PA8584401A1 - Modulo electronico que implica un elemento aparente sobre una cara y metodo de fabricacion de tal modulo - Google Patents

Modulo electronico que implica un elemento aparente sobre una cara y metodo de fabricacion de tal modulo

Info

Publication number
PA8584401A1
PA8584401A1 PA20038584401A PA8584401A PA8584401A1 PA 8584401 A1 PA8584401 A1 PA 8584401A1 PA 20038584401 A PA20038584401 A PA 20038584401A PA 8584401 A PA8584401 A PA 8584401A PA 8584401 A1 PA8584401 A1 PA 8584401A1
Authority
PA
Panama
Prior art keywords
module
sheet
face
electronic
window
Prior art date
Application number
PA20038584401A
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32075147&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PA8584401(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of PA8584401A1 publication Critical patent/PA8584401A1/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0023—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality around holes, apertures or channels present in at least one layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Credit Cards Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Battery Mounting, Suspending (AREA)
  • Details Of Resistors (AREA)
  • Structure Of Transmissions (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

LA PRESENTE INVENCION SE REFIERE A UN METODO DE FABRICACION DE UN MODULO ELECTRONICO Y A UN MODULO FABRICADO SEGUN ESTE METODO QUE INCLUYE UN ENSAMBLAJE DE DOS HOJAS AISLANTES (2,9) Y DE UN ELEMENTO ELECTRONICO (3). UNA PRIMERA HOJA AISLANTE (2) QUE CONSTITUYE UNA DE LAS CARAS DEL MODULO INCLUYE AL MENOS UNA VENTANA (4) EN LA QUE ESTA ALOJADO EL ELEMENTO ELECTRONICO (3), UNA CARA DE DICHO ELEMENTO (3) ESTA A RAS DE LA SUPERFICIE DE DICHO PRIMERA HOJA (2) Y APARECE SOBRE LA CARA EXTERNA DEL MODULO. LA SEGUNDA HOJA AISLANTE (9) CONSTITUYE LA OTRA CARA DEL MODULO. EL MODULO ESTA CARACTERIZADO POR EL HECHO DE QUE INCLUYE UNA PELICULA ADHESIVA (5) QUE SE EXTIENDE EN UNA REGION QUE CUBRE AL MENOS EL CONTORNO DE LA VENTANA (4) DEL ELEMENTO (3), Y ESTA SITUADO EN UNA REGION COMPRENDIDA ENTRE LA PRIMERA HOJA (2) Y LA SEGUNDA HOJA (9). EL MODULO TAMBIEN PUEDE INCLUIR, AL MENOS UN CIRCUITO ELECTRONICO (6) COLOCADO ENTRE AMBAS HOJAS AISLANTES (2,9) Y CONECTADO AL ELEMENTO (3) SOBRE UNAS ZONAS CONDUCTORES DE CONEXION (13) SITUADAS SOBRE LA CARA INTERNA DEL ELEMENTO (3). EL OBJETIVO DE ESTA INVENCION CONSISTE EN EVITAR LA APARICION DE UNOS RESIDUOS INDESEABLES SOBRE LA CARA EXTERNA DEL MODULO CERCA DEL ELEMENTO (3). ESTOS RESIDUOS PROVIENEN DE UNA INFILTRACION DE MATERIAL DE RELLENO (8) A TRAVES DE LA VENTANA (4) Y/O DEL ELEMENTO (3) EN LA QUE ESTA ALOJADO.
PA20038584401A 2002-10-11 2003-10-03 Modulo electronico que implica un elemento aparente sobre una cara y metodo de fabricacion de tal modulo PA8584401A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH16902002 2002-10-11

Publications (1)

Publication Number Publication Date
PA8584401A1 true PA8584401A1 (es) 2005-02-04

Family

ID=32075147

Family Applications (1)

Application Number Title Priority Date Filing Date
PA20038584401A PA8584401A1 (es) 2002-10-11 2003-10-03 Modulo electronico que implica un elemento aparente sobre una cara y metodo de fabricacion de tal modulo

Country Status (19)

