CN102315509B - 电子装置壳体及其制作方法 - Google Patents
电子装置壳体及其制作方法 Download PDFInfo
- Publication number
- CN102315509B CN102315509B CN201010212561.XA CN201010212561A CN102315509B CN 102315509 B CN102315509 B CN 102315509B CN 201010212561 A CN201010212561 A CN 201010212561A CN 102315509 B CN102315509 B CN 102315509B
- Authority
- CN
- China
- Prior art keywords
- electronic device
- case
- conductive
- antenna stack
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229920003023 plastic Polymers 0.000 claims abstract description 33
- 239000004033 plastic Substances 0.000 claims abstract description 33
- 239000012766 organic filler Substances 0.000 claims abstract description 16
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 14
- 239000002131 composite material Substances 0.000 claims abstract description 9
- 238000002347 injection Methods 0.000 claims description 26
- 239000007924 injection Substances 0.000 claims description 26
- 239000004020 conductor Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- -1 polybutylene terephthalate Polymers 0.000 claims description 13
- 239000004416 thermosoftening plastic Substances 0.000 claims description 13
- 239000011370 conductive nanoparticle Substances 0.000 claims description 12
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 125000005624 silicic acid group Chemical group 0.000 claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002041 carbon nanotube Substances 0.000 claims description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 6
- 239000011135 tin Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000008187 granular material Substances 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 239000002082 metal nanoparticle Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052711 selenium Inorganic materials 0.000 claims description 4
- 239000011669 selenium Substances 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000002134 carbon nanofiber Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 239000002861 polymer material Substances 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- 239000004952 Polyamide Substances 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 8
- 229920002647 polyamide Polymers 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 239000004926 polymethyl methacrylate Substances 0.000 description 8
- 229920001155 polypropylene Polymers 0.000 description 8
- 229910000019 calcium carbonate Inorganic materials 0.000 description 5
- 235000010216 calcium carbonate Nutrition 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000002991 molded plastic Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Telephone Set Structure (AREA)
- Support Of Aerials (AREA)
- Details Of Aerials (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010212561.XA CN102315509B (zh) | 2010-06-29 | 2010-06-29 | 电子装置壳体及其制作方法 |
US12/967,151 US8884826B2 (en) | 2010-06-29 | 2010-12-14 | Housing of portable electronic device and method for making the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010212561.XA CN102315509B (zh) | 2010-06-29 | 2010-06-29 | 电子装置壳体及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102315509A CN102315509A (zh) | 2012-01-11 |
CN102315509B true CN102315509B (zh) | 2015-07-15 |
Family
ID=45352038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010212561.XA Expired - Fee Related CN102315509B (zh) | 2010-06-29 | 2010-06-29 | 电子装置壳体及其制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8884826B2 (zh) |
CN (1) | CN102315509B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102723574A (zh) * | 2011-03-31 | 2012-10-10 | 深圳富泰宏精密工业有限公司 | 内置天线的壳体组件及应用其的电子装置 |
US9692475B2 (en) | 2011-07-07 | 2017-06-27 | Classic Promotions Pty Ltd. | Attachment for an electronic communications device |
