TW201203689A - Hosing for electronic device and method for making same - Google Patents

Abstract

The present invention discloses a housing for electronic device and method for making the housing. The housing includes a base, an antenna, and a shielding layer. The antenna is formed on the base by injection molding and is covered by the shielding layer. The antenna is made of conductive plastic. The conductive plastic consists of by weight of 35-45% thermal plastics, by weight of 12-18% organic fillers, and by weight of 43-47% nano-conductive nuclei. The antenna is covered and protected by the shielding layer, thus, the housing can be used for a long period.

Description

201203689 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to an electronic device housing, and more particularly to an electronic device housing with an integrated antenna and a method of fabricating the same. [0002] [Prior Art] With the development of technologies such as mobile communication and Bluetooth, the implementation of such application electronic devices has more and more functions, but the volume of such electronic devices is moving toward a light and thin direction. How to simplify the built-in component structure in these electronic devices and reduce the volume of these built-in components plays an important role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. The antenna is an important component of a signal transmission and reception in an electronic device, and its structure simplification and volume reduction play an important role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. [0003] A conventional electronic device includes a body, an antenna radiator, and a housing. The antenna radiator is fixed to the body by adhesive bonding. The housing is fixed to the body by a snap fit and covers the antenna radiator. 0004 [0004] However, the electronic device is formed by the above method, and the antenna radiator is fixed on the body by the adhesive method, and the antenna is easily degummed and separated from the body, thereby affecting the service life of the electronic device. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an electronic device housing having an integrated antenna having a long service life. In addition, it is also necessary to provide a method of fabricating an electronic device housing of the above integrated antenna. 099122255 Form No. A0101 Page 3 of 14 0992039195-0 201203689 [0007] An electronic device housing includes a base layer, an antenna layer and a cover layer; the antenna layer is injection molded on the base layer by conductive plastic The cover layer covers the antenna layer; the conductive plastic is composed of a composite polymer material formed by weight percentage of 35-45% thermoplastic plastic, 12-18% organic filler and 43-47% nano conductive particles. [0008] An electronic device housing includes a base layer, an antenna layer, and a cover layer: the antenna layer is injection molded on the cover layer by a conductive plastic, the base layer at least partially covering the antenna layer; and the conductive plastic resistor The ratio is 1. 5-10x1 (Γ8 ohm·m, the conductive plastic weight percentage is 35-45% thermoplastic plastic, 12-18% organic filler and 43-47% nano conductive particles formed of composite polymer material. [0009] A method for fabricating an electronic device housing, comprising the steps of: [0010] two-shot injection molding to form a base layer and an antenna layer of an electronic device housing, the antenna layer being connected to the base layer by injection molding of conductive plastic; The conductive plastic is composed of a composite polymer material formed by weight percentage of 35-45% thermoplastic plastic, 12-18% organic filler and 43-47% nanometer conductive particles. [0011] Injection molding to form a cover of the electronic device casing a layer, the cover layer is connected to the base layer and covers the antenna layer. [0012] Compared with the prior art, the manufacturing method of the electronic device casing of the present invention is two-shot injection molding, and the antenna layer is formed on the substrate. Then, the antenna layer is covered by the cover layer, which is covered by the cover layer, is not easy to be separated, and has a long service life. [Embodiment] 099122255 Form No. A0101 Page 4 / 14 Page 0992039195-0 201203689 [0013] [0014 ]

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Referring to FIG. 1 and FIG. 2, the electronic device housing 10 of the first preferred embodiment of the present invention includes a base layer 11, an antenna layer 13, a cover layer 15, and a conductive member 17. The antenna layer 13 is formed on the base layer 11 by injection molding of a conductive plastic, and the cover layer 15 is bonded to the base layer 11 and partially or entirely covers the antenna layer 13. The conductive member 17 is insert-molded on the base layer 11 and electrically connected to the antenna layer 13 to form an antenna feed end and a ground end. The base layer 11 is formed by injection molding, and the conductive member 17 is embedded therein. The plastic of the injection molded base layer 11 may be selected from the group consisting of polypropylene (poly), polyamide (polyamide), polycarbonate (PC), polyethylene terephthalate (PET), and polymethyl methacrylate ( Any of PMMA). The base layer 11 can be directly formed into the shape of the electronic device housing 10 and occupy about one-third to three-fifth of the thickness of the electronic device housing 10; or can be molded into the electronic device housing 10 -section. The antenna layer 13 is formed by injection molding a conductive material and molding it in a predetermined shape. The conductive material is preferably a conductive plastic having a resistivity of 1. 5-10x1 (Γ8 ohm·meter. The conductive plastic is 35-45% by weight of thermoplastic plastic, 12-18% organic filler and 43- The composite polymer material formed by 47% nanometer conductive particles may be polybutylene terephthalate (PBT) or polyimine (PI). The organic filler may be ruthenium. An acid and/or a citric acid derivative. The antenna layer 13 is formed at a position to ensure that the conductive member 17 protrudes or is flush with the surface of the antenna layer 13. The nano conductive particles may be metal nanoparticles, the metal including copper, Gold, silver, turn, record, sharp 'Ming, Ming, tin, antimony, indium, gallium>, antimony, sodium-containing alkali metal and combinations thereof, and its solid particle size is less than or 099122255 Form No. A0101 Page 5 / A total of 14 pages 0992039195-0 [0016] 201203689 equals 75 nm. The material can also be electrically conductive nanocarbon carbonate. The material of about 4 is based on the nano-carbonate, and the pH is in the condition of pH 6. The chemical co-precipitation method is formed on the surface of nanocarbonate coated with tin dioxide. Miscellaneous - a conductive (four) precursor, the weight ratio of each component is CaC03:Sn:Sb = 55-90:9-4 (Ml〇; the conductive powder precursor is calcined at 3G0t-8GG °C The conductive nanocarbon carbonic acid feed is obtained. The hexagonal conductive particles can also be a carbon nanotube, the carbon nanotube having a diameter of 2 〇 to 40 nm and a length of 2 〇〇 5 〇〇〇 nanometer. The nano conductive particles may also be 2 〇 - 4 〇 nanometer carbon fiber, nano graphite fiber nano metal fiber. . . .

