ES2189461T3 - Procedimiento de fabricacion de tarjetas sin contacto. - Google Patents

Procedimiento de fabricacion de tarjetas sin contacto.

Info

Publication number
ES2189461T3
ES2189461T3 ES99939227T ES99939227T ES2189461T3 ES 2189461 T3 ES2189461 T3 ES 2189461T3 ES 99939227 T ES99939227 T ES 99939227T ES 99939227 T ES99939227 T ES 99939227T ES 2189461 T3 ES2189461 T3 ES 2189461T3
Authority
ES
Spain
Prior art keywords
chip
antenna
contact
manufacturing
manufacturing cards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99939227T
Other languages
English (en)
Inventor
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9523811&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2189461(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Application granted granted Critical
Publication of ES2189461T3 publication Critical patent/ES2189461T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Procedimiento de fabricación de tarjeta chip sin contacto comprendiendo un chip de circuito integrado (3) y una antena (2), en el que se realizan almohadillados metalizados (5) sobre dos resaltos de contacto (4) del chip (3) caracterizado porque la conexión del chip (3), en la antena (2) se realiza por incrustación de almohadillados metalizados (5) en el espesor de la antena (2), en el momento del traslado del chip (3) sobre dicha antena (2).
ES99939227T 1998-03-09 1999-02-26 Procedimiento de fabricacion de tarjetas sin contacto. Expired - Lifetime ES2189461T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9802844A FR2775810B1 (fr) 1998-03-09 1998-03-09 Procede de fabrication de cartes sans contact

Publications (1)

Publication Number Publication Date
ES2189461T3 true ES2189461T3 (es) 2003-07-01

Family

ID=9523811

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99939227T Expired - Lifetime ES2189461T3 (es) 1998-03-09 1999-02-26 Procedimiento de fabricacion de tarjetas sin contacto.

Country Status (10)

Country Link
US (3) US6957481B1 (es)
EP (1) EP1062635B1 (es)
JP (1) JP2002507032A (es)
CN (1) CN1292907A (es)
AT (1) ATE229204T1 (es)
AU (1) AU743756B2 (es)
DE (1) DE69904306T2 (es)
ES (1) ES2189461T3 (es)
FR (1) FR2775810B1 (es)
WO (1) WO1999046728A1 (es)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
US6046385A (en) * 1997-10-09 2000-04-04 Midwest Oilseeds, Inc. Mutant male sterile gene of soybean
WO2009093248A1 (en) 2008-01-23 2009-07-30 On Track Innovations Ltd. Manufacture of a smart card
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
DE19941637A1 (de) * 1999-09-01 2001-03-08 Orga Kartensysteme Gmbh Chipkarte und Verfahren zur Herstellung einer Chipkarte
WO2001026910A1 (fr) * 1999-10-08 2001-04-19 Dai Nippon Printing Co., Ltd. Support de donnees et puce de circuit integre sans contact
JP2001175829A (ja) * 1999-10-08 2001-06-29 Dainippon Printing Co Ltd 非接触式データキャリアおよびｉｃチップ
DE10016715C1 (de) * 2000-04-04 2001-09-06 Infineon Technologies Ag Herstellungsverfahren für laminierte Chipkarten
JP2002043716A (ja) * 2000-07-31 2002-02-08 Hitachi Chem Co Ltd 接続構造と接続方法並びにｉｃカードとその製造方法
JP2002231759A (ja) * 2001-01-31 2002-08-16 Toppan Forms Co Ltd Ｉｃチップの実装方法
JP4666296B2 (ja) * 2001-01-31 2011-04-06 トッパン・フォームズ株式会社 Ｉｃチップを実装したアンテナの形成方法
DE10114355A1 (de) * 2001-03-22 2002-10-17 Intec Holding Gmbh Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
FR2826153B1 (fr) † 2001-06-14 2004-05-28 A S K Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
DE10229168A1 (de) * 2002-06-28 2004-01-29 Infineon Technologies Ag Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht
FR2847365B1 (fr) * 2002-11-15 2005-03-11 Gemplus Card Int Connexion/raccordement simultane par un percage d'adhesif d'encartage
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
DE10329653A1 (de) * 2003-07-01 2005-02-10 Infineon Technologies Ag Chipkarte zur kontaktlosen Datenübertragung, Chipmodul zur Verwendung in der Chipkarte sowie ein Verfahren zum Herstellen einer Chipkarte zur kontaktlosen Datenübertragung
JP4479209B2 (ja) * 2003-10-10 2010-06-09 パナソニック株式会社 電子回路装置およびその製造方法並びに電子回路装置の製造装置
DE102004006457A1 (de) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
DE102004042187B4 (de) * 2004-08-31 2021-09-09 Infineon Technologies Ag Chipkartenmodul für eine kontaklose Chipkarte mit Sicherheitsmarkierung
US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7452748B1 (en) 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
JP2006163450A (ja) * 2004-12-02 2006-06-22 Fujitsu Ltd Ｒｆｉｄタグおよびその製造方法
JP4669270B2 (ja) * 2004-12-02 2011-04-13 富士通株式会社 Ｒｆｉｄタグおよびその製造方法
US20090217515A1 (en) * 2004-12-03 2009-09-03 Hallys Corporation Electronic component production method and electronic component production equipment
ATE488985T1 (de) * 2004-12-03 2010-12-15 Hallys Corp Zwischenglied-bondierungseinrichtung
EP1876877B1 (en) 2005-04-06 2010-08-25 Hallys Corporation Electronic component manufacturing apparatus
CN101160597A (zh) * 2005-04-18 2008-04-09 哈里斯股份有限公司 电子零件及该电子零件的制造方法
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
JP2007042087A (ja) * 2005-07-04 2007-02-15 Hitachi Ltd Ｒｆｉｄタグ及びその製造方法
CA2618036A1 (en) 2005-08-01 2007-02-08 Powerid Ltd. Intermediate attachment mechanism and use thereof in rfid transponder
HK1109708A2 (zh) * 2007-04-24 2008-06-13 On Track Innovations Ltd. 介面卡及仪器以及其形成工艺
EP2001077A1 (fr) * 2007-05-21 2008-12-10 Gemplus Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
EP2034429A1 (en) * 2007-09-05 2009-03-11 Assa Abloy AB Manufacturing method for a card and card obtained by said method
US8341083B1 (en) * 2007-09-12 2012-12-25 Devicefidelity, Inc. Wirelessly executing financial transactions
US9304555B2 (en) * 2007-09-12 2016-04-05 Devicefidelity, Inc. Magnetically coupling radio frequency antennas
US8915447B2 (en) * 2007-09-12 2014-12-23 Devicefidelity, Inc. Amplifying radio frequency signals
US9311766B2 (en) * 2007-09-12 2016-04-12 Devicefidelity, Inc. Wireless communicating radio frequency signals
US8070057B2 (en) 2007-09-12 2011-12-06 Devicefidelity, Inc. Switching between internal and external antennas
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US11288564B1 (en) 2008-03-11 2022-03-29 Impinj, Inc. High-speed RFID tag assembly using impulse heating
US9436902B1 (en) 2008-03-11 2016-09-06 Impinj, International Ltd. RFID integrated circuits with large contact pads
US8881373B1 (en) 2008-03-11 2014-11-11 Impinj, Inc. Assembling a radio frequency identification (RFID) tag precursor
US8188927B1 (en) 2008-03-11 2012-05-29 Impinj, Inc. RFID tag assembly methods
US8308072B2 (en) * 2008-04-24 2012-11-13 Toray Industries, Inc. Non-contact IC tag
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
CN102315509B (zh) * 2010-06-29 2015-07-15 赛恩倍吉科技顾问（深圳）有限公司 电子装置壳体及其制作方法
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
CN102821563A (zh) * 2011-06-10 2012-12-12 深圳富泰宏精密工业有限公司 电子装置壳体及其制作方法
DE102012003605A1 (de) * 2012-02-21 2013-08-22 Giesecke & Devrient Gmbh Elektronisches Modul und portabler Datenträger mit elektronischem Modul
WO2014006787A1 (ja) * 2012-07-04 2014-01-09 パナソニック株式会社 電子部品実装構造体、ｉｃカード、ｃｏｆパッケージ
WO2015194665A1 (ja) * 2014-06-20 2015-12-23 国立研究開発法人産業技術総合研究所 歪みセンサ及びその製造方法
US10012436B2 (en) 2015-10-30 2018-07-03 Praxair Technology, Inc. Multiple pass, parallel flow downcomer tray for a mass transfer column
US10989471B2 (en) 2015-10-30 2021-04-27 Praxair Technology, Inc. Multiple pass, parallel flow downcomer tray for a mass transfer column
CN105537968B (zh) * 2016-03-07 2017-11-07 深圳市华鑫精工机械技术有限公司 一种inlay全自动生产方法
US10622700B2 (en) * 2016-05-18 2020-04-14 X-Celeprint Limited Antenna with micro-transfer-printed circuit element
FR3058545B1 (fr) * 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce
EP3688668B8 (en) * 2017-09-29 2022-08-24 Avery Dennison Retail Information Services LLC Strap mounting techniques for wire format antennas

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01129431A (ja) * 1987-11-16 1989-05-22 Sharp Corp 半導体チップ実装方式
NL8800901A (nl) * 1988-04-08 1989-11-01 Philips Nv Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.
JPH04237066A (ja) * 1991-01-21 1992-08-25 Nec Corp 配線基板の回路形成用荷電性粉末の製造方法
US5827907A (en) * 1993-08-30 1998-10-27 Ibm Corporation Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
DE4431606A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Chipkartenmodul für eine kontaktlose Chipkarte und Verfahren zu deren Herstellung
WO1996007958A1 (en) 1994-09-08 1996-03-14 Westinghouse Electric Corporation Diagnostic advisor for combustion turbine operations
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
JP4015717B2 (ja) * 1995-06-29 2007-11-28 日立マクセル株式会社 情報担体の製造方法
ATE194242T1 (de) * 1996-08-02 2000-07-15 Schlumberger Systems & Service Kombinierte chipkarte
FR2752077B1 (fr) * 1996-08-02 1998-09-18 Solaic Sa Carte a circuit integre a connexion mixte et module a circuit integre correspondant
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
US6406989B1 (en) * 1997-02-21 2002-06-18 Nec Corporation Method of fabricating semiconductor device with bump electrodes
JPH11250214A (ja) * 1998-03-03 1999-09-17 Matsushita Electron Corp 部品の実装方法とｉｃカード及びその製造方法
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
FR2778308B1 (fr) * 1998-04-30 2006-05-26 Schlumberger Systems & Service Procede de realisation d'un composant electronique et composant electronique
FR2781298B1 (fr) * 1998-07-20 2003-01-31 St Microelectronics Sa Procede de fabrication d'une carte a puce electronique et carte a puce electronique
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
FR2790849B1 (fr) * 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
AU2001293304A1 (en) * 2000-09-19 2002-04-02 Nanopierce Technologies, Inc. Method for assembling components and antennae in radio frequency identification devices
FR2826153B1 (fr) * 2001-06-14 2004-05-28 A S K Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact

Also Published As

Publication number Publication date
ATE229204T1 (de) 2002-12-15
EP1062635A1 (fr) 2000-12-27
FR2775810A1 (fr) 1999-09-10
EP1062635B1 (fr) 2002-12-04
JP2002507032A (ja) 2002-03-05
AU3256999A (en) 1999-09-27
US7204427B2 (en) 2007-04-17
AU743756B2 (en) 2002-02-07
US6957481B1 (en) 2005-10-25
DE69904306T2 (de) 2003-10-16
US7494068B2 (en) 2009-02-24
WO1999046728A1 (fr) 1999-09-16
DE69904306D1 (de) 2003-01-16
FR2775810B1 (fr) 2000-04-28
US20060027668A1 (en) 2006-02-09
US20070187518A1 (en) 2007-08-16
CN1292907A (zh) 2001-04-25

Similar Documents

Publication Publication Date Title
ES2189461T3 (es) Procedimiento de fabricacion de tarjetas sin contacto.
FR2769389B1 (fr) Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
FR2743649B1 (fr) Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
ES2180142T3 (es) Procedimiento de transaccion con un elemento de identificacion portatil.
DK1399880T3 (da) Kontaktlöst chipkort med en antennebærer og en chipbærer i fibröst materiale
ES2125650T3 (es) Procedimiento para la fabricacion de un modulo de tarjetas de chip para tarjetas de chip sin contacto.
FR2617666B1 (fr) Carte a microcircuits electroniques et son procede de fabrication
ES2160674T3 (es) Un lector de tarjetas.
IL147980A0 (en) Contact-free portable object comprising one or several contact-free peripheral devices
FR2840711B1 (fr) Carte de circuit integre et procede de fabrication de celle-ci
DE59600634D1 (de) Kontaktlose chipkarte
FR2812427B1 (fr) Etiquette electronique sans contact pour objet tridimensionnel
BR9711161A (pt) Módulo de cartão de chip, cartão de chip combinado contendo esse módulo e processo para a sua fabricação.
FR2760113B1 (fr) Procede de fabrication de carte sans contact a antenne bobinee
FR2882174B1 (fr) Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
EP1258831A3 (en) IC Card and Electronic Devices having contact and non-contact interface
DE69919008D1 (de) Kontaktlose chipkarte mit hemmungsmitteln
DE50015305D1 (de) Chipkarte mit Sollbiegestellen
DE50005482D1 (de) Chipmodul zum Einbau in einen Chipkartenträger
ES2120229T3 (es) Disposicion de soporte para su integracion en una tarjeta de chip sin contacto.
DE59914917D1 (de) Chipkarte mit integrierter Schaltung
DE50100437D1 (de) Zugangskontrolleinrichtung
EP1054346A3 (en) Non-contact chip card comprising a pair of covering sheets
DE50010291D1 (de) Chipkarte
FR2653620B1 (fr) Carte a circuit integre sans contact.