CN108605425A - Electromagnetic shielding film - Google Patents
Electromagnetic shielding film Download PDFInfo
- Publication number
- CN108605425A CN108605425A CN201780010708.7A CN201780010708A CN108605425A CN 108605425 A CN108605425 A CN 108605425A CN 201780010708 A CN201780010708 A CN 201780010708A CN 108605425 A CN108605425 A CN 108605425A
- Authority
- CN
- China
- Prior art keywords
- protective layer
- insulating protective
- layer
- electromagnetic shielding
- shielding film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- -1 acryloxy Chemical group 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
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- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
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- 239000007787 solid Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 101000661807 Homo sapiens Suppressor of tumorigenicity 14 protein Proteins 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical class CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000003273 ketjen black Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920005673 polypropylene based resin Polymers 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
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- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920000914 Metallic fiber Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- VQLYBLABXAHUDN-UHFFFAOYSA-N bis(4-fluorophenyl)-methyl-(1,2,4-triazol-1-ylmethyl)silane;methyl n-(1h-benzimidazol-2-yl)carbamate Chemical compound C1=CC=C2NC(NC(=O)OC)=NC2=C1.C=1C=C(F)C=CC=1[Si](C=1C=CC(F)=CC=1)(C)CN1C=NC=N1 VQLYBLABXAHUDN-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000012241 calcium silicate Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- YARNEMCKJLFQHG-UHFFFAOYSA-N prop-1-ene;styrene Chemical compound CC=C.C=CC1=CC=CC=C1 YARNEMCKJLFQHG-UHFFFAOYSA-N 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229940117958 vinyl acetate Drugs 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Electromagnetic shielding film contains insulating protective layer 110 and shielded layer 120.The arithmetic average gradient on the surface of insulating protective layer 110 is 30 ° or more.
Description
Technical field
The present invention relates to a kind of electromagnetic shielding films.
Background technology
In recent years smart mobile phone, flat type information terminal etc. to the performance requirement of High Speed Transfer Large Volume Data increasingly
It is high.And in order to which High Speed Transfer Large Volume Data just needs to use high-frequency signal.But using if high-frequency signal, it is set to printed wiring
The signal line of plate will produce electromagnetic wave noise, be easy to cause surrounding machine run-time error.Therefore, this operation is wrong in order to prevent
Accidentally, make shielding printed wiring board not critically important by electromagnetic wave influence.
In order to shield printed wiring board, someone expects having the electromagnetic shielding film of insulating layer and shielded layer to be attached at print
The method of wiring board processed（Referring for example to patent document 1.）.
In addition, for unexposed line figure, someone expects the electromagnetic shielding film of insulating protective layer painted black（Example
As with reference to patent document 2.）.
Furthermore in order to improve the resolution for the white print content for being printed in electromagnetic wave shielding film surface, someone expects
Adjust the tone of the insulating protective layer of electromagnetic shielding film（Referring for example to patent document 3.）.
Citation
Patent document
Patent document 1:Special open（Japanese Patent Publication）2004-095566 bulletins；
Patent document 2:Special open（Japanese Patent Publication）2014-078574 bulletins；
Patent document 3:No. 5796690 bulletin of patent.
Invention content
Technical problems to be solved by the inivention
With white ink the electromagnetic shielding film for being attached at printed wiring board surface printing mark etc., in e-machine
The printed wiring board is managed in assembling steps.But the print content of white ink is easily spread and sunk in previous electromagnetic shielding film,
This low disadvantage of productivity of the step of useful white ink printing.
In addition, the information terminal etc. using electromagnetic shielding film needs light weight to minimize, electromagnetic shielding film along with this
Size become smaller, the word etc. for being printed in electromagnetic shielding film also becomes smaller.
Since the size of print content becomes smaller, it is difficult to identify the word for being printed in previous electromagnetic shielding film.Especially
In the high interior of illumination, which can become larger.
Furthermore if previous electromagnetic shielding film prints word, mark by wire mark, ink is had to silk-screen plate and electricity
Exudation causes printing accuracy low between magnetic wave screened film, it is difficult to identify the problem of small size word etc..Even if adjusting insulation
The tone of protective layer improves contrast, can not fundamentally improve the low of visibility caused by spreading and sinking in.
The technical problem to be solved is that a kind of electromagnetic shielding film of realization, the electromagnetic shielding films to make small ruler for the disclosure
Very little word etc. is readily identified, and can with high accuracy be printed.