Country Link
US (1) US7710732B2 (es)
EP (1) EP1559068B1 (es)
JP (1) JP4347218B2 (es)
KR (1) KR100988971B1 (es)
CN (1) CN100481121C (es)
AR (1) AR041581A1 (es)
AT (1) ATE397255T1 (es)
AU (1) AU2003264824B2 (es)
BR (1) BR0314472A (es)
CA (1) CA2501777C (es)
DE (1) DE60321373D1 (es)
ES (1) ES2308033T3 (es)
MX (1) MXPA05003717A (es)
MY (1) MY130783A (es)
PA (1) PA8584401A1 (es)
PT (1) PT1559068E (es)
RU (1) RU2316817C2 (es)
TW (1) TWI326844B (es)
WO (1) WO2004034320A1 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4860436B2 (ja) 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 Ｉｃカードおよびその製造方法
WO2008082617A2 (en) 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
WO2008082616A1 (en) 2006-12-29 2008-07-10 Solicore, Inc. Card configured to receive separate battery
DE102008019571A1 (de) * 2008-04-18 2009-10-22 Giesecke & Devrient Gmbh Chipkarte und Verfahren zu deren Herstellung
DE102008053368A1 (de) * 2008-10-27 2010-04-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines tragbaren Datenträgers und tragbarer Datenträger
ES2405981T3 (es) * 2009-12-28 2013-06-04 Nagraid S.A. Procedimiento de fabricación de tarjetas electrónicas
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
EP2390824A1 (fr) * 2010-05-27 2011-11-30 Gemalto SA Procédé de réalisation d'un module multifonctionnel et dispositif le comprenant
US8717186B2 (en) * 2012-06-28 2014-05-06 Xunwei Zhou Detection of swelling in batteries
ES2674483T3 (es) 2014-12-22 2018-07-02 Magna Steyr Fahrzeugtechnik Ag & Co Kg Procedimiento para la fabricación de un componente tipo sándwich
EP3259708A1 (fr) * 2015-02-20 2017-12-27 Nid Sa Procédé de fabrication d'un dispositif comportant au moins un élément électronique associé à un substrat et à une antenne
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
FR3063555B1 (fr) * 2017-03-03 2021-07-09 Linxens Holding Carte a puce et procede de fabrication d’une carte a puce
SE1750836A1 (en) * 2017-06-28 2018-12-29 Fingerprint Cards Ab Fingerprint sensor module comprising antenna and method for manufacturing a fingerprint sensor module
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS62290593A (ja) 1986-06-11 1987-12-17 大日本印刷株式会社 Ｉｃカード
JPH0696357B2 (ja) 1986-12-11 1994-11-30 三菱電機株式会社 Ｉｃカードの製造方法
JPH03114788A (ja) 1989-09-29 1991-05-15 Citizen Watch Co Ltd Ｉｃカード構造
DE4122049A1 (de) * 1991-07-03 1993-01-07 Gao Ges Automation Org Verfahren zum einbau eines traegerelements
US5581065A (en) * 1993-08-02 1996-12-03 Dai Nippon Printing Co., Ltd. Sheet-framed IC carrier, method for producing the same, and IC carrier case
GB2309933B (en) * 1996-02-12 2000-02-23 Plessey Telecomm Contact card
FR2760113B1 (fr) * 1997-02-24 1999-06-04 Gemplus Card Int Procede de fabrication de carte sans contact a antenne bobinee
JPH1114494A (ja) 1997-06-23 1999-01-22 Nikka Densoku Kk 密封容器の密封不良検出方法および装置
JP2001084347A (ja) 1999-09-16 2001-03-30 Toshiba Corp カード型記憶装置及びその製造方法
TW200300990A (en) * 2001-12-11 2003-06-16 Nagra Id S A Low cost electronic module and method for manufacturing such module

Also Published As

Publication number Publication date
DE60321373D1 (de) 2008-07-10
ATE397255T1 (de) 2008-06-15
US20060124350A1 (en) 2006-06-15
PT1559068E (pt) 2008-08-06
EP1559068B1 (fr) 2008-05-28
AU2003264824B2 (en) 2009-06-11
KR20050067173A (ko) 2005-06-30
WO2004034320A1 (fr) 2004-04-22
MY130783A (en) 2007-07-31
US7710732B2 (en) 2010-05-04
RU2005110187A (ru) 2006-03-27
EP1559068A1 (fr) 2005-08-03
AU2003264824A1 (en) 2004-05-04
MXPA05003717A (es) 2005-06-17
TW200409039A (en) 2004-06-01
JP4347218B2 (ja) 2009-10-21
TWI326844B (en) 2010-07-01
RU2316817C2 (ru) 2008-02-10
CA2501777A1 (en) 2004-04-22
ES2308033T3 (es) 2008-12-01
CN1703718A (zh) 2005-11-30
BR0314472A (pt) 2005-07-26
KR100988971B1 (ko) 2010-10-20
CA2501777C (en) 2011-11-29
JP2006503424A (ja) 2006-01-26
CN100481121C (zh) 2009-04-22
AR041581A1 (es) 2005-05-18

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