CN108605425B - Electromagnetic wave shielding film - Google Patents
Electromagnetic wave shielding film Download PDFInfo
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- CN108605425B CN108605425B CN201780010708.7A CN201780010708A CN108605425B CN 108605425 B CN108605425 B CN 108605425B CN 201780010708 A CN201780010708 A CN 201780010708A CN 108605425 B CN108605425 B CN 108605425B
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- Prior art keywords
- insulating protective
- protective layer
- electromagnetic wave
- layer
- shielding film
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The electromagnetic wave-shielding film includes an insulating protective layer 110 and a shielding layer 120. The arithmetic mean inclination of the surface of the insulating protective layer 110 is 30 ° or more.
Description
Technical Field
The present invention relates to an electromagnetic wave shielding film.
Background
In recent years, smart phones, tablet-type information terminals, and the like have been increasingly required to have high performance for high-speed transmission of large-capacity data. And a high frequency signal is required for high-speed transmission of large-capacity data. However, when a high-frequency signal is used, electromagnetic wave noise is generated in a signal line provided on the printed wiring board, and thus, an operation error of a peripheral device is likely to occur. Therefore, in order to prevent such an operation error, it is important to shield the shield printed wiring board from electromagnetic waves.
In order to shield a printed wiring board, a method of attaching an electromagnetic wave shielding film having an insulating layer and a shielding layer to a printed wiring board has been proposed (for example, see patent document 1).
In addition, an electromagnetic wave shielding film in which an insulating protective layer is black-coated is proposed for concealing the wiring pattern (for example, see patent document 2).
Further, in order to improve the visibility of white printed matter printed on the surface of an electromagnetic wave shielding film, it has been thought to adjust the color tone of an insulating protective layer of the electromagnetic wave shielding film (for example, see patent document 3).
Prior art documents
Patent document
Patent document 1 Japanese patent laid-open (Japanese patent laid-open) No. 2004-095566;
patent document 2 Japanese patent laid-open (Japanese patent laid-open) No. 2014-078574;
patent document 3, patent No. 5796690.
Disclosure of Invention
Technical problem to be solved by the invention
A white ink is used to print a mark or the like on the surface of an electromagnetic wave shielding film attached to a printed wiring board to manage the printed wiring board in an assembly step of an electronic appliance. However, conventional electromagnetic wave shielding films have a drawback that printing with white ink is prone to blurring, and the productivity of a process for printing with white ink is low.
Further, information terminals and the like using electromagnetic wave shielding films are required to be light-weight and small-sized, and along with this, the size of the electromagnetic wave shielding film is reduced, and characters and the like printed on the electromagnetic wave shielding film are also reduced.
Since the size of printed contents is reduced, it is difficult to recognize characters printed on a conventional electromagnetic wave shielding film. In particular, in a room with high illuminance, the influence becomes large.
Further, when characters and symbols are printed on the conventional electromagnetic wave shielding film by screen printing, there is a problem that printing accuracy is lowered due to ink bleeding between the screen plate and the electromagnetic wave shielding film, and it is difficult to recognize small-sized characters. Even if the color tone of the insulating protective layer is adjusted to improve the contrast, the deterioration of visibility due to blurring cannot be fundamentally improved.
The technical problem to be solved by the present disclosure is to realize an electromagnetic wave shielding film that allows small-sized characters and the like to be easily recognized and that can be printed with high accuracy.
Means for solving the problems
One embodiment of the electromagnetic wave shielding film includes an insulating protective layer and a shielding layer, and the arithmetic mean inclination of the surface of the insulating protective layer is 30 ° or more.
Effects of the invention
The electromagnetic wave shielding film of the present disclosure enables small-sized characters and the like to be easily recognized and printed with high accuracy.
Brief description of the drawings
Fig. 1 is a cross-sectional view of an electromagnetic wave shielding film according to an embodiment;
fig. 2 is a cross-sectional view of an electromagnetic wave shielding film according to a modification.
Modes for carrying out the invention
The electromagnetic wave shielding film of the present invention will be specifically described below. However, the present invention is not limited to the following embodiments, and can be applied with appropriate modifications within a scope not changing the gist of the present invention.
(electromagnetic wave shielding film)
Fig. 1 is a schematic cross-sectional view of an electromagnetic wave shielding film according to the present embodiment. As shown in fig. 1, the electromagnetic wave-shielding film has an insulating protective layer 110 and a shielding layer 120. If necessary, an adhesive layer 130 may be provided on the surface of the shield layer 120 opposite to the insulating protective layer 110. The electromagnetic wave shielding film can be easily attached to the printed circuit board by arranging the adhesive layer.
(insulating protective layer)
The insulating protective layer 110 is provided to protect the shielding layer. In the electromagnetic wave shielding film of the present embodiment, the arithmetic mean inclination of the insulating protective layer 110 is 30 ° or more.
When the arithmetic mean inclination of the insulating protective layer 110 is 30 ° or more, preferably 35 ° or more, and more preferably 40 ° or more, the surface area of the insulating protective layer 110 becomes large, the ink absorbability is improved, and the bleeding of ink at the screen printing can be prevented. This can improve the efficiency of the print job.
The larger the value of the arithmetic mean inclination is, the better from the viewpoint of reducing bleeding, but from the viewpoint of productivity of the insulating protective layer 110, the arithmetic mean inclination is preferably 80 ° or less, more preferably 70 ° or less.
The arithmetic mean inclination in the present disclosure can be measured according to JIS B0601 (2001).
The root-mean-square inclination of the insulating protective layer may be 35 ° or more, more preferably 40 ° or more, and still more preferably 45 ° or more. The root mean square inclination is 35 ° or more, which increases the surface area of the insulating protective layer 110, improves the ink absorbability, and prevents bleeding of ink during screen printing. This can improve the efficiency of the print job.
The root mean square inclination in the present disclosure can be measured according to JIS B0601 (2001).
The method for obtaining the insulating protective layer having the arithmetic mean tilt and the root mean square tilt in a certain range is not particularly limited, and a known method can be used. Such a method can be exemplified by the following well-known methods: a method of transferring the uneven shape of the release film to the insulating protective layer by applying a resin composition for forming the insulating protective layer on the surface of the release film provided with the uneven shape by embossing and drying the resin composition; a method of forming an insulating protective layer having a concave-convex shape by applying a resin composition containing fine particles on the surface of a shield layer and drying the resin composition; a method of spraying dry ice or the like on the surface of the insulating protective layer; and a method in which an active energy ray-curable composition is applied to the surface of the shielding layer, a mold having a concave-convex shape is pressed, the curable composition layer is cured, and the mold is peeled off.
Among them, from the viewpoint of productivity, a method of obtaining an insulating protective layer having a concave-convex shape by applying a resin composition containing fine particles and drying is preferable. In this case, the fine particles to be added to the insulating protective layer 110 are not particularly limited, and for example, resin fine particles or inorganic fine particles can be used. The resin fine particles may be acrylic resin fine particles, polyacrylonitrile fine particles, polyurethane fine particles, polyamide fine particles, polyimide fine particles, or the like. The inorganic fine particles may be calcium carbonate fine particles, calcium silicate fine particles, clay, china clay, talc, silica fine particles, glass fine particles, diatomaceous earth, mica powder, alumina fine particles, magnesium oxide fine particles, zinc oxide fine particles, barium sulfate fine particles, aluminum sulfate fine particles, calcium sulfate fine particles, magnesium carbonate fine particles, or the like. These resin fine particles and inorganic fine particles may be used alone or in combination. From the viewpoint of improving the abrasion resistance of the insulating protective layer, inorganic fine particles are preferable.
From the viewpoint of forming appropriate irregularities on the surface of the insulating protective layer and increasing the arithmetic mean gradient and the root-mean-square gradient, the 50% average particle diameter of the fine particles is preferably 2 μm or more, more preferably 4 μm or more, and still more preferably 10 μm or more. In order to prevent the insulating protective layer from being white, the 50% average particle diameter is preferably 30 μm or less, and more preferably 20 μm or less.
From the viewpoint of increasing the arithmetic mean gradient and the root mean square gradient, the amount of fine particles added to the insulating protective layer 110 is preferably 3% by mass or more, and more preferably 5% by mass or more. From the viewpoint of preventing the insulating protective layer from being white, it is preferably 30% by mass or less, more preferably 20% by mass or less, and still more preferably 17% by mass or less.
The value of L ＊ of the insulating protective layer 110 can be made small and the visibility of characters can be further improved by adding a black colorant, when characters printed on the insulating protective layer 110 are white, the value of L ＊ is preferably 20 or less, more preferably 18 or less, and the value of L ＊ in the present disclosure can be measured according to JIS Z8781-4 (2013).
The black-based colorant may be a black pigment or a mixed pigment obtained by subtractive color mixing of a plurality of pigments to make black. The Black pigment may be one or a combination of carbon Black, Ketjen Black (Ketjen Black), Carbon Nanotube (CNT), perylene Black (perylene Black), titanium Black, iron Black, aniline Black, or the like. The mixed pigment can be used by mixing, for example, red, green, blue, yellow, violet, cyan, magenta and other pigments.