Solve the technological means of technical problem
One form of electromagnetic shielding film contains insulating protective layer and shielded layer, and the arithmetic average on the surface of insulating protective layer is inclined
Gradient is 30 ° or more.
Invention effect
It enables to small size word etc. readily identified by the electromagnetic shielding film of the disclosure and is with high accuracy printed.
The simple declaration of attached drawing
Fig. 1 is the sectional view of the electromagnetic shielding film involved by an embodiment；
Fig. 2 is the sectional view of the electromagnetic shielding film involved by variation.
The embodiment of invention
Just the electromagnetic shielding film of the present invention is specifically described below.But the present invention is not limited by following implementation,
It can suitably change and be applicable in the range of not changing present subject matter.
（Electromagnetic shielding film）
Fig. 1 is the schematical summary sectional view of the electromagnetic shielding film of present embodiment.As shown in Figure 1, electromagnetic shielding film
There are insulating protective layer 110 and shielded layer 120.It as required, can be in shielded layer 120 and 110 opposite side of insulating protective layer
Face setting gluing oxidant layer 130.Can electromagnetic shielding film easily be fitted in into printed wiring board by the way that gluing oxidant layer is arranged.
（Insulating protective layer）
It is for guard shield layer that insulating protective layer 110, which is arranged,.In the electromagnetic shielding film of present embodiment, insulating protective layer
110 arithmetic average gradient is 30 ° or more.
So that the arithmetic average gradient of insulating protective layer 110 is 30 ° or more, preferably 35 ° or more, more preferably 40 °
More than, thus the surface area of insulating protective layer 110 becomes larger, and is improved to the absorbability of ink, can prevent oozing for ink when wire mark
Go out.Thereby, it is possible to improve the efficiency of presswork.
From the viewpoint of reducing and oozing out, the value of arithmetic average gradient is the bigger the better, but from the life of insulating protective layer 110
From the perspective of yield, arithmetic average gradient is preferably 80 ° hereinafter, more preferably 70 ° or less.
Arithmetic average gradient in the disclosure can be according to JIS B 0601（2001）It is measured.
In addition, the root mean square gradient of insulating protective layer can be 35 ° or more, more preferably 40 ° or more, 45 ° or more more
It is good.Root mean square gradient is 35 ° or more, and thus the surface area of insulating protective layer 110 becomes larger, and is improved to the absorbability of ink, energy
The exudation of ink when enough preventing wire mark.Thus, it is possible to improve the efficiency of presswork.
Root mean square gradient in the disclosure can be according to JIS B 0601（2001）Measurement.
The method for the insulating protective layer for having a certain range of arithmetic average gradient and root mean square gradient is obtained without special
It limits, well-known method can be used.This method can enumerate following well-known method：Add by embossing
Work have been assigned the stripping film of concaveconvex shape it is used for surface applying in formed insulating protective layer resin combination and be allowed to dry,
Thus the method for the concaveconvex shape of stripping film being transferred to insulating protective layer；On the surface of shielded layer, coating includes the tree of particulate
Fat composition and the dry method to be formed with the insulating protective layer of concaveconvex shape；Surface spray drying ice to insulating protective layer etc.
Method；The mold that concaveconvex shape is pressed after to shielding layer surface coating active energy ray-curable constituent, makes this solid
The method etc. that the property changed composition nitride layer cures and removes mold.
Wherein, it from the viewpoint of productivity, is preferably coated with the resin combination comprising particulate and dries to obtain
There is the method for the insulating protective layer of concaveconvex shape.At this point, the particulate added to insulating protective layer 110 is not particularly limited, such as
Resin microparticle or inorganic fine particles can be used.Resin microparticle can be acrylic resin particulate, polyacrylonitrile particle
Son, polyurethane particulate, polyamide micro-particle and polyimide microparticle etc..In addition, inorganic fine particles can be calcium carbonate
Particulate, calcium silicates particulate, clay, china clay, talcum, silica particles, fine glass particle, diatomite, mica powder, aluminium oxide
Particulate, magnesium oxide particle, zinc oxide fine particles, barium sulfate particles, aluminum sulfate particulate, calcium sulfate particulate and
Magnesium carbonate particulate etc..These resin microparticles and inorganic fine particles, which can be used alone, can also combine several use.From
From the perspective of the marresistance for improving insulating protective layer, preferably inorganic fine particles.
