
77、81、127、205、227・・移動防止部
25、55、97、113、133、153、171、191、211・・モールド部品
17a、17b、17c、41a、41b、141、161、201、223・・熱伝導薄膜層
29、61、105、125、145、159、183、203、219・・熱伝導材
157、217・・熱伝導部材
Claims (6)
- 発熱する電子部品が所定領域に搭載された基板、
開口部を有する箱状のケースと、当該ケースの開口部を閉塞するとともにケースよりも底の浅いカバーとから構成され、前記基板を収容する筐体、
前記筐体内において前記カバー側に設けられ、前記基板の前記所定領域に対応する突出面を有して前記所定領域に向けて突出し、前記カバーと一体に形成された突出部、
前記突出部の前記突出面と前記所定領域において前記突出面に近接する前記基板あるいは前記電子部品の前記突出面の対向面との間の隙間に配置された柔軟性を有する熱伝導材とを有し、
前記基板は、前記ケースと前記カバーとの間で挟み込まれており、かつ、前記熱伝導材の配置される前記隙間の間隔の寸法精度を確保するように、前記カバーの前記突出部を含まない一部によって、所定の厚みを有するスペーサを介して押圧されるようにして、当該カバー及び前記ケースと固定されており、
前記スペーサは、前記カバーの一部と、前記基板における前記カバーの一部と対向する対向領域との間にのみ配置されて前記隙間の間隔を確保することを特徴とする電子制御装置。 - 前記突出部の突出面に対向する前記対向面は、前記電子部品の放熱部材であることを特徴とする請求項1に記載の電子制御装置。
- 前記電子部品は、該電子部品と一体にモールドされた放熱部材を備え、前記突出部の突出面に該放熱部材を向けて前記基板に搭載されていることを特徴とする請求項1に記載の電子制御装置。
- 前記突出部の突出面に対向する前記対向面は、前記基板の前記電子部品の搭載面と反対側の前記基板の面に配置された熱伝導薄膜層であることを特徴とする請求項1に記載の電子制御装置。
- 前記突出部の突出面は凹凸状とされていることを特徴とする請求項1〜4のいずれかに記載の電子制御装置。
- 前記基板は前記カバーにネジにより固定されていることを特徴とする請求項1〜5のいずれかに記載の電子制御装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012221344A JP5408320B2 (ja) | 2012-10-03 | 2012-10-03 | 電子制御装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012221344A JP5408320B2 (ja) | 2012-10-03 | 2012-10-03 | 電子制御装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010173320A Division JP2010258474A (ja) | 2010-08-02 | 2010-08-02 | 電子制御装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013118799A Division JP6027945B2 (ja) | 2013-06-05 | 2013-06-05 | 電子制御装置 |
Publications (2)
Publication Number | Publication Date |
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JP2013062509A JP2013062509A (ja) | 2013-04-04 |
JP5408320B2 true JP5408320B2 (ja) | 2014-02-05 |
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Application Number | Title | Priority Date | Filing Date |
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JP2012221344A Expired - Fee Related JP5408320B2 (ja) | 2012-10-03 | 2012-10-03 | 電子制御装置 |
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JP (1) | JP5408320B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6171631B2 (ja) * | 2013-07-01 | 2017-08-02 | 株式会社デンソー | 電子装置の製造方法 |
JP6331424B2 (ja) * | 2014-01-30 | 2018-05-30 | 日本精工株式会社 | 電子制御ユニットおよび電動パワーステアリング装置 |
JP6382784B2 (ja) * | 2015-11-26 | 2018-08-29 | 株式会社Soken | 半導体装置の製造方法 |
WO2024024066A1 (ja) * | 2022-07-28 | 2024-02-01 | 日立Astemo株式会社 | 電力変換装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS56162696U (ja) * | 1980-04-30 | 1981-12-03 | ||
JPS6422093U (ja) * | 1987-07-29 | 1989-02-03 | ||
JPH0955459A (ja) * | 1995-06-06 | 1997-02-25 | Seiko Epson Corp | 半導体装置 |
DE19528632A1 (de) * | 1995-08-04 | 1997-02-06 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
JP3885321B2 (ja) * | 1997-11-19 | 2007-02-21 | 株式会社デンソー | 樹脂封止型半導体部品の製造方法 |
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