BR9910718A - Processo de fabricação de um dispositivo eletrônico portátil que comporta pelo menos um microchip de circuito integrado - Google Patents
Processo de fabricação de um dispositivo eletrônico portátil que comporta pelo menos um microchip de circuito integradoInfo
- Publication number
- BR9910718A BR9910718A BR9910718-0A BR9910718A BR9910718A BR 9910718 A BR9910718 A BR 9910718A BR 9910718 A BR9910718 A BR 9910718A BR 9910718 A BR9910718 A BR 9910718A
- Authority
- BR
- Brazil
- Prior art keywords
- electronic device
- integrated circuit
- microchip
- cavity
- portable electronic
- Prior art date
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Resumo da Patente de Invenção para <B>"PROCESSO DE FABRICAçãO DE UM DISPOSITIVO ELETRôNICO PORTáTIL QUE COMPORTA PELO MENOS UM MICROCHIP DE CIRCUITO INTEGRADO"<D> A invenção compreende um método para fazer um dispositivo eletrônico, tal como cartão de microchip compreendendo pelo menos um microchip de circuito integrado (200) localizado em uma cavidade (120) no corpo do cartão (100). O microchip (200) está conectado, por meio de pistas condutoras (112), a elementos de interface (110). A cavidade (120) tem paredes inclinadas. As pistas condutoras (112) e os elementos de interface (110) formam um padrão que resulta de uma impressão, em três dimensões, eletricamente condutora. O padrão de estende da superfície de suporte do cartão (100) ao longo das paredes inclinadas da cavidade (120), até o fundo desta. O dito método permite o aumento da taxa de produção e redução do custo de produção.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9806684A FR2779255B1 (fr) | 1998-05-27 | 1998-05-27 | Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre |
PCT/FR1999/001232 WO1999062028A1 (fr) | 1998-05-27 | 1999-05-26 | Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9910718A true BR9910718A (pt) | 2001-01-09 |
Family
ID=9526770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9910718-0A BR9910718A (pt) | 1998-05-27 | 1999-05-26 | Processo de fabricação de um dispositivo eletrônico portátil que comporta pelo menos um microchip de circuito integrado |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1084481A1 (pt) |
JP (1) | JP2002517047A (pt) |
CN (1) | CN1309796A (pt) |
AU (1) | AU3832299A (pt) |
BR (1) | BR9910718A (pt) |
CA (1) | CA2333431A1 (pt) |
FR (1) | FR2779255B1 (pt) |
WO (1) | WO1999062028A1 (pt) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2875995B1 (fr) * | 2004-09-24 | 2014-10-24 | Oberthur Card Syst Sa | Procede de montage d'un composant electronique sur un support, de preference mou, et entite electronique ainsi obtenue, telle q'un passeport |
JP2006318217A (ja) | 2005-05-12 | 2006-11-24 | Matsushita Electric Works Ltd | メモリカード用アダプタ |
JP4500214B2 (ja) * | 2005-05-30 | 2010-07-14 | 株式会社日立製作所 | 無線icタグ、及び無線icタグの製造方法 |
CN101025796B (zh) * | 2006-02-17 | 2010-05-12 | 上海英内电子标签有限公司 | 一种电子标签的倒封装工艺 |
JP4950627B2 (ja) * | 2006-11-10 | 2012-06-13 | 株式会社日立製作所 | Rficタグとその使用方法 |
FR3009411A1 (fr) * | 2013-08-02 | 2015-02-06 | Ask Sa | Couverture de livret d'identite muni d'un dispositif radiofrequence et son procede de fabrication |
FR3027433A1 (fr) | 2014-10-16 | 2016-04-22 | Ask Sa | Procede de fabrication d'un support de dispositif radiofrequence constitue d'une seule couche |
CN106299623A (zh) * | 2016-09-27 | 2017-01-04 | 北京小米移动软件有限公司 | 无线保真WiFi天线及制造方法 |
CN106897766A (zh) * | 2017-03-31 | 2017-06-27 | 金邦达有限公司 | 带ic芯片的智能卡及智能卡的制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2684471B1 (fr) * | 1991-12-02 | 1994-03-04 | Solaic | Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue. |
EP0688050A1 (fr) * | 1994-06-15 | 1995-12-20 | Philips Cartes Et Systemes | Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue |
US6329213B1 (en) * | 1997-05-01 | 2001-12-11 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
-
1998
- 1998-05-27 FR FR9806684A patent/FR2779255B1/fr not_active Expired - Fee Related
-
1999
- 1999-05-26 CA CA002333431A patent/CA2333431A1/fr not_active Abandoned
- 1999-05-26 WO PCT/FR1999/001232 patent/WO1999062028A1/fr not_active Application Discontinuation
- 1999-05-26 AU AU38322/99A patent/AU3832299A/en not_active Abandoned
- 1999-05-26 BR BR9910718-0A patent/BR9910718A/pt not_active Application Discontinuation
- 1999-05-26 JP JP2000551358A patent/JP2002517047A/ja active Pending
- 1999-05-26 EP EP99920924A patent/EP1084481A1/fr not_active Withdrawn
- 1999-05-26 CN CN99806621A patent/CN1309796A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO1999062028A1 (fr) | 1999-12-02 |
JP2002517047A (ja) | 2002-06-11 |
EP1084481A1 (fr) | 2001-03-21 |
FR2779255B1 (fr) | 2001-10-12 |
CA2333431A1 (fr) | 1999-12-02 |
CN1309796A (zh) | 2001-08-22 |
AU3832299A (en) | 1999-12-13 |
FR2779255A1 (fr) | 1999-12-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FA10 | Dismissal: dismissal - article 33 of industrial property law | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |