ATE229204T1 - Verfahren zur herstellung von kontaktlosen karten - Google Patents

Verfahren zur herstellung von kontaktlosen karten

Info

Publication number
ATE229204T1
ATE229204T1 AT99939227T AT99939227T ATE229204T1 AT E229204 T1 ATE229204 T1 AT E229204T1 AT 99939227 T AT99939227 T AT 99939227T AT 99939227 T AT99939227 T AT 99939227T AT E229204 T1 ATE229204 T1 AT E229204T1
Authority
AT
Austria
Prior art keywords
antenna
contactless cards
chip
substrate
remote
Prior art date
Application number
AT99939227T
Other languages
English (en)
Inventor
Philippe Patrice
Original Assignee
Gemplus Card Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9523811&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE229204(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gemplus Card Int filed Critical Gemplus Card Int
Application granted granted Critical
Publication of ATE229204T1 publication Critical patent/ATE229204T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13144—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT99939227T 1998-03-09 1999-02-26 Verfahren zur herstellung von kontaktlosen karten ATE229204T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9802844A FR2775810B1 (fr) 1998-03-09 1998-03-09 Procede de fabrication de cartes sans contact
PCT/FR1999/000445 WO1999046728A1 (fr) 1998-03-09 1999-02-26 Procede de fabrication de cartes sans contact

Publications (1)

Publication Number Publication Date
ATE229204T1 true ATE229204T1 (de) 2002-12-15

Family

ID=9523811

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99939227T ATE229204T1 (de) 1998-03-09 1999-02-26 Verfahren zur herstellung von kontaktlosen karten

Country Status (10)

Country Link
US (3) US6957481B1 (de)
EP (1) EP1062635B1 (de)
JP (1) JP2002507032A (de)
CN (1) CN1292907A (de)
AT (1) ATE229204T1 (de)
AU (1) AU743756B2 (de)
DE (1) DE69904306T2 (de)
ES (1) ES2189461T3 (de)
FR (1) FR2775810B1 (de)
WO (1) WO1999046728A1 (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
US6046385A (en) * 1997-10-09 2000-04-04 Midwest Oilseeds, Inc. Mutant male sterile gene of soybean
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
DE19941637A1 (de) * 1999-09-01 2001-03-08 Orga Kartensysteme Gmbh Chipkarte und Verfahren zur Herstellung einer Chipkarte
WO2001026910A1 (en) * 1999-10-08 2001-04-19 Dai Nippon Printing Co., Ltd. Non-contact data carrier and ic chip
JP2001175829A (ja) * 1999-10-08 2001-06-29 Dainippon Printing Co Ltd 非接触式データキャリアおよびｉｃチップ
DE10016715C1 (de) * 2000-04-04 2001-09-06 Infineon Technologies Ag Herstellungsverfahren für laminierte Chipkarten
JP2002043716A (ja) * 2000-07-31 2002-02-08 Hitachi Chem Co Ltd 接続構造と接続方法並びにｉｃカードとその製造方法
JP4666296B2 (ja) * 2001-01-31 2011-04-06 トッパン・フォームズ株式会社 Ｉｃチップを実装したアンテナの形成方法
JP2002231759A (ja) * 2001-01-31 2002-08-16 Toppan Forms Co Ltd Ｉｃチップの実装方法
DE10114355A1 (de) * 2001-03-22 2002-10-17 Intec Holding Gmbh Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
FR2826153B1 (fr) † 2001-06-14 2004-05-28 A S K Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
DE10229168A1 (de) * 2002-06-28 2004-01-29 Infineon Technologies Ag Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht
FR2847365B1 (fr) * 2002-11-15 2005-03-11 Gemplus Card Int Connexion/raccordement simultane par un percage d'adhesif d'encartage
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
DE10329653A1 (de) * 2003-07-01 2005-02-10 Infineon Technologies Ag Chipkarte zur kontaktlosen Datenübertragung, Chipmodul zur Verwendung in der Chipkarte sowie ein Verfahren zum Herstellen einer Chipkarte zur kontaktlosen Datenübertragung
JP4479209B2 (ja) * 2003-10-10 2010-06-09 パナソニック株式会社 電子回路装置およびその製造方法並びに電子回路装置の製造装置
DE102004006457A1 (de) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
DE102004042187B4 (de) * 2004-08-31 2021-09-09 Infineon Technologies Ag Chipkartenmodul für eine kontaklose Chipkarte mit Sicherheitsmarkierung
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7452748B1 (en) 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
JP2006163450A (ja) * 2004-12-02 2006-06-22 Fujitsu Ltd Ｒｆｉｄタグおよびその製造方法
JP4669270B2 (ja) * 2004-12-02 2011-04-13 富士通株式会社 Ｒｆｉｄタグおよびその製造方法
US20090217515A1 (en) * 2004-12-03 2009-09-03 Hallys Corporation Electronic component production method and electronic component production equipment
JP4091096B2 (ja) * 2004-12-03 2008-05-28 株式会社 ハリーズ インターポーザ接合装置
DE602006016425D1 (de) 2005-04-06 2010-10-07 Hallys Corp Vorrichtung zur herstellung elektronischer komponenten
WO2006112447A1 (ja) * 2005-04-18 2006-10-26 Hallys Corporation 電子部品及び、この電子部品の製造方法
JP2007042087A (ja) * 2005-07-04 2007-02-15 Hitachi Ltd Ｒｆｉｄタグ及びその製造方法
JP2009503718A (ja) 2005-08-01 2009-01-29 パワリッド エルティーディー． Ｒｆｉｄトランスポンダにおける中間アタッチメントメカニズム及びこのメカニズムの使用
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
EP2001077A1 (de) * 2007-05-21 2008-12-10 Gemplus Verfahren zur Herstellung einer Vorrichtung, die eine Transponderantenne verbunden mit Kontaktbereichen umfasst, und so erhaltene Vorrichtung
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
EP2034429A1 (de) * 2007-09-05 2009-03-11 Assa Abloy AB Herstellungsverfahren für eine Karte und mit diesem Verfahren hergestellte Karte
US8915447B2 (en) * 2007-09-12 2014-12-23 Devicefidelity, Inc. Amplifying radio frequency signals
US9311766B2 (en) * 2007-09-12 2016-04-12 Devicefidelity, Inc. Wireless communicating radio frequency signals
US8070057B2 (en) 2007-09-12 2011-12-06 Devicefidelity, Inc. Switching between internal and external antennas
US9304555B2 (en) * 2007-09-12 2016-04-05 Devicefidelity, Inc. Magnetically coupling radio frequency antennas
US20090069049A1 (en) 2007-09-12 2009-03-12 Devicefidelity, Inc. Interfacing transaction cards with host devices
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
KR101286871B1 (ko) 2008-01-23 2013-07-16 스마트랙 아이피 비.브이. 스마트 카드의 제조