AU2011203352B1 (en) * | 2011-07-07 | 2012-06-21 | Classic Promotions Pty Ltd | Silicon case |
CN104685705B (zh) * | 2012-05-01 | 2017-06-13 | 纳米通股份有限公司 | 射频(rf)传导媒介 |
CN102858111B (zh) * | 2012-09-24 | 2015-04-29 | 上海蓝沛新材料科技股份有限公司 | 一种新型具有天线功能的电子壳体及其制作方法 |
CN104795631A (zh) * | 2014-01-22 | 2015-07-22 | 深圳富泰宏精密工业有限公司 | 壳体,该壳体的制作方法及应用该壳体的电子装置 |
KR101762778B1 (ko) | 2014-03-04 | 2017-07-28 | 엘지이노텍 주식회사 | 무선 충전 및 통신 기판 그리고 무선 충전 및 통신 장치 |
US20170169490A1 (en) * | 2015-04-22 | 2017-06-15 | Martin J. Bonacci | Automated Personalized Product Specification |
US10148000B2 (en) | 2015-09-04 | 2018-12-04 | Apple Inc. | Coupling structures for electronic device housings |
WO2017059116A1 (en) * | 2015-09-30 | 2017-04-06 | Apple Inc. | Multi-part electronic device housing having contiguous filled surface |
US10158164B2 (en) * | 2015-10-30 | 2018-12-18 | Essential Products, Inc. | Handheld mobile device with hidden antenna formed of metal injection molded substrate |
US10372166B2 (en) | 2016-07-15 | 2019-08-06 | Apple Inc. | Coupling structures for electronic device housings |
CN110066392B (zh) | 2018-01-23 | 2021-10-08 | 高新特殊工程塑料全球技术有限公司 | 封端的聚(亚芳基醚)共聚物,其制备方法,以及由其制备的可固化组合物和固化组合物 |
KR102242930B1 (ko) * | 2019-08-22 | 2021-04-21 | 주식회사 만도 | 레이더 장치 마운팅 어셈블리 |
US11632448B2 (en) | 2019-12-03 | 2023-04-18 | Apple Inc. | Handheld electronic device |
US11784673B2 (en) | 2020-09-16 | 2023-10-10 | Apple Inc. | Electronic device housing having a radio-frequency transmissive component |
US11769940B2 (en) | 2021-09-09 | 2023-09-26 | Apple Inc. | Electronic device housing with integrated antenna |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1917282A (zh) * | 2005-08-18 | 2007-02-21 | 三星电机株式会社 | 无线通信终端的内置天线模块 |
CN101161726A (zh) * | 2007-09-28 | 2008-04-16 | 深圳市科聚新材料有限公司 | 高导电聚苯硫醚复合材料及其制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2775810B1 (fr) * | 1998-03-09 | 2000-04-28 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
US7804450B2 (en) * | 2007-07-20 | 2010-09-28 | Laird Technologies, Inc. | Hybrid antenna structure |
TW200921986A (en) * | 2007-11-02 | 2009-05-16 | Delta Electronics Inc | Wireless communication device |
US8497812B2 (en) * | 2009-01-30 | 2013-07-30 | Raytheon Company | Composite radome and radiator structure |
CN202276561U (zh) * | 2011-06-17 | 2012-06-13 | 深圳富泰宏精密工业有限公司 | 电子装置壳体 |
US9153856B2 (en) * | 2011-09-23 | 2015-10-06 | Apple Inc. | Embedded antenna structures |
-
2010
- 2010-06-29 CN CN201010212561.XA patent/CN102315509B/zh not_active Expired - Fee Related
- 2010-12-14 US US12/967,151 patent/US8884826B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1917282A (zh) * | 2005-08-18 | 2007-02-21 | 三星电机株式会社 | 无线通信终端的内置天线模块 |
CN101161726A (zh) * | 2007-09-28 | 2008-04-16 | 深圳市科聚新材料有限公司 | 高导电聚苯硫醚复合材料及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US8884826B2 (en) | 2014-11-11 |
US20110316753A1 (en) | 2011-12-29 |
CN102315509A (zh) | 2012-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SCIENBIZIP CONSULTING (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. Effective date: 20150427 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150427 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd. Address before: 518109 F3 building, Foxconn science and Technology Industrial Park, Longhua Town, Shenzhen, Guangdong, A, China Applicant before: Shenzhen Futaihong Precision Industry Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170612 Address after: Shaojiao village Nansha District Lanhe town Guangzhou City, Guangdong province Shaxinglu 511458 No. 2 (workshop) A102 Patentee after: GUANGZHOU HANSHENG AUTO PARTS INDUSTRY CO.,LTD. Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Patentee before: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 |