ES2079036T3 - Construccion de tarjeta de datos personales. - Google Patents

Construccion de tarjeta de datos personales.

Info

Publication number
ES2079036T3
ES2079036T3 ES91310677T ES91310677T ES2079036T3 ES 2079036 T3 ES2079036 T3 ES 2079036T3 ES 91310677 T ES91310677 T ES 91310677T ES 91310677 T ES91310677 T ES 91310677T ES 2079036 T3 ES2079036 T3 ES 2079036T3
Authority
ES
Spain
Prior art keywords
card
circuit panel
structural member
heat
polyester film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91310677T
Other languages
English (en)
Inventor
Richard Michael Flynn
Fred William Verdi Verdi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of ES2079036T3 publication Critical patent/ES2079036T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B32B2038/042—Punching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

UNA TARJETA PERSONAL DE INFORMACION (10), TAMBIEN CONOCIDA COMO TARJETA ELEGANTE, COMPRENDE LA LAMINACION DE UNAS HOJAS TERMOPLASTICAS. UNA HOJA (140), ES UN PANEL DE CIRCUITO HECHO DE UN FILM DE POLIESTER, TENIENDO LINEAS DE INTERCONEXION METALICAS (144) SOBRE SU SUPERFICIE, HECHAS MEDIANTE GRABADO. EL CIRCUITO DE LA TARJETA INCLUYE UNO O MAS CHIPS SEMICONDUCTORES FRAGILES (200), MONTADOS SOBRE EL PANEL DEL CIRCUITO. OTRA HOJA (130), ES UN MIEMBRO ESTRUCTURAL (SOLIDO), QUE COMPRENDE UNA PELICULA DE POLIESTER ESTABILIZADA AL CALOR, Y QUE INCLUYE UN ADHESIVO ACTIVO AL CALOR (133) EN AMBAS CARAS (131, 132). EL MIEMBRO ESTRUCTURAL TIENE A TRAVES SUYO AGUJEROS (136, 137), PARA RECIBIR COMPONENTES (200, 500), MONTADOS SOBRE EL PANEL DEL CIRCUITO, CUANDO ESTAS HOJAS HAN SIDO UNIDAS, Y PARA ADMITIR UN ENCAPSULANTE EPOXICO (300, 400), VACIADO EN SU INTERIOR. CUANDO EL ENCAPSULANTE SECA, ES MUCHO MAS RIGIDO QUE EL CUERPO DE LA TARJETA DE POLIESTER, Y ASI PUEDE PROTEGER LOS CHIPS SEMICONDUCTORES DE LA ROTURA, CUANDO LA TARJETA ES DOBLADA. LAS HOJAS SUPERIOR E INFERIOR (110, 150) DE LA TARJETA CONTIENEN PELICULAS DELGADAS DE POLIVINILO DE CLORURO, QUE PROTEGEN LA TARJETA DE LOS CONTAMINANTES EXTERIORES, TENIENDO CARACTERISTICAS DE EXPANSION TERMICA IDENTICAS, ASI QUE LA ESTRUCTURA LAMINADA NO SE DEFORMA CON EL CAMBIO DE TEMPERATURAS.
ES91310677T 1990-11-30 1991-11-20 Construccion de tarjeta de datos personales. Expired - Lifetime ES2079036T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62016690A 1990-11-30 1990-11-30

Publications (1)

Publication Number Publication Date
ES2079036T3 true ES2079036T3 (es) 1996-01-01

Family

ID=24484856

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91310677T Expired - Lifetime ES2079036T3 (es) 1990-11-30 1991-11-20 Construccion de tarjeta de datos personales.

Country Status (7)

Country Link
EP (1) EP0488574B1 (es)
JP (1) JPH04286697A (es)
AU (1) AU627124B2 (es)
BR (1) BR9105051A (es)
CA (1) CA2051836C (es)
DE (1) DE69114451T2 (es)
ES (1) ES2079036T3 (es)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279612A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd Integrated circuit or smart card.
NL9301457A (nl) * 1993-08-23 1995-03-16 Nedap Nv Contactloze identificatiekaart of smart card.
EP0754567B1 (en) * 1994-03-31 2003-05-28 Ibiden Co., Ltd. Component including an electronic part
JPH07266767A (ja) * 1994-03-31 1995-10-17 Ibiden Co Ltd 非接触型ｉｃカード及び非接触型ｉｃカードの製造方法
FR2721732B1 (fr) * 1994-06-22 1996-08-30 Solaic Sa Carte à mémoire sans contact dont le circuit électronique comporte un module.
US6207004B1 (en) 1996-06-17 2001-03-27 Mitsubishi Denki Kabushiki Kaisha Method for producing thin IC cards and construction thereof
CN1079053C (zh) * 1996-06-17 2002-02-13 三菱电机株式会社 制造薄ic卡的方法及其结构
WO1998009252A1 (de) * 1996-08-26 1998-03-05 Tomas Meinen Verfahren zur herstellung von chipkarten
FR2808395B1 (fr) * 2000-04-26 2003-01-31 Audiosmartcard Internat Sa Procede pour realiser, dans un objet electronique nomade se presentant sous la forme d'une carte de credit, les interconnexions entre des composants electroniques contenus dans ledit objet nomade
DE50015958D1 (de) 2000-05-05 2010-08-26 Infineon Technologies Ag Chipkarte
US6706624B1 (en) * 2001-10-31 2004-03-16 Lockheed Martin Corporation Method for making multichip module substrates by encapsulating electrical conductors
FR2855890B1 (fr) * 2003-06-05 2005-07-22 Sagem Carte multicouche en materiau thermoplastique et procede de securisation de carte multicouche
FR2869255B1 (fr) * 2004-04-27 2009-01-30 Daniel Mignon Procede pour la realisation de cartes plastiques composites souples et cartes obtenues a l'aide dudit procede.
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
US7607249B2 (en) 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
CN101467164B (zh) 2006-04-10 2013-08-21 因诺瓦蒂尔公司 用于电子卡和标签的电子嵌入件模块、电子卡和用于制造此类电子嵌入件模块和卡的方法
US20070290048A1 (en) 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
WO2009142592A1 (en) * 2008-05-20 2009-11-26 Swecard International Sa Electronic device and component protection during manufacture
DE102009016762B4 (de) * 2009-04-07 2016-10-06 SUMIDA Components & Modules GmbH Verfahren und Komponentensatz zum Herstellen elektronischer Baugruppen unter Verwendung einer Vergussmasse
US8766099B2 (en) 2009-09-29 2014-07-01 Apple Inc. Component mounting structures for electronic devices
US9428237B2 (en) 2010-09-01 2016-08-30 Peer Toftner Motorcycle with adjustable geometry
JP2014509269A (ja) * 2011-01-18 2014-04-17 イノベイティア インコーポレイテッド 電子装置の製造において電子アセンブリをボトムオーバーレイに取り付ける方法
WO2016004002A1 (en) * 2014-07-01 2016-01-07 Isola Usa Corp. Prepregs and laminates having a uv curable resin layer
US9579868B2 (en) 2014-07-01 2017-02-28 Isola Usa Corp. Prepregs and laminates having a UV curable resin layer
CN108027892B (zh) * 2015-09-18 2021-04-09 X卡控股有限公司 用于信息携带卡的自定心嵌体和芯层、过程以及得到的产品
GB2548637A (en) * 2016-03-24 2017-09-27 Zwipe As Method of manufacturing an electronic card
DE112017005077T5 (de) * 2016-10-07 2019-06-19 Jaguar Land Rover Limited Steuergerät
DE102019118444B4 (de) * 2019-07-08 2021-03-04 Infineon Technologies Ag Verfahren zum Herstellen einer Chipkarten-Schichtenstruktur, und Chipkarten-Schichtenstruktur

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142489A (ja) * 1983-12-28 1985-07-27 Dainippon Printing Co Ltd Ｉｃカ−ド
JPS61123990A (ja) * 1984-11-05 1986-06-11 Casio Comput Co Ltd Ｉｃカ−ド
JPS61277496A (ja) * 1985-06-04 1986-12-08 株式会社東芝 Ｉｃカ−ド
JPH0751390B2 (ja) * 1985-07-10 1995-06-05 カシオ計算機株式会社 Ｉｃカ−ド
JPS6282092A (ja) * 1985-10-07 1987-04-15 カシオ計算機株式会社 Ｉｃカ−ド
JPS63149191A (ja) * 1986-12-15 1988-06-21 日立マクセル株式会社 Ｉｃカ−ド
JPS62276659A (ja) * 1987-03-31 1987-12-01 Casio Comput Co Ltd シ−ト状小型電子機器
WO1989010269A1 (en) * 1988-04-20 1989-11-02 Matsushita Electric Industrial Co., Ltd. Ic card and production method thereof
GB8901189D0 (en) * 1989-01-19 1989-03-15 Avery W & T Limited Portable electronic token
JPH02204096A (ja) * 1989-02-03 1990-08-14 Citizen Watch Co Ltd Ｉｃカード製造方法
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente

Also Published As

Publication number Publication date
BR9105051A (pt) 1992-06-23
DE69114451T2 (de) 1996-03-21
EP0488574A2 (en) 1992-06-03
CA2051836C (en) 1996-07-23
AU627124B2 (en) 1992-08-13
CA2051836A1 (en) 1992-05-31
AU8821991A (en) 1992-06-18
EP0488574B1 (en) 1995-11-08
EP0488574A3 (en) 1992-11-04
DE69114451D1 (de) 1995-12-14
JPH04286697A (ja) 1992-10-12

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