WO2014148085A1 - 電子制御装置及び電子制御装置の基板接続方法 - Google Patents
電子制御装置及び電子制御装置の基板接続方法 Download PDFInfo
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- WO2014148085A1 WO2014148085A1 PCT/JP2014/050985 JP2014050985W WO2014148085A1 WO 2014148085 A1 WO2014148085 A1 WO 2014148085A1 JP 2014050985 W JP2014050985 W JP 2014050985W WO 2014148085 A1 WO2014148085 A1 WO 2014148085A1
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- heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to an electronic control device and an electronic control mounted on a vehicle such as an engine control unit and an automatic transmission control unit having a heat dissipation structure that radiates heat generated from electronic components such as semiconductor elements to the outside of the housing.
- the present invention relates to a substrate connecting method of an apparatus.
- FIG. 8 is an explanatory diagram showing the heat dissipation structure.
- a heat conductive material 104 is interposed between the electronic component 102 mounted on the circuit board 101 and the housing 103, and heat generated from the electronic component 102 is generated. The heat is transmitted to the housing 103 via the heat conductive material 104 and is radiated from the surface of the housing 103 to the outside of the housing.
- heat radiation grease is used as the heat conducting material.
- the adhesive becomes rubber and the hardness increases, and the electronic component is rigidly connected to the base portion. For this reason, the stress to an electronic component or a solder part generate
- the heat dissipating grease retains its viscosity even after application, and can suppress the concentration of stress on the electronic component or the solder part.
- Patent Document 1 For example, Patent Document 1
- the heat release grease generally contains a heat conductive material such as alumina in order to increase the heat conductivity, so the initial viscosity is high, and the heat release grease is applied by discharging the heat release grease from the nozzle with air pressure or the like.
- a heat conductive material such as alumina
- a nozzle to a Peruvian can containing heat radiation grease (for example, a 20 kg can), connect the nozzle, and discharge the heat radiation grease in the can from the nozzle and apply it.
- heat radiation grease for example, a 20 kg can
- the heat dissipation grease In order to improve the applicability of heat dissipation grease and prevent deformation due to thermal deformation and vibration, the heat dissipation grease has a multi-layer structure of a low-viscosity layer and a high-viscosity layer. A heat dissipation grease has also been developed that prevents deformation due to thermal deformation and vibration in the viscous layer, but this also increases the cost. (2) The heat dissipating grease is liable to lose its shape or to flow out of the electronic component 102 due to thermal deformation or vibration. In order to prevent deformation and outflow, the periphery of the heat dissipation grease 104 can be surrounded by a frame 105 as shown in FIG.
- the present invention solves the above-described problems of the conventional example, can be applied at low cost compared to the heat dissipation grease of the multilayer structure, and can improve the coatability and suppress the deformation and outflow due to thermal deformation and vibration.
- the present invention has been made with the object of providing an electronic control device and a substrate connection method for the electronic control device.
- the present invention provides an electronic control device having a configuration in which a circuit board on which an electronic component is mounted and a housing that encloses the board are thermally connected using a flexible heat conductive material.
- the heat conductive material used was a heat dissipating grease that increased in viscosity after coating than before coating.
- the heat dissipation grease has a lower viscosity at the application stage than the viscosity after application, the application work becomes easier, and the application work using the application device, the Peru can, etc. becomes possible.
- the coating workability can be improved.
- FIG. 1 is an exploded perspective view of an engine control unit of an automobile as the electronic control device 1.
- the electronic control device 1 includes a casing 4 formed by liquid-tightly bonding a substantially plate-like case 2 attached to the vehicle body side and a substantially box-shaped cover 3 (joining via a sealing material), and the casing. 4 is constituted roughly by a circuit board 6 that is housed in a protective space inside and on which various electronic components 5 such as heat-generating electronic components and non-heat-generating electronic components are mounted, and is mounted in an engine room (not shown) or the like.
- the brackets 7 and 8 of the case 2 serving as a mounting surface to the vehicle body side, it is mounted on the vehicle body side.
- the heat dissipating grease 9 is interposed between the electronic component 5, particularly the heat generating electronic component and the inner surface of the case 2.
- the circuit board 6 has a non-heat-generating electronic component such as a capacitor, a coil, or the like that does not generate heat relatively or does not require special heat dissipation treatment such as a heat sink, on the upper side surface (surface on the cover 3 side) 6a.
- a so-called printed wiring board on which a heat generating electronic component 5 that is relatively easy to generate heat is mounted on the lower side surface (surface on the case 2 side), such as an arithmetic processing unit, a transistor, and an IC.
- a wiring circuit pattern is formed on the front or back surface of a plate material made of glass epoxy resin or the like or inside thereof, and various electronic components 5 are electrically connected to the wiring circuit pattern by soldering or the like.
- a connector 11 having a connection port 10 connected to an external connector is attached to a part of the peripheral side of the circuit board 6.
- the connector 11 is fixed to the circuit board 6 via the mounting base 12.
- the connector 11 is configured such that the connection port 10 faces the outside through a window portion 13 that is a space formed between the case 2 and the cover 3, and is connected to a vehicle-side connector here.
- the case 2 is integrally formed in a substantially plate shape, more specifically, a shallow box shape with a slightly raised peripheral edge made of a metal material having excellent thermal conductivity such as aluminum.
- the side wall 2b is erected on the outer peripheral edge (each side) of the substantially rectangular bottom wall 2a, and the whole is configured to open upward.
- Cover fixing portions 14 for attaching and fixing the cover 3 are formed at the four corners of the side wall 2b, and the cover 3 is attached to the cover fixing portion 14.
- the circuit board 6 is screwed to the upper end surface of the board fixing part 15 erected on the peripheral part on the inner wall surface side of the bottom wall 2 a of the case 2.
- FIG. 2 is a cross-sectional view showing a state in which the heat dissipating grease 9 is interposed between the heat-generating component 5 mounted on the lower side surface of the circuit board 6 and the bottom wall 2a of the case 2.
- the heat dissipating grease 9 effectively transmits (conducts) the heat generated by the heat generating component 5 to the case 2 side and releases it from the outer surface of the case 2.
- the heat dissipating grease 9 has a viscosity that does not hinder applicability at the time of application, for example, a viscosity of about 50 to 400 Pa ⁇ s, and is finally made of a material that increases the viscosity to about 600 to 3000 Pa ⁇ s after curing. Has been.
- Viscosity at the time of application of heat dissipation grease 9 should be properly used depending on the purpose of use and the shape of the case. For low viscosity (50 Pa ⁇ s and its vicinity), if the thickness of heat dissipation clearance is small, a flat spread is required at the time of application. If the viscosity is high (up to 600 Pa ⁇ s and the vicinity thereof), the thickness of the heat radiation clearance is required, which is suitable when a three-dimensional thickness is required.
- the element alone (the main body, not the solder part) has a simple structure (chip resistance, capacitor, etc.), and has a complicated structure (IC, etc., wire-bonded in a molding resin. Etc.) tend to be weak. (In general, 1> 2 in terms of impact)
- As the heat dissipating grease 9 an addition reaction thickening type heat conductive silicon grease and a room temperature moisture thickening type heat conductive silicon grease are known.
- Addition reaction thickening type thermal conductive silicone grease is thickened using a curing furnace, and the necessary properties of grease can be obtained in a short time, but capital investment is required because a curing furnace is required. Become. However, in the case where the waterproof seal is a thermosetting resin, the silicon grease can be cured by utilizing the heating when the seal is cured.
- the room temperature moisture thickening type thermally conductive silicon grease does not require a curing furnace and can therefore reduce the capital investment, but requires a long time to obtain the required curing characteristics.
- the curing characteristics of the addition reaction thickening type thermally conductive silicone grease are as follows: the viscosity at 0 min immediately after coating is 100 (Pa ⁇ s), and 1600 (Pa ⁇ s) at 20 min. s), 2000 (Pa ⁇ s) at 40 min, 2200 (Pa ⁇ s) at 60 min, 2200 (Pa ⁇ s) at 90 min, and the viscosity is kept substantially the same after 60 min.
- the initial viscosity is preferably about 50 to 400 (Pa ⁇ s) surrounded by a circle A1 in FIG. In order to prevent misalignment or outflow, it is preferably about 600 to 3000 (Pa ⁇ s) surrounded by a circle B1 in FIG.
- the viscosity is 600 to 3000 (Pa ⁇ s)
- the hardness (Asuka C) is replaced with approximately 10 to 200 (Asuka C)
- the modulus (G ′) is displayed. Then, it is replaced with about 5000 to 200000 MPa.
- the curing property of the room temperature moisture thickening type thermally conductive silicone grease is as follows. As shown in Table 2 and FIG. Pa ⁇ s), 530 (Pa ⁇ s) for 24 hr, 680 (Pa ⁇ s) for 48 hr, 750 (Pa ⁇ s) for 72 hr, 800 (Pa ⁇ s) for 96 hr, 800 (Pa ⁇ s) for 168 hr Yes, after 96 hours, the viscosity is kept substantially the same.
