ES2174422T3 - Soporte de datos electronico, de constitucion modular. - Google Patents
Soporte de datos electronico, de constitucion modular.Info
- Publication number
- ES2174422T3 ES2174422T3 ES98908041T ES98908041T ES2174422T3 ES 2174422 T3 ES2174422 T3 ES 2174422T3 ES 98908041 T ES98908041 T ES 98908041T ES 98908041 T ES98908041 T ES 98908041T ES 2174422 T3 ES2174422 T3 ES 2174422T3
- Authority
- ES
- Spain
- Prior art keywords
- electronic data
- data support
- modular constitution
- card body
- modular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09836—Oblique hole, via or bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Manufacturing And Processing Devices For Dough (AREA)
- Discharge Of Articles From Conveyors (AREA)
- General Factory Administration (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Pens And Brushes (AREA)
- Push-Button Switches (AREA)
- Communication Cables (AREA)
Abstract
LA PRESENTE INVENCION SE REFIERE A UN SOPORTE DE DATOS EN FORMA DE TARJETA DE CHIP QUE COMPRENDE EL CUERPO DE LA TARJETA (1) DOTADO DE UNA ANTENA (3), UN MODULO DE CHIP (2), QUE CONTIENE UN CIRCUITO INTEGRADO (10), Y SITUADO EN UN REBAJE (5) DISPUESTO EN EL CUERPO DE LA TARJETA (1). LA CONEXION ELECTRICA ENTRE LA ANTENA (3) Y EL MODULO DE CHIP (2) PASA A TRAVES DE UNAS PARTES BAJAS (11) EN LAS CONEXIONES (4) DE LA ANTENA (3). CUANDO FABRICA EL SOPORTE DE DATOS DE LA INVENCION, SE DISPONE UNA CAVIDAD (5) DENTRO DEL CUERPO DE LA TARJETA (1), EN DONDE SE ENCUENTRA LA ANTENA AL MENOS PARCIALMENTE EMPOTRADA. EL MODULO DE CHIP (2) SE COLOCA EN DICHA CAVIDAD (5) Y SE ENCOLA AL CUERPO DE LA TARJETA, POR EJEMPLO, CON UNA COLA ENDURECIBLE (6), ESTABLECIENDOSE DE ESE MODO UNA CONEXION ELECTRICA ENTRE EL MODULO DE CHIP (2) Y LA ANTENA (3) CUANDO, POR EJEMPLO, SE UTILIZA COMO COLA CONDUCTORA PARA LA APLICACION PREVISTA A LAS CONEXIONES LIBRES (4) DE LA ANTENA (3). EN LA REALIZACION PREFERIDA, LA RETIRADA DEL CHIP SE EFECTUA DE MANERA QUE SE FORME UN CORTE OBLICUO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19703990A DE19703990A1 (de) | 1997-02-03 | 1997-02-03 | Modular aufgebauter, elektronischer Datenträger |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2174422T3 true ES2174422T3 (es) | 2002-11-01 |
Family
ID=7819161
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES98908041T Expired - Lifetime ES2174422T3 (es) | 1997-02-03 | 1998-02-02 | Soporte de datos electronico, de constitucion modular. |
ES01120744T Expired - Lifetime ES2253310T3 (es) | 1997-02-03 | 1998-02-02 | Metodo para la produccion de un soporte de datos. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES01120744T Expired - Lifetime ES2253310T3 (es) | 1997-02-03 | 1998-02-02 | Metodo para la produccion de un soporte de datos. |
Country Status (7)
Country | Link |
---|---|
US (1) | US6467692B1 (es) |
EP (2) | EP0956538B1 (es) |
AT (2) | ATE217719T1 (es) |
AU (1) | AU6619198A (es) |
DE (3) | DE19703990A1 (es) |
ES (2) | ES2174422T3 (es) |
WO (1) | WO1998034194A1 (es) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3712248B2 (ja) * | 1998-01-21 | 2005-11-02 | アサ電子工業株式会社 | 卓上型キーシータ |
FR2785071B1 (fr) * | 1998-10-26 | 2002-10-25 | Gemplus Card Int | Procede de fabrication d'une carte a puce et d'un module electronique destine a etre insere dans une telle carte |
DE19939347C1 (de) * | 1999-08-19 | 2001-02-15 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
DE19940480C2 (de) * | 1999-08-26 | 2001-06-13 | Orga Kartensysteme Gmbh | Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Chipkarte mit einer Leiterbahnträgerschicht und Verfahren zur Herstellung einer Chipkarte |
DE19942931A1 (de) * | 1999-09-08 | 2001-03-22 | Giesecke & Devrient Gmbh | Verfahren zum Herstellen von Chipkarten |
FR2798873B1 (fr) * | 1999-09-28 | 2005-03-11 | Cybernetix | Procede et dispositif d'usinage d'objets integrant un element electriquement conducteur |
DE19962194A1 (de) * | 1999-12-22 | 2001-06-28 | Flexchip Ag | Verfahren zur Herstellung von kontaktierbaren Leiterschleifen für Transponder |
DE10006514C5 (de) * | 2000-02-15 | 2004-08-12 | Datacard Corp., Minnetonka | Verfahren zum Einbau von Chips in Kartenkörper |
DE10120254A1 (de) * | 2001-04-25 | 2002-11-07 | Infineon Technologies Ag | Chipkartenmodul |
DE10234751B4 (de) * | 2002-07-30 | 2007-06-28 | Sagem Orga Gmbh | Verfahren zur Herstellung einer spritzgegossenen Chipkarte und nach dem Verfahren hergestellte Chipkarte |
DE10256433A1 (de) * | 2002-12-02 | 2004-06-24 | Orga Kartensysteme Gmbh | Kontaktierung zwischen Chipmodulen und anderen in einer Chipkarte verendeten Bauteilen |
DE10257111B4 (de) | 2002-12-05 | 2005-12-22 | Mühlbauer Ag | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
FR2853434B1 (fr) * | 2003-04-03 | 2005-07-01 | Oberthur Card Syst Sa | Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication |
DE10356153B4 (de) * | 2003-12-02 | 2010-01-14 | Infineon Technologies Ag | Modul für kontaktlose Chipkarten oder Identifizierungssysteme |
JP4028863B2 (ja) * | 2004-09-10 | 2007-12-26 | 富士通株式会社 | 基板製造方法 |
FR2880160B1 (fr) * | 2004-12-28 | 2007-03-30 | K Sa As | Module electronique double face pour carte a puce hybride |
DE102005036303A1 (de) * | 2005-04-29 | 2007-08-16 | Giesecke & Devrient Gmbh | Verfahren zur Initialisierung und/oder Personalisierung eines tragbaren Datenträgers |
ES2537081T3 (es) * | 2006-06-19 | 2015-06-02 | Nagravision S.A. | Procedimiento de fabricación de tarjetas que comprenden por lo menos un módulo electrónico, conjunto que interviene en este procedimiento y producto intermedio |
JP5059854B2 (ja) * | 2006-06-19 | 2012-10-31 | ナグライデ・エス アー | 電子モジュールおよび中間製品を含むカードの製造方法 |
US7999383B2 (en) | 2006-07-21 | 2011-08-16 | Bae Systems Information And Electronic Systems Integration Inc. | High speed, high density, low power die interconnect system |
PL2132684T3 (pl) * | 2007-02-09 | 2013-03-29 | Nagravision Sa | Sposób produkcji kart elektronicznych zawierających co najmniej jeden nadrukowany wzór |
EP2034429A1 (en) * | 2007-09-05 | 2009-03-11 | Assa Abloy AB | Manufacturing method for a card and card obtained by said method |
DE102008016274A1 (de) * | 2008-03-28 | 2009-10-01 | Smartrac Ip B.V. | Chipträger für ein Transpondermodul sowie Transpondermodul |
US8837159B1 (en) | 2009-10-28 | 2014-09-16 | Amazon Technologies, Inc. | Low-profile circuit board assembly |
DE102009058435A1 (de) | 2009-12-16 | 2011-06-22 | Giesecke & Devrient GmbH, 81677 | Befestigen und elektrisch leitendes Verbinden eines Chipmoduls mit einer Chipkarte |
EP2618292A1 (en) | 2012-01-17 | 2013-07-24 | Assa Abloy Ab | Dual interface card with metallic insert connection |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
