SG10202101505UA - Electronic power devices integrated with an engineered substrate - Google Patents
Electronic power devices integrated with an engineered substrateInfo
- Publication number
- SG10202101505UA SG10202101505UA SG10202101505UA SG10202101505UA SG10202101505UA SG 10202101505U A SG10202101505U A SG 10202101505UA SG 10202101505U A SG10202101505U A SG 10202101505UA SG 10202101505U A SG10202101505U A SG 10202101505UA SG 10202101505U A SG10202101505U A SG 10202101505UA
- Authority
- SG
- Singapore
- Prior art keywords
- power devices
- electronic power
- devices integrated
- engineered substrate
- engineered
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
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- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
-
- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/861—Diodes
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1066—Gate region of field-effect devices with PN junction gate
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Country | Link |
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US (6) | US10181419B2 (en) |
EP (1) | EP3504730A4 (en) |
JP (2) | JP7059257B2 (en) |
KR (2) | KR102551812B1 (en) |
CN (2) | CN109804456B (en) |
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-
2017
- 2017-08-23 US US15/684,753 patent/US10181419B2/en active Active
- 2017-08-23 TW TW110120449A patent/TWI767741B/en active
- 2017-08-23 SG SG11201901373YA patent/SG11201901373YA/en unknown
- 2017-08-23 US US15/684,724 patent/US10395965B2/en active Active
- 2017-08-23 CN CN201780062397.9A patent/CN109804456B/en active Active
- 2017-08-23 JP JP2019510893A patent/JP7059257B2/en active Active
- 2017-08-23 TW TW106128550A patent/TWI732925B/en active
- 2017-08-23 KR KR1020227017441A patent/KR102551812B1/en active IP Right Grant
- 2017-08-23 EP EP17844329.7A patent/EP3504730A4/en active Pending
- 2017-08-23 CN CN202211558205.2A patent/CN115775719A/en active Pending
- 2017-08-23 KR KR1020197008306A patent/KR102403038B1/en active IP Right Grant
- 2017-08-23 SG SG10202101505UA patent/SG10202101505UA/en unknown
- 2017-08-23 WO PCT/US2017/048172 patent/WO2018039316A1/en unknown
-
2018
- 2018-12-07 US US16/213,512 patent/US10535547B2/en active Active
-
2019
- 2019-07-01 US US16/459,356 patent/US10529613B2/en active Active
- 2019-12-05 US US16/704,894 patent/US11107720B2/en active Active
-
2021
- 2021-07-28 US US17/387,861 patent/US11735460B2/en active Active
-
2022
- 2022-04-13 JP JP2022066533A patent/JP2022106775A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR102551812B1 (en) | 2023-07-04 |
KR102403038B1 (en) | 2022-05-27 |
JP7059257B2 (en) | 2022-04-25 |
KR20190052003A (en) | 2019-05-15 |
US20190122916A1 (en) | 2019-04-25 |
SG11201901373YA (en) | 2019-03-28 |
EP3504730A1 (en) | 2019-07-03 |
EP3504730A4 (en) | 2020-04-08 |
US20180061694A1 (en) | 2018-03-01 |
US11735460B2 (en) | 2023-08-22 |
TWI732925B (en) | 2021-07-11 |
TW201816849A (en) | 2018-05-01 |
US20190326148A1 (en) | 2019-10-24 |
US20210358795A1 (en) | 2021-11-18 |
US20180061630A1 (en) | 2018-03-01 |
TW202141584A (en) | 2021-11-01 |
KR20220075444A (en) | 2022-06-08 |
CN115775719A (en) | 2023-03-10 |
US10395965B2 (en) | 2019-08-27 |
CN109804456A (en) | 2019-05-24 |
JP2019528576A (en) | 2019-10-10 |
US10529613B2 (en) | 2020-01-07 |
US10181419B2 (en) | 2019-01-15 |
US20200111698A1 (en) | 2020-04-09 |
WO2018039316A1 (en) | 2018-03-01 |
US11107720B2 (en) | 2021-08-31 |
US10535547B2 (en) | 2020-01-14 |
TWI767741B (en) | 2022-06-11 |
JP2022106775A (en) | 2022-07-20 |
CN109804456B (en) | 2022-12-23 |
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