- the initial viscosity is desirably about 50 to 400 (Pa ⁇ s) surrounded by a circle A2 in FIG.
- it is preferably about 600 to 3000 (Pa ⁇ s) surrounded by a circle B2 in FIG.
- the viscosity of 600 to 3000 (Pa ⁇ s) is replaced with about 10 to 200 (Asuka C) in terms of hardness (Asuka C), and is replaced with about 5000 to 200000 MPa in terms of modulus (G ′). It is done.
- the thermal conductivity silicon grease of the addition reaction thickening type or room temperature moisture thickening type is selected in consideration of the performance required by customers (seismic resistance, operating temperature range, etc.), production efficiency, etc. .
- the thermal conductivity silicon grease of the addition reaction thickening type or room temperature moisture thickening type is selected in consideration of the performance required by customers (seismic resistance, operating temperature range, etc.), production efficiency, etc. .
- a room temperature moisture thickening type is used.
- Admixing an adhesive aid material for bonding to the adherend by hydrogen bonding
- a silane coupling agent in the thermally conductive silicon grease to provide an adhesive group to enclose the thermally conductive silicon grease.
- FIG. 5 to 7 show second to fourth embodiments in which the heat radiation effect is further improved with respect to the first embodiment shown in FIG.
- FIG. 5 shows a second embodiment.
- a part of the bottom wall of the case 2 is protruded toward the circuit board 6 to form a convex portion 16 surrounding the heat-generating electronic component 5.
- the height of the convex portion 16 is formed according to the thickness of the heat-generating electronic component 5.
- the volume of the electronic control device can be reduced by the presence of the convex portion 16. Moreover, since the front end surface 16a of the convex portion 16 approaches the circuit board 6, it is possible to easily receive heat radiation from the circuit board. Furthermore, the protrusion 16 surrounding the heat-generating electronic component 5 can prevent the heat dissipation grease 9 from flowing out.
- FIG. 6 shows a third embodiment.
- the case where the convex part 16 surrounding the heat-generating electronic component 5 is formed, and the heat radiation grease 9 is applied in the concave part 17 adjacent to the convex part 16 so as to fill the space between the heat-generating electronic component 5 and the case 2 is shown.
- the heat generated by the heat generating electronic component 5 can be released to the case 2 side by the heat dissipation grease 9 also from the side surface of the heat generating electronic component 5.
- the surface area of the case 2 is increased by the concave and convex portions 16 and 17, the heat dissipation effect can be further improved.
- Other configurations are the same as those of the second embodiment, and thus a duplicate description is omitted.
- FIG. 7 shows a fourth embodiment.
- the clearance between the circuit board 6 and the case 2 is narrowed in accordance with the amount of displacement of the case 2 due to the temperature rise in the housing 4 or the increase in internal pressure.
- the grease 9 is also intended to improve the heat dissipation efficiency.
- the heat generating component 5 such as an arithmetic processing unit, a transistor, or an IC is attached to the lower side surface of the circuit board 6, and the heat dissipating grease 9 is provided between the heat generating component 5 and the case 2.
- the heat generating component 5 is made to escape to the case 2 side, but conversely, the heat generating component 5 is attached to the upper side surface of the circuit board 6 so that the heat generating component 5 and the cover 3
- the heat dissipating grease 9 may be interposed between the heat generating components 5 and the heat from the heat generating component 5 may be released to the case 2 side.
- the case 2 is formed of a metal material having excellent thermal conductivity such as aluminum.