US4727246A (en) * | 1984-08-31 | 1988-02-23 | Casio Computer Co., Ltd. | IC card |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
US4790697A (en) * | 1987-05-21 | 1988-12-13 | Hines Industries, Inc. | Automatic grinder |
DE3723547C2 (de) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
FR2625000B1 (fr) * | 1987-12-22 | 1991-08-16 | Sgs Thomson Microelectronics | Structure de carte a puce |
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
US5208450A (en) * | 1988-04-20 | 1993-05-04 | Matsushita Electric Industrial Co., Ltd. | IC card and a method for the manufacture of the same |
FR2677785A1 (fr) * | 1991-06-17 | 1992-12-18 | Philips Composants | Procede de fabrication d'une carte a microcircuit. |
FR2702067B1 (fr) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Procédé et dispositif de fabrication de cartes à mémoire. |
FR2703168A1 (fr) * | 1993-03-22 | 1994-09-30 | Int Jeux | Terminal de jeux interactif multimédia. |
DE4326816A1 (de) * | 1993-08-10 | 1995-02-16 | Giesecke & Devrient Gmbh | Elektronisches Modul für Karten und Herstellung eines solchen Moduls |
JPH07117385A (ja) * | 1993-09-01 | 1995-05-09 | Toshiba Corp | 薄型icカードおよび薄型icカードの製造方法 |
DE4340249A1 (de) * | 1993-11-26 | 1995-06-01 | Schmoll Gmbh Maschinen | Vorrichtung zum Tiefenbohren von Leiterplatten o. dgl. |
DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
US5519201A (en) * | 1994-04-29 | 1996-05-21 | Us3, Inc. | Electrical interconnection for structure including electronic and/or electromagnetic devices |
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
JP3735374B2 (ja) * | 1995-08-01 | 2006-01-18 | オーストリア カード プラスティッカルテン ウント アウスヴァイスジステーム ゲゼルシャフト ミット ベシュレンクテル ハフツング | コンポネントを含むモジュールを持ち且つコイルを持つデータ担体及びその製造方法 |
DE19610507C2 (de) * | 1996-03-15 | 1997-12-04 | David Finn | Chipkarte |
CN1116655C (zh) * | 1996-08-02 | 2003-07-30 | 施伦贝格尔体系公司 | 具有两种连接方式的集成电路卡 |
-
1997
- 1997-02-03 DE DE19703990A patent/DE19703990A1/de not_active Withdrawn
-
1998
- 1998-02-02 ES ES98908041T patent/ES2174422T3/es not_active Expired - Lifetime
- 1998-02-02 ES ES01120744T patent/ES2253310T3/es not_active Expired - Lifetime
- 1998-02-02 DE DE59813280T patent/DE59813280D1/de not_active Expired - Lifetime
- 1998-02-02 DE DE59804136T patent/DE59804136D1/de not_active Expired - Lifetime
- 1998-02-02 WO PCT/EP1998/000549 patent/WO1998034194A1/de active IP Right Grant
- 1998-02-02 US US09/355,328 patent/US6467692B1/en not_active Expired - Lifetime
- 1998-02-02 AU AU66191/98A patent/AU6619198A/en not_active Abandoned
- 1998-02-02 EP EP98908041A patent/EP0956538B1/de not_active Expired - Lifetime
- 1998-02-02 AT AT98908041T patent/ATE217719T1/de active
- 1998-02-02 AT AT01120744T patent/ATE313124T1/de not_active IP Right Cessation
- 1998-02-02 EP EP01120744A patent/EP1162569B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6467692B1 (en) | 2002-10-22 |
ATE313124T1 (de) | 2005-12-15 |
ATE217719T1 (de) | 2002-06-15 |
EP1162569A2 (de) | 2001-12-12 |
DE59813280D1 (de) | 2006-01-19 |
DE19703990A1 (de) | 1998-08-06 |
AU6619198A (en) | 1998-08-25 |
EP1162569A3 (de) | 2003-11-12 |
EP1162569B1 (de) | 2005-12-14 |
WO1998034194A1 (de) | 1998-08-06 |
EP0956538B1 (de) | 2002-05-15 |
DE59804136D1 (de) | 2002-06-20 |
ES2253310T3 (es) | 2006-06-01 |
EP0956538A1 (de) | 1999-11-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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