MX2017010502A - Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena. - Google Patents

Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena.

Info

Publication number
MX2017010502A
MX2017010502A MX2017010502A MX2017010502A MX2017010502A MX 2017010502 A MX2017010502 A MX 2017010502A MX 2017010502 A MX2017010502 A MX 2017010502A MX 2017010502 A MX2017010502 A MX 2017010502A MX 2017010502 A MX2017010502 A MX 2017010502A
Authority
MX
Mexico
Prior art keywords
substrate
antenna
electronic element
producing
element associated
Prior art date
Application number
MX2017010502A
Other languages
English (en)
Inventor
Droz François
Original Assignee
Nid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nid Sa filed Critical Nid Sa
Publication of MX2017010502A publication Critical patent/MX2017010502A/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La invención se refiere a un proceso de fabricación de un dispositivo que incluye al menos un elemento electrónico (3) asociado a un substrato (1) y una antena (4). De acuerdo a la invención, este proceso comprende las siguientes etapas: -se coloca una antena (2) sobre la cara superior (6) de un substrato (1); - se introduce al menos parcialmente un elemento electrónico (3, 10) en el substrato (1); - se lamina el conjunto de manera para permitir que la antena (2) y el elemento electrónico (3, 10) entren completamente en el substrato (1) ; y - se enfría el substrato (1) laminado bajo presión. La invención tiene igualmente que ver con un dispositivo obtenido de este modo, ya sea que el mismo sea un producto terminado o un producto semi-terminado. Este dispositivo puede encontrar aplicaciones como tarjeta electrónica o en un pasaporte.
MX2017010502A 2015-02-20 2015-02-20 Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena. MX2017010502A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2015/053661 WO2016131499A1 (fr) 2015-02-20 2015-02-20 Procédé de fabrication d'un dispositif comportant au moins un élément électronique associé à un substrat et à une antenne

Publications (1)

Publication Number Publication Date
MX2017010502A true MX2017010502A (es) 2018-03-14

Family

ID=52589382

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017010502A MX2017010502A (es) 2015-02-20 2015-02-20 Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena.

Country Status (7)

Country Link
US (1) US10558905B2 (es)
EP (1) EP3259708A1 (es)
CN (1) CN107567633A (es)
BR (1) BR112017017273A2 (es)
MX (1) MX2017010502A (es)
RU (1) RU2685973C2 (es)
WO (1) WO2016131499A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017122052A1 (de) * 2017-09-22 2019-03-28 Schreiner Group Gmbh & Co. Kg RFID-Etikett mit Schutz der RFID-Funktion

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4545838A (en) * 1983-02-07 1985-10-08 Sealtran Corp. Lamination product and method employing temporary transfer film
FR2701139B1 (fr) * 1993-02-01 1995-04-21 Solaic Sa Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté.
DE4446369A1 (de) * 1994-12-23 1996-06-27 Giesecke & Devrient Gmbh Datenträger mit einem elektronischen Modul
WO1998006063A1 (fr) * 1996-08-02 1998-02-12 Solaic Carte a circuit integre a connexion mixte
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
FR2781298B1 (fr) * 1998-07-20 2003-01-31 St Microelectronics Sa Procede de fabrication d'une carte a puce electronique et carte a puce electronique
JP2002109491A (ja) * 2000-09-29 2002-04-12 Sony Corp Ｉｃカード及びその製造方法
FR2824939B1 (fr) * 2001-05-16 2003-10-10 A S K Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede
DE10124770C1 (de) * 2001-05-21 2002-10-17 Infineon Technologies Ag Verfahren zur Kontaktierung eines elektrischen Bauelementes mit einem eine Leiterstruktur aufweisenden Substrat
JP3931330B2 (ja) * 2001-09-14 2007-06-13 ソニー株式会社 熱プレス用プレートおよびカード製造装置
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
PA8584401A1 (es) * 2002-10-11 2005-02-04 Nagraid Sa Modulo electronico que implica un elemento aparente sobre una cara y metodo de fabricacion de tal modulo
JP2004220413A (ja) * 2003-01-16 2004-08-05 Seiko Epson Corp Ｒｆｉｄインレットおよびその加工装置
MY148205A (en) 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
KR100751983B1 (ko) * 2003-05-26 2007-08-28 오므론 가부시키가이샤 정보 캐리어, 정보 기록 매체, 센서, 물품 관리 방법
FR2881252A1 (fr) * 2005-01-24 2006-07-28 Ask Sa Dispositif d'idenfication radiofrequence resistant aux milieux et son procede de fabrication
US7785932B2 (en) * 2005-02-01 2010-08-31 Nagraid S.A. Placement method of an electronic module on a substrate and device produced by said method
DE102005058101B4 (de) * 2005-12-05 2019-04-25 Smartrac Ip B.V. Chipkarte und Verfahren zur Herstellung einer Chipkarte
US7777317B2 (en) * 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method
US8067253B2 (en) * 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
US8786510B2 (en) * 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
EP2001077A1 (fr) * 2007-05-21 2008-12-10 Gemplus Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu
US7707706B2 (en) * 2007-06-29 2010-05-04 Ruhlamat Gmbh Method and arrangement for producing a smart card
US8062445B2 (en) * 2007-08-06 2011-11-22 Avery Dennison Corporation Method of making RFID devices
FR2922342B1 (fr) * 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
DE102009014249B4 (de) * 2009-03-20 2012-12-27 Smartrac Ip B.V. Mehrschichtige thermoplastische laminierte Folienanordnung sowie Vorrichtung und Verfahren zum Laminieren
FR2962579A1 (fr) * 2010-07-12 2012-01-13 Ask Sa Dispositif d'identification radio frequence en polycarbonate et son procede de fabrication

Also Published As

Publication number Publication date
BR112017017273A2 (pt) 2018-04-17
EP3259708A1 (fr) 2017-12-27
RU2685973C2 (ru) 2019-04-23
RU2017131527A3 (es) 2019-03-20
RU2017131527A (ru) 2019-03-20
US10558905B2 (en) 2020-02-11
CN107567633A (zh) 2018-01-09
WO2016131499A1 (fr) 2016-08-25
US20180018548A1 (en) 2018-01-18

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