- the heat-generating component 5 may be attached to the upper side surface and the lower side surface of the circuit board 6 so as to dissipate heat from both the case 2 and the cover 3.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
(1)放熱グリスは、一般的に熱伝導率を上げるためにアルミナ等の熱伝導材を混入しているので、初期粘度が高く、空気圧等で放熱グリスをノズルから吐出させて塗布する場合には、放熱グリスをノズルから円滑に吐出させるのが困難でノズルの目詰まりが起こり易い。このため、塗布ロボット等を使用しての塗布作業に不向きである。
(2)放熱グリスは、熱変形や振動により型崩れや、電子部品102外への流出を起こし易い。型崩れや流出を防止するために、放熱グリス104の周囲を、図8に示すように、枠105で囲って、電子部品102の型崩れや流出を防止することができるが、放熱グリス104を枠105で囲うと、枠105の高さの分だけ、電子部品102と筐体103のクリアランスCが拡大し、放熱効果が悪化する。
前記熱伝導材に、塗布前よりも塗布後に粘度を増す放熱グリスを使用した。
図1は、電子制御装置1としての自動車のエンジンコントロールユニットの分解斜視図である。この電子制御装置1は、車体側に取り付けられる略板状のケース2と略箱状のカバー3とを液密に接合(シール材を介して接合)してなる筐体4と、この筐体4内部の保護空間に収容されて発熱性電子部品や非発熱性電子部品等の各種電子部品5を実装した回路基板6と、により大略構成されており、エンジンルーム(図示省略)等に搭載され、車体側への取付面となるケース2のブラケット7,8の底面において、車体側に取り付けられる。
ここで、ストレスへの耐性の考え方は、
1.ICリードのような応力緩和機構を持たずに基板に直接半田付けされる部品(チップ部品等)は弱く、リードを持って半田付けされるもの(リード部品、IC等)は弱い傾向にある。
2.素子単独(半田部でなく本体)では、単純な構造のもの(チップの抵抗やコンデンサ等の部品)が強く、構造の複雑なもの(ICなど、モール度樹脂の中にワイヤーボンディングされている部品等)が弱いという傾向がある。(影響度的には1>2が一般的)
放熱グリス9は、付加反応増粘タイプの熱伝導性シリコングリスと、室温湿気増粘タイプの熱伝導性シリコングリスが知られている。
図5は第2実施例を示す。この実施例においては、ケース2の底壁の一部を、回路基板6側に向けて突出させ、発熱性電子部品5を囲む凸部16を形成した。前記凸部16の高さは、発熱性電子部品5の肉厚に応じて形成されている。
2…ケース
3…カバー
4…筐体
5…電子部品
6…回路基板
9…放熱グリス
Claims (8)
- 電子部品を実装する回路基板と、該基板を内包する筐体との間を、柔軟性を有する熱伝導材を用いて熱的に接続する構成において、
前記熱伝導材として、塗布前よりも塗布後に粘度を増す放熱グリスを使用したことを特徴とする電子制御装置。 - 前記放熱グリスは、塗布時においては塗布性を阻害しない50~400(Pa・s)の粘度を有し、塗布後において600~3000(Pa・s)に粘度を増す材質で形成されていることを特徴とする請求項1に記載の電子制御装置。
- 前記放熱グリスは、電子部品を筐体に接着する接着助剤を含有していることを特徴とする請求項1又は2に記載の電子制御装置。
- 前記放熱グリスは、回路基板に実装された電子部品としての発熱部品と筐体の内面との間に塗布されていることを特徴とする請求項1~3の何れかに記載の電子制御装置。
- 電子部品を実装する回路基板と、該基板を内包する筐体との間を、柔軟性を有する熱伝導材を用いて熱的に接続する電子制御装置の基板接続方法において、
前記熱伝導材として、塗布前よりも塗布後に粘度を増す放熱グリスを使用することを特徴とする電子制御装置の基板接続方法。 - 前記放熱グリスは、塗布時においては塗布性を阻害しない50~400(Pa・s)の粘度を有し、塗布後において600~3000(Pa・s)に粘度を増す材質で形成されていることを特徴とする請求項5に記載の電子制御装置の基板接続方法。
- 前記放熱グリスは、電子部品を筐体に接着する接着助剤を含有していることを特徴とする請求項5又は6に記載の電子制御装置の基板接続方法。
- 前記放熱グリスを、回路基板に実装された電子部品としての発熱部品と筐体の内面との間に塗布することを特徴とする請求項5~7の何れかに記載の電子制御装置の基板接続方法。
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MX2015011602A MX351312B (es) | 2013-03-21 | 2014-01-20 | Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico. |
DE112014001533.4T DE112014001533B4 (de) | 2013-03-21 | 2014-01-20 | Herstellungsverfahren für eine elektronische Steuerungsvorrichtung |
CN201480003697.6A CN104871311B (zh) | 2013-03-21 | 2014-01-20 | 电子控制装置及电子控制装置的基板连接方法 |
US14/772,504 US10028412B2 (en) | 2013-03-21 | 2014-01-20 | Electronic control apparatus and method for connecting substrate of electronic control apparatus |
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JP2013058888A JP6141064B2 (ja) | 2013-03-21 | 2013-03-21 | 回路基板と筐体の接続方法 |
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US20160021789A1 (en) | 2016-01-21 |
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MX351312B (es) | 2017-10-10 |
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