HK1254938A1 - 預浸漬體、印刷布線板、半導體封裝體及印刷布線板的製造方法 - Google Patents

預浸漬體、印刷布線板、半導體封裝體及印刷布線板的製造方法

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Publication number
HK1254938A1
HK1254938A1 HK18114040.1A HK18114040A HK1254938A1 HK 1254938 A1 HK1254938 A1 HK 1254938A1 HK 18114040 A HK18114040 A HK 18114040A HK 1254938 A1 HK1254938 A1 HK 1254938A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
printed circuit
prepreg
semiconductor package
producing
Prior art date
Application number
HK18114040.1A
Other languages
English (en)
Inventor
登坂祐治
齊藤猛
中村幸雄
佐佐木亮太
清水浩
Original Assignee
日立化成株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式會社 filed Critical 日立化成株式會社
Publication of HK1254938A1 publication Critical patent/HK1254938A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Textile Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
HK18114040.1A 2016-01-15 2018-11-02 預浸漬體、印刷布線板、半導體封裝體及印刷布線板的製造方法 HK1254938A1 (zh)

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US11342248B2 (en) 2020-07-14 2022-05-24 Gan Systems Inc. Embedded die packaging for power semiconductor devices
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TWI738705B (zh) 2021-09-11
JP6919575B2 (ja) 2021-08-18
JPWO2017122819A1 (ja) 2018-11-01
EP3403800A4 (en) 2019-08-14
WO2017122819A1 (ja) 2017-07-20
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US10856423B2 (en) 2020-12-01
TW201728447A (zh) 2017-08-16

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