[0019] The covering layer 15 is formed by injection molding. The injection molding cover layer π can be selected from the group consisting of polypropylene (pp), polyamine (pA), polycarbonate (PC), polyethylene terephthalate (pET) and polymethyl methacrylate. Any of (PMMA). The cover layer 15 covers the antenna layer 13 to finally form the shape of the electronic device housing 10. The cover layer 15 completely covers the antenna layer 13', i.e., the cover layer 15 and the base layer 11 enclose the antenna 13 therein. The antenna layer 13 is electrically connected to the circuit board or electronic device through the conductive member 17. The method of fabricating the electronic device housing 10 of the first preferred embodiment of the present invention includes the following steps: two-shot injection molding to form the base layer 11 and the antenna layer 13 of the electronic device housing 10. First, a first injection mold is provided, the first injection mold having a primary molding cavity and a secondary molding cavity in communication with the primary molding cavity. 099122255 Form No. A0101 Page 6 of 14 0992039195-0 201203689 [0020] [0024] [0024] [0024] [0024] Injection molding of plastic into the primary molding cavity to form an electronic device housing 1 The base layer is flawed. The plastic injection molded base layer may be selected from the group consisting of polypropylene (polyamide), polyamide (polyamide), polycarbonate (PC), polyethylene terephthalate (PET), and polymethyl methacrylate. Any of (PMMA). The electric resistivity of the conductive plastic is 1. 5-10 χ 10_8 ohm. meters. The conductive plastic is a composite polymer material formed by weighting 35-45% thermoplastic plastic, 12-18% organic filler and 43-47% nano conductive particles. The thermoplastic plastic may be polybutylene terephthalate (PBT) or polyimine (PI). The organic filler may be a citric acid and/or a citric acid derivative. The antenna layer 13 is formed at a position to ensure that the guiding member 17 protrudes or is flush with the surface of the antenna layer 13, and the nano conductive particles are metal nanoparticles, and the metal includes copper, gold, silver, molybdenum, nickel, Bismuth, aluminum, platinum, tin, titanium, indium, gallium, selenium, sodium-containing alkali metals, and combinations thereof, and having a solid particle size of less than or equal to 75 nm or other nanowires described above in an electronic device housing Particles. A second injection mold is provided, and the second injection mold has a cavity. Positioning the base layer 形成 formed with the antenna layer 丨3 into the cavity of the second injection mold, and molding the plastic into the cavity to form the cover layer 15 of the electronic device casing. The cover layer 15 completely shields the antenna layer. 13. The plastic of the covering layer 15 can be selected from the group consisting of polypropylene (pp), polyamidoamine (pA), polycarbonate (PC), polyethylene terephthalate (PET) and polymethyl methacrylate. Any of (PMMA). In conjunction with the reference M3, in the second preferred embodiment of the present invention, the electronic 099122255 form number A0101 苐 7 pages / total 14 pages 0992039195-0 201203689 The antenna layer 13 of the device housing 10 includes a pin 131, the pin The 131 extends through the base layer 11 and serves as an antenna feed/ground for electrical connection to a circuit board or electronic device. [0025] When the electronic device housing 10 is fabricated, it is only necessary to reserve a passage in the process of forming the base layer 11. When the antenna layer 13 is formed, the conductive plastic fills the reserved passage to form the lead 131. It will be understood that the above injection molding can be carried out using a multi-shot mold, thereby further improving production efficiency. [0027] It can be understood that if the cover layer 15 is formed first, and then the antenna layer 13 is injection molded on the cover layer 15 and finally molded to form the base layer 11, the base layer 11 may not completely cover the antenna layer 13, that is, the The antenna layer 13 is partially exposed to be electrically connected directly to an external circuit, and accordingly, the conductive member 17 can be omitted. [0028] The manufacturing method of the electronic device housing 10 of the present invention is suitable for production of a product housing such as a wireless communication product or a notebook computer. [0029] The manufacturing method of the electronic device casing of the present invention is formed by double-shot injection molding, and the antenna layer is formed on the base layer, and the antenna layer can be formed into a predetermined shape in an injection molding process as needed, which can be a two-dimensional antenna or a three-dimensional The antenna improves the designer's degree of freedom; the antenna layer is covered by the cover layer, is not easy to separate, and has a long service life; using a nano material, the antenna is small in size, which is advantageous for miniaturization of the electronic device. [0030] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art are 099122255, Form No. A0101, Page 8 / Total 14 Page 0992039195-0 201203689 Equivalent modifications or variations made in accordance with the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0039] FIG. 1 is an electronic device housing according to a first preferred embodiment of the present invention. [0039] FIG. 2 is a cross-sectional view of the electronic device housing of FIG. 1; FIG. 3 is a cross-sectional view of the electronic device housing according to a second preferred embodiment of the present invention. [Main component symbol description] Electronic device housing: 10 base layer :11 Antenna layer: 13 pins: 131 Cover: 15

Conductive parts: 17

099122255 Form number Α0101 Page 9 of 14 0992039195-0

Claims (1)

201203689 VII. Patent application scope: An electronic device housing comprising: a base layer, wherein the electronic device housing further comprises an antenna layer and a covering layer; the antenna layer is formed by injection molding conductive plastic The cover layer covers the antenna layer on the base layer; the conductive plastic is composed of a composite polymer material formed by weight percentage of 35_thermoplastic, 12-18% organic filler and 43_47% nano conductive particles. The electronic device housing of claim 1, wherein the electronic device housing comprises at least a conductive member, the conductive member being electrically connected at one end and the other end through the base layer. 3. The electronic device housing according to the patent application, wherein the nano conductive particles are metal nano-seal or metal-filled metal, including copper, gold, silver, molybdenum, nickel, niobium, One of aluminum, platinum, tin, titanium, indium, marry, field or any combination thereof, and the size of the metal nanoparticles or nano-particles containing nanoparticles is less than or budd at 75 nm. 4. The electric device of claim 2, wherein the nano conductive particles are carbon nanotubes, and the carbon nanotubes have a diameter of 2〇_4〇N 2 and a length of 200-5000. Nano. The electronic device housing according to claim 1, wherein the nano conductive particles are nano carbon fibers, nano graphite fibers, and nano metal fibers having a size of 20-40 nm. An electronic device housing comprising: a base layer _ an antenna layer and a cover layer; the antenna layer is formed on the cover layer by injection molding, the base layer at least partially covering the antenna layer; the conductive plastic resistivity 15_1〇= 10_8 ohm.m, the conductive plastic weight is 100 μm, the white knife ratio is 35-45% thermoplastic 099122255 Form No. 1010101 Page 1 / Total 14 Page 0992039195-0 201203689 Glue, 12-18% organic The filler is composed of a composite polymer material formed of 43-47% of nano conductive particles. 7. A method of fabricating an electronic device housing, comprising the steps of: bijective injection molding to form a base layer and an antenna layer of an electronic device housing, the antenna layer being connected to a base layer by injection molding of a conductive plastic; the conductive plastic It is composed of a composite polymer material formed by weight percentage of 35-45% thermoplastic plastic, 12-18% organic filler and 43-47% nanometer conductive particles; injection molding to form a covering layer of an electronic device casing, the covering layer It is connected to the base layer and covers the antenna layer. 8. The method of manufacturing the electronic device casing according to claim 7, wherein the nano conductive particles are metal nanoparticles or sodium alkali metal nanoparticles, and the metal comprises copper, gold, silver. , one of molybdenum, nickel, ruthenium, aluminum, platinum, tin, titanium, indium, gallium, selenium or any combination thereof, and the size of the metal nanoparticle or sodium alkali metal nanoparticle is less than or equal to 75 Meter. 9. The method of manufacturing the electronic device casing according to claim 7, wherein the nano conductive particles are carbon nanotubes, the carbon nanotubes having a diameter of 20-40 nm and a length of 200-5000 nanometers. Meter. 10. The method of manufacturing an electronic device casing according to claim 7, wherein the nano conductive particles are nano carbon fibers, nano graphite fibers, and nano metal fibers having a size of 20-40 nm. 099122255 Form number A0101 Page 11 of 14 0992039195-0