US8881373B1 (en) 2008-03-11 2014-11-11 Impinj, Inc. Assembling a radio frequency identification (RFID) tag precursor
US11288564B1 (en) 2008-03-11 2022-03-29 Impinj, Inc. High-speed RFID tag assembly using impulse heating
US9436902B1 (en) 2008-03-11 2016-09-06 Impinj, International Ltd. RFID integrated circuits with large contact pads
US8188927B1 (en) 2008-03-11 2012-05-29 Impinj, Inc. RFID tag assembly methods
CN102007644B (zh) * 2008-04-24 2013-10-16 东丽株式会社 非接触ic标签
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
CN102315509B (zh) * 2010-06-29 2015-07-15 赛恩倍吉科技顾问（深圳）有限公司 电子装置壳体及其制作方法
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
CN102821563A (zh) * 2011-06-10 2012-12-12 深圳富泰宏精密工业有限公司 电子装置壳体及其制作方法
DE102012003605A1 (de) * 2012-02-21 2013-08-22 Giesecke & Devrient Gmbh Elektronisches Modul und portabler Datenträger mit elektronischem Modul
CN104412724A (zh) * 2012-07-04 2015-03-11 松下知识产权经营株式会社 电子部件安装构造体、ic卡、cof封装
WO2015194665A1 (ja) * 2014-06-20 2015-12-23 国立研究開発法人産業技術総合研究所 歪みセンサ及びその製造方法
US10989471B2 (en) 2015-10-30 2021-04-27 Praxair Technology, Inc. Multiple pass, parallel flow downcomer tray for a mass transfer column
US10012436B2 (en) 2015-10-30 2018-07-03 Praxair Technology, Inc. Multiple pass, parallel flow downcomer tray for a mass transfer column
CN105537968B (zh) * 2016-03-07 2017-11-07 深圳市华鑫精工机械技术有限公司 一种inlay全自动生产方法
US10622700B2 (en) * 2016-05-18 2020-04-14 X-Celeprint Limited Antenna with micro-transfer-printed circuit element
FR3058545B1 (fr) * 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01129431A (ja) * 1987-11-16 1989-05-22 Sharp Corp 半導体チップ実装方式
NL8800901A (nl) * 1988-04-08 1989-11-01 Philips Nv Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.
JPH04237066A (ja) * 1991-01-21 1992-08-25 Nec Corp 配線基板の回路形成用荷電性粉末の製造方法
US5827907A (en) * 1993-08-30 1998-10-27 Ibm Corporation Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
DE4431606A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Chipkartenmodul für eine kontaktlose Chipkarte und Verfahren zu deren Herstellung
WO1996007958A1 (en) 1994-09-08 1996-03-14 Westinghouse Electric Corporation Diagnostic advisor for combustion turbine operations
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
JP4015717B2 (ja) * 1995-06-29 2007-11-28 日立マクセル株式会社 情報担体の製造方法
EP0917688B1 (de) * 1996-08-02 2000-06-28 SCHLUMBERGER Systèmes Kombinierte chipkarte
FR2752077B1 (fr) * 1996-08-02 1998-09-18 Solaic Sa Carte a circuit integre a connexion mixte et module a circuit integre correspondant
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
US6406989B1 (en) * 1997-02-21 2002-06-18 Nec Corporation Method of fabricating semiconductor device with bump electrodes
JPH11250214A (ja) * 1998-03-03 1999-09-17 Matsushita Electron Corp 部品の実装方法とｉｃカード及びその製造方法
FR2775810B1 (fr) 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
FR2778308B1 (fr) * 1998-04-30 2006-05-26 Schlumberger Systems & Service Procede de realisation d'un composant electronique et composant electronique
FR2781298B1 (fr) * 1998-07-20 2003-01-31 St Microelectronics Sa Procede de fabrication d'une carte a puce electronique et carte a puce electronique
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
FR2790849B1 (fr) * 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
TW504864B (en) * 2000-09-19 2002-10-01 Nanopierce Technologies Inc Method for assembling components and antennae in radio frequency identification devices
FR2826153B1 (fr) * 2001-06-14 2004-05-28 A S K Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact

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DE69904306T2 (de) 2003-10-16
DE69904306D1 (de) 2003-01-16
US7494068B2 (en) 2009-02-24
AU3256999A (en) 1999-09-27
FR2775810A1 (fr) 1999-09-10
ES2189461T3 (es) 2003-07-01
AU743756B2 (en) 2002-02-07
US7204427B2 (en) 2007-04-17
CN1292907A (zh) 2001-04-25
US20070187518A1 (en) 2007-08-16
US20060027668A1 (en) 2006-02-09
EP1062635B1 (de) 2002-12-04
US6957481B1 (en) 2005-10-25
EP1062635A1 (de) 2000-12-27
FR2775810B1 (fr) 2000-04-28
JP2002507032A (ja) 2002-03-05
WO1999046728A1 (fr) 1999-09-16

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