From the bumps for making the surface generation of insulating protective layer appropriate, arithmetic average gradient and root mean square gradient is made to become larger
From the perspective of, 50% average grain diameter of particulate is preferably 2 μm or more, more preferably 4 μm or more, and 10 μm or more are more preferably.Separately
Outside, the whitening of insulating protective layer, preferably 50% average grain diameter are 30 μm hereinafter, more preferably 20 μm or less in order to prevent.
From the viewpoint of so that arithmetic average gradient and root mean square gradient is become larger, added to insulating protective layer 110 micro-
The additive amount of particle is preferably 3 mass % or more, and more preferably 5% or more.In addition, from the whitening for preventing insulating protective layer
Viewpoint is set out, preferably 30 mass % hereinafter, more preferably 20 mass % hereinafter, 17 mass % or less more preferably.
Black system colorant can be added to insulating protective layer 110.It enables to insulate by adding black system colorant
The L* values of protective layer 110 become smaller and further increase the visibility of word.The word for being printed in insulating protective layer 110 is white
When, it is preferably such that L* values for 20 hereinafter, more preferably 18 or less.L* values in the disclosure can be according to JIS Z 8781-
4（2013）It measures.
Black system colorant can be black pigment or become the mixing of black to the mixing that lose lustre of several pigment
Pigment etc..Black pigment for example can be carbon black, Ketjen black（Ketjen Black）, carbon nanotube（CNT）, it is black
（perylene black）, black, the iron black and nigrosine of titanium etc. one or more of combinations.Hybrid pigment can for example mix
The pigment such as red, green, blue, yellow, purple, cyan and magenta are closed to use.
The grain size of black system colorant can realize required L* values, but from the sight of the reduction of dispersibility and L* values etc.
Point sets out, and preferably average primary particle diameter is 20nm or more, and preferably 100nm or less.Being averaged for black system colorant is primary
Grain size can be from passing through transmission electron microscope certainly（TEM）The image for expanding as 50,000 times~1,000,000 times of degree is able to observe that
The average value of primary particle of 20 degree find out.
From the viewpoint of reducing L* values, the additive amount that black system colorant is added to insulating protective layer 110 is preferably 0.
5 mass % or more, more preferably 1 mass % or more.But black system colorant is added as required, and can not also be added
Add.
By make insulating protective layer 110 60 ° of glossiness be 3% hereinafter, preferably 2% hereinafter, more preferably 1% with
Under, the scattering of the light of appropriateness, moderate inhibition reflecting feel are thus generated on the surface of insulating protective layer 110.Thus, it is possible to improve print
The visibility of brush content.In addition, 85 ° of glossiness of insulating protective layer 110 be preferably 10% hereinafter, more preferably 3% hereinafter,
1% or less more preferably.
60 ° of glossiness and 85 ° of glossiness in the disclosure can be measured by method shown in embodiment.
Insulating protective layer 110 preferably has required insulating properties, and meets certain mechanical strength, chemical resistance and heat-resisting
Property.
The resin material for constituting insulating protective layer has sufficient insulating properties, is not particularly limited, such as can use heat
Plastic resin constituent, thermosetting resin composition and active energy ray-curable constituent etc..
Thermoplastic resin composition is not particularly limited, and can use styrene resin composition, vinyl acetate esters tree
Fat composition, polyester resin constituent, polythylene resin constituent, polypropylene-based resin constituent, imide resin
Constituent and acrylic resin constituent etc..Thermosetting resin composition is not particularly limited, and can use phenolic resin group
At object, epoxylite constituent, polyurethane based resin constituent, melamine resin composition and alkyd based resin
Constituent etc..Active energy ray-curable constituent is not particularly limited, such as can use in molecule at least 2（Methyl）
The polymerizable compound etc. of acryloxy.These constituents can be used alone with a kind, can also be used in combination of two or more.
Can also include solidification as required in addition, in insulating protective layer 110 other than above-mentioned particulate and colorant
Accelerating agent pays stick, antioxidant, pigment, dyestuff, plasticizer, ultra-violet absorber, antifoaming agent, leveling agent, filler, resistance
Fire agent, viscosity-controlling agent and anti-blocking agent etc..
The thickness of insulating protective layer 110 is not particularly limited, and can be suitably set as required, but is shielded from adequately protecting
From the perspective of layer, preferably 1 μm or more, more preferably 4 μm or more.In addition, from the bending for ensuring electromagnetic shielding film
Viewpoint is set out, and preferably 10 μm hereinafter, more preferably 5 μm or less.
（Shielded layer）
The shielded layer 120 of present embodiment can be metal layer.Shielded layer 120 can use nickel, copper, silver, tin, gold, palladium, aluminium,
Chromium, titanium and zinc one kind or include the metal layers of the formation such as these alloy of more than two kinds.The material and thickness of metal layer
According to required effectiveness and slip patience is bent repeatedly suitably to select.From obtaining sufficient electromagnetic shielding
From the perspective of effect, the thickness of metal layer is preferably 0.1 μm or more.In addition, from the viewpoint of productivity and bending etc.
Preferably 8 μm or less.Metal layer can by galvanoplastic, electroless plating method, sputtering method, e-beam evaporation, vacuum vapour deposition,
The formation such as CVD method and Metalorganic Chemical Vapor Deposition.Metal layer can also by metal foil, metal nanoparticle and
The formation such as flakey metallic.
（Gluing oxidant layer）
The electromagnetic shielding film of present embodiment can also contain glue in shielded layer 120 and 110 opposite side of insulating protective layer
Adhesive layer 130.Gluing oxidant layer 130 can be formed by the resin combination of zygosity.Zygosity resin combination is not particularly limited,
Styrene resin composition, vinylacetate resin composition, polyester resin constituent, polyethylene kind tree can be used
Fat composition, polypropylene-based resin constituent, imide resin constituent, amide resin composition and acrylic resin
The thermoplastic resin compositions such as constituent and phenolic resin constituent, epoxylite constituent, polyurethane based resin composition
Thermosetting resin compositions such as object, melamine resin composition, alkyd based resin constituent etc..These can be with a kind individually
It uses, can also be used in combination of two or more.
As required, it is to have isotropic conductivity or the layer of anisotropic conductive to enable to gluing oxidant layer 130.It wants
When so that gluing oxidant layer 130 being conductive layer, the particulate of electric conductivity is added to the resin combination of zygosity.
The particulate of electric conductivity is not particularly limited, and can use metal microparticle, carbon nanotube, carbon fiber, metallic fiber
Deng.Such as the metal microparticles such as silver powder, copper powder, nickel powder, solder powder and aluminium powder can be used.In addition, can also use to copper
Powder implement it is silver-plated made of silver-coated copper powder and with coating metal made of coating metal high molecular particle, glass microballoon etc.
Particulate etc..Wherein, from the viewpoint of economy, the copper powder cheaply obtained or silver-coated copper powder are preferably capable.
50% average grain diameter of electroconductive particle is not particularly limited, from the viewpoint of obtaining satisfactory electrical conductivity preferably
0.5 μm or more.In addition, being preferably 15 μm or less from the viewpoint of making electrically conductive adhesive layer thin.
The shape of electroconductive particle is not particularly limited, can be appropriate from spherical, flat, flakey and dendron shape etc.
Selection.
The thickness of gluing oxidant layer 130 can be adjusted as required, but excellent from the viewpoint of obtaining good bond
It is selected as 0.5 μm or more.In addition, being preferably 20 μm or less from the viewpoint of making electromagnetic shielding film thin.
There is the structure of insulating protective layer 110, shielded layer 120 and gluing oxidant layer 130 to be illustrated with regard to electromagnetic shielding film,
But as shown in Fig. 2, also can be the structure for having insulating protective layer 110 and isotropic conductivity gluing oxidant layer 140.
Insulating protective layer 110 can be structure identical with electromagnetic shielding film shown in Fig. 1.Isotropic conductivity gluing
Oxidant layer 140 can be formed by the resin combination and conductive particle of zygosity identical as gluing oxidant layer 130.Isotropism is led
Electrical gluing oxidant layer 140 is functioned as shielded layer.
（The manufacturing method of screened film）
Electromagnetic shielding film can be manufactured by well-known manufacturing method.Its an example of following presentation.
First, conductive gluing oxidant layer 130 is formed on the support film for having carried out release processing to surface.Specifically
For, simultaneously in the surface of support film by the solution coating of the gluing oxidant layer constituent of the material including constituting gluing oxidant layer 130
It makes it dry to form gluing oxidant layer 130.
Next, forming shielded layer 120 on the surface of gluing oxidant layer 130.Specifically, following methods can be used：It will
It is pre-formed into certain thickness metal foil and fits in the method for gluing oxidant layer 130, by being deposited or being electroplated（plating）Deng
The method of the forming metal layer on surface of gluing oxidant layer 130.
Next, forming insulating protective layer 110 on the surface of shielded layer 120.Specifically, can use will include constitute
The solution coating of the insulating protective layer constituent of the material of insulating protective layer 110 is in the surface of shielded layer 120 and makes it dry
Method.
Later, electromagnetic shielding film can be obtained by removing support film.
It is also possible that gluing oxidant layer 130 is isotropic conductivity gluing oxidant layer 140, and in isotropic conductivity glue
The surface of adhesive layer 140 forms insulating protective layer 110.
In order to adjust insulating protective layer 110 surface arithmetic average gradient and root mean square gradient, also can be to exhausted
The surface of edge protective layer 110 carries out the processing such as sandblasting.
Illustrate the example formed from 130 side of gluing oxidant layer, but also can be successively from 110 side shape of insulating protective layer
At.At this point, the surface that can be transferred to gluing oxidant layer 130 by using the support film for having Micropicture and by Micropicture is come
Adjust the arithmetic average gradient and root mean square gradient on the surface of gluing oxidant layer 130.
Embodiment
In the following, by embodiment, the present invention is described in detail.But following embodiment is to illustrate, and does not limit this hair
It is bright.
＜ evaluating characteristics ＞
［ evaluation of exudation ］
Letter, the number of 1mm × 2mm are printed on the surface of the insulating protective layer of electromagnetic shielding film using wire mark version, use is micro-
The shape of sem observation letter, number, thus evaluates the presence or absence of exudation.It is zero when not confirming exudation, produces and ooze
Go out and confirm the deformation of profile, ink shrinkage cavity（cissing）When for ×.
［ evaluation of visibility ］
Visibility is carried out by observing the method for 45 ° of normal reflections.In darkroom, from table the height of 10cm make LED light
（SUPRABEAM systems）Irradiation mouth be about 45 ° from vertical direction, and from irradiation mouth just under to horizontal direction deviate
The position of 10cm loads above-mentioned electromagnetic shielding film.Then, to horizontal direction from from the position for being placed with electromagnetic shielding film
Deviation 10cm, the position observation for deviateing 10cm to vertical direction are printed on 3 words on the surface of insulating protective layer with white ink
Female, number（Vertical 0.5mm, the horizontal interval 0.2mm, 0.1mm）, being clear to property is evaluated.It clearly can visually confirm printing
It is zero when whole profiles of content, be when cannot visually confirm print content ×.
［ measurement of arithmetic average gradient and root mean square gradient ］
Use laser microscope（Co., Ltd.'s KEYENCE systems, VK-X200,50 times of object lens）Observe appointing for insulation protection layer surface
5 visuals field of meaning, and according to JIS B 0601（2001）Determine the average value of arithmetic average gradient and root mean square gradient.Separately
Outside, datum length is 280 μm.
［ measurement of L* values ］
Use integrating sphere spectrophotometer（X-Rite corporations, Ci64, tungsten light source）Determine L* values.
［ measurement of glossiness ］
60 ° of glossiness and 85 ° of glossiness pass through BYK Gardner micro-gloss（Portable gloss meter）It is determined.
（Embodiment 1）
The making-of electrically conductive adhesive layer
The bisphenol type epoxy resinoid of 100 mass parts is added to toluene（Mitsubishi Chemical（Strain）System, jER1256）, 0.1 mass parts
Curing agent（Mitsubishi Chemical（Strain）System, ST14）, 47 mass parts 10 μm of average grain diameter spherical silver-coated copper powder, and make solid
The amount of ingredient is 20 mass %, is stirred to prepare the gluing oxidant layer constituent of electric conductivity.The gluing oxidant layer of acquisition is formed
Object is coated on the PET film that release processing has been carried out to surface, and forms adhesive in support film surface by heat drying
Layer.
The making-of shielded layer
The silver layer of 0.1 μm of thickness is formd by vapour deposition method on the surface of the gluing oxidant layer obtained.
The making-of insulating protective layer
The bisphenol type epoxy resinoid of 100 mass parts is mixed in toluene（Mitsubishi Chemical（Strain）System, jER1256）, 0.1 mass
The curing agent of part（Mitsubishi Chemical（Strain）System, ST14）, 15 mass parts the carbon particle as black system colorant（TOKAI
CARBON CO., LTD. system, TOKABLACK#8300/F）, 10 mass parts 6 μm of the average grain diameter as particulate poly- ammonia
Ester resin particle, and so that the amount of solid constituent is 20 mass %, prepare insulating protective layer constituent.The constituent is applied
It is distributed in obtained shielded layer and heat drying obtains the electromagnetic shielding film of embodiment 1.
The arithmetic average gradient on the surface of the insulating protective layer obtained is 43 °, and root mean square gradient is 50 °, L* values
Be 18,60 ° of glossiness it is 0.2%, 85 ° of glossiness are 0.3%.When evaluating the presence or absence of exudation, ink shrinkage cavity is not seen
（cissing）Deng not confirming exudation.The visibility of print content is also good.
（Embodiment 2）
In addition to so that the particulate that insulating protective layer constituent is added is the polyurethane resin grain of 2 μm of the average grain diameter of 10 mass parts
Other than son, carry out similarly to Example 1.The arithmetic average gradient on the surface of the insulating protective layer obtained is 32 °, just
Root gradient is 39 °, and L* values are that 20,60 ° of glossiness are 1.1%, and 85 ° of glossiness are 2.3%.It is carried out to the presence or absence of exudation
When evaluation, ink shrinkage cavity is not seen（cissing）Deng not confirming exudation.The visibility of print content is also good.
（Embodiment 3）
In addition to so that the particulate that insulating protective layer constituent is added is the polyurethane resin grain of 5 μm of the average grain diameter of 10 mass parts
Other than son, carry out similarly to Example 1.The arithmetic average gradient on the surface of the insulating protective layer obtained is 46 °, just
Root gradient is 52 °, and L* values are that 21,60 ° of glossiness are 0.3%, and 85 ° of glossiness are 2.6%.The presence or absence of exudation is commented
When valence, ink shrinkage cavity is not seen（cissing）Deng not confirming exudation.The visibility of print content is also good.
（Embodiment 4）
In addition to so that the particulate that insulating protective layer constituent is added is the styrene-propene of 5 μm of the average grain diameter of 13 mass parts
Other than acid resin particle, carry out similarly to Example 1.The arithmetic average gradient on the surface of the insulating protective layer obtained is
35 °, root mean square gradient is 43 °, and L* values are that 18,60 ° of glossiness are 0.8%, and 85 ° of glossiness are 2.1%.Have to exudation
When without being evaluated, the visibility of print content is good.
（Comparative example 1）
So that the black system colorant that insulating protective layer constituent is added is 5 mass parts, particulate is not added.It is release implementing
Processing, the support film that has concaveconvex shape on face surface coating insulating protective layer constituent is simultaneously allowed to dry, by itself and screen
After covering layer fitting, from the sur-face peeling support film of insulating protective layer, the irregular insulating protective layer of transfer is thus formed.
Other conditions are same as Example 1.The arithmetic average gradient on the surface of the insulating protective layer obtained is 22 °, and root mean square inclines
Gradient is 31 °, and L* values are that 28,60 ° of glossiness are 2.0%, and 85 ° of glossiness are 43.4%.The presence or absence of exudation is evaluated
When, confirm ink shrinkage cavity（cissing）.In addition, print content can not visually be confirmed by reflected light interference.
（Comparative example 2）
Other than making the black system colorant that insulating protective layer constituent is added be 5 mass parts and particulate be not added,
He is same as Example 1.The arithmetic average gradient on the surface of the insulating protective layer obtained is 16 °, and root mean square gradient is
25 °, L* values are that 27,60 ° of glossiness are 11.1%, and 85 ° of glossiness are 36.7%.When evaluating the presence or absence of exudation, confirm
Ink shrinkage cavity is arrived（cissing）.Print content can not visually be confirmed by reflected light interference.
（Comparative example 3）
Other than making the black system colorant that insulating protective layer constituent is added be 5 mass parts and particulate be not added,
He is same as Example 1.The arithmetic average gradient on the surface of the insulating protective layer obtained is 23 °, and root mean square gradient is
30 °, L* values are that 25,60 ° of glossiness are 4.2%, and 85 ° of glossiness are 33.1%.When evaluating the presence or absence of exudation, confirm
Ink shrinkage cavity is arrived（cissing）.Print content also can not visually be confirmed by reflected light interference.
（Comparative example 4）
Other than the film for being 0.6 μm by surface roughness is used as support film, other are identical as comparative example 1.What is obtained is exhausted
The arithmetic average gradient on the surface of edge protective layer is 13 °, and root mean square gradient is 19 °, and L* values are that 28,60 ° of glossiness are
8.0%, 85 ° of glossiness are 43.1%.Print content can not visually be confirmed by reflected light interference.
（Comparative example 5）
In addition to so that the particulate that insulating protective layer constituent is added is the polyurethane resin grain of 7 μm of the average grain diameter of 3 mass parts
Other than son, other are same as Example 1.The arithmetic average gradient on the surface of the insulating protective layer obtained is 14 °, root mean square
Gradient is 20 °, and L* values are that 26,60 ° of glossiness are 6.1%, and 85 ° of glossiness are 36.9%.Print content is interfered by reflected light
Can not visually it confirm.
The composition and characteristic of the insulating protective layer for indicating each Examples and Comparative Examples are concentrated in table 1.
[table 1]
The insulating protective layer for the Examples 1 to 3 that the arithmetic average gradient on surface is 30 ° or more does not all confirm ink shrinkage cavity
（cissing）And printing property is good.In addition, compared with the insulating protective layer of comparative example, the insulating protective layer of Examples 1 to 3 does not have
There is exudation, and visibility is superior.
Practicability
The electromagnetic shielding film of the disclosure can with high accuracy print the word etc. of small size, as e-machine etc.
Electromagnetic shielding film is useful.
Symbol description
110 insulating protective layers
120 shielded layers
130 gluing oxidant layer
140 isotropic conductivity gluing oxidant layer.
Claims (1)
1. a kind of electromagnetic shielding film, contains：
Insulating protective layer and shielded layer, wherein
The arithmetic average gradient on the surface of the insulating protective layer is 30 ° or more.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016024914 | 2016-02-12 | ||
| JP2016-024914 | 2016-02-12 | ||
| PCT/JP2017/004941 WO2017138638A1 (en) | 2016-02-12 | 2017-02-10 | Electromagnetic-wave shield film |
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| CN108605425A true CN108605425A (en) | 2018-09-28 |
| CN108605425B CN108605425B (en) | 2020-04-07 |
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| JP (1) | JP6621487B2 (en) |
| KR (1) | KR102432750B1 (en) |
| CN (1) | CN108605425B (en) |
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| WO (1) | WO2017138638A1 (en) |
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|---|---|---|---|---|
| CN111556703A (en) * | 2019-06-18 | 2020-08-18 | 东洋油墨Sc控股株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111800997B (en) * | 2016-09-06 | 2023-08-29 | 拓自达电线株式会社 | Electromagnetic wave shielding film |
| WO2019073737A1 (en) * | 2017-10-10 | 2019-04-18 | 東レ株式会社 | Film |
| JP6863908B2 (en) * | 2018-01-12 | 2021-04-21 | タツタ電線株式会社 | Electromagnetic wave shield film |
| TW201943330A (en) * | 2018-03-29 | 2019-11-01 | 日商拓自達電線股份有限公司 | Resin composition for protective layer of electromagnetic wave-shielding film, electromagnetic wave-shielding film, and method for producing electromagnetic wave-shielding film |
| TWI764350B (en) * | 2020-10-30 | 2022-05-11 | 臻鼎科技股份有限公司 | Electromagnetic shielding film and manufacturing method |
| TW202402154A (en) * | 2022-06-28 | 2024-01-01 | 日商拓自達電線股份有限公司 | Electromagnetic shielding film |
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- 2017-02-10 WO PCT/JP2017/004941 patent/WO2017138638A1/en active Application Filing
- 2017-02-10 TW TW106104503A patent/TWI700982B/en active
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| JP2003298285A (en) * | 2002-03-29 | 2003-10-17 | Tatsuta Electric Wire & Cable Co Ltd | Reinforcing shield film and shield flexible printed wiring board |
| CN102318460A (en) * | 2008-12-17 | 2012-01-11 | 3M创新有限公司 | The electromagnetic shielding goods |
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| KR102432750B1 (en) | 2022-08-12 |
| CN108605425B (en) | 2020-04-07 |
| JP6621487B2 (en) | 2019-12-18 |
| TW201803434A (en) | 2018-01-16 |
| TWI700982B (en) | 2020-08-01 |
| KR20180113500A (en) | 2018-10-16 |
| WO2017138638A1 (en) | 2017-08-17 |
| JPWO2017138638A1 (en) | 2018-12-06 |
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