The particle size of the black colorant may be such that a desired L ＊ value can be achieved, but from the viewpoint of dispersibility and a reduction in the L ＊ value, the average primary particle size is preferably 20nm or more, and preferably 100nm or less, and the average primary particle size of the black colorant may be determined from the average value of 20 primary particles that can be observed from an image enlarged by a Transmission Electron Microscope (TEM) to about 5 to 100 ten thousand times.
From the viewpoint of reducing the L ＊ value, the amount of the black-based colorant added to the insulating protective layer 110 is preferably 0.5 mass% or more, and more preferably 1 mass% or more.
When the 60 ° glossiness of the insulating protection layer 110 is 3% or less, preferably 2% or less, and more preferably 1% or less, appropriate scattering of light occurs on the surface of the insulating protection layer 110, and the glossy feeling is appropriately suppressed. This can improve the visibility of the printed content. The insulating protective layer 110 preferably has an 85 ° gloss of 10% or less, more preferably 3% or less, and still more preferably 1% or less.
The 60 ° gloss and 85 ° gloss in this disclosure can be measured by the methods shown in the examples.
The insulating protective layer 110 preferably has desired insulation properties and satisfies certain mechanical strength, chemical resistance and heat resistance.
The resin material constituting the insulating protective layer is not particularly limited as long as it has sufficient insulating properties, and for example, a thermoplastic resin composition, a thermosetting resin composition, an active energy ray-curable composition, or the like can be used.
The thermoplastic resin composition is not particularly limited, and a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an acrylic resin composition, and the like can be used. The thermosetting resin composition is not particularly limited, and a phenol resin composition, an epoxy resin composition, a polyurethane resin composition, a melamine resin composition, an alkyd resin composition, and the like can be used. The active energy ray-curable composition is not particularly limited, and for example, a polymerizable compound having at least 2 (meth) acryloyloxy groups in the molecule, or the like can be used. These compositions may be used alone in 1 kind, or may be used in combination of 2 or more kinds.
The insulating and protecting layer 110 may contain, in addition to the fine particles and the coloring agent, a curing accelerator, an adhesion promoter, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, a viscosity adjuster, an anti-blocking agent, and the like as required.
The thickness of the insulating protective layer 110 is not particularly limited, and can be appropriately set as needed, but is preferably 1 μm or more, and more preferably 4 μm or more, from the viewpoint of sufficiently protecting the shield layer. From the viewpoint of ensuring the bendability of the electromagnetic wave shielding film, it is preferably 10 μm or less, and more preferably 5 μm or less.
(Shielding layer)
The shield layer 120 of the present embodiment can be a metal layer. The shield layer 120 can be formed using a metal layer made of one kind of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, and zinc, or an alloy containing 2 or more kinds of these. The material and thickness of the metal layer may be appropriately selected in accordance with the desired electromagnetic shielding effect and the repeated bending and seeding slip resistance. The thickness of the metal layer is preferably 0.1 μm or more from the viewpoint of obtaining a sufficient electromagnetic shielding effect. In addition, from the viewpoint of productivity, bendability, and the like, it is preferably 8 μm or less. The metal layer can be formed by an electroplating method, a chemical plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic chemical vapor deposition method, or the like. The metal layer can be formed of a metal foil, metal nanoparticles, scale-like metal particles, or the like.
(adhesive layer)
The electromagnetic wave shielding film of the present embodiment may include the adhesive layer 130 on the side of the shielding layer 120 opposite to the insulating protective layer 110. The adhesive layer 130 may be formed of a resin composition having bondability. The adhesive resin composition is not particularly limited, and a thermoplastic resin composition such as a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin composition, or an acrylic resin composition, or a thermosetting resin composition such as a phenol resin composition, an epoxy resin composition, a polyurethane resin composition, a melamine resin composition, or an alkyd resin composition can be used. These may be used alone in 1 kind, or may be used in combination of 2 or more kinds.
The adhesive layer 130 can be made to be a layer having isotropic conductivity or anisotropic conductivity as necessary. In order to make the adhesive layer 130 a conductive layer, conductive fine particles may be added to the adhesive resin composition.
The conductive fine particles are not particularly limited, and metal fine particles, carbon nanotubes, carbon fibers, metal fibers, and the like can be used. For example, fine metal particles such as silver powder, copper powder, nickel powder, solder powder, and aluminum powder can be used. In addition, silver-coated copper powder obtained by plating copper powder with silver, metal-coated fine particles obtained by coating polymer fine particles, glass beads, or the like with metal, or the like can be used. Among these, copper powder or silver-coated copper powder that can be obtained at low cost is preferable from the viewpoint of economy.
The 50% average particle diameter of the conductive particles is not particularly limited, and is preferably 0.5 μm or more from the viewpoint of obtaining good conductivity. In addition, from the viewpoint of making the conductive adhesive layer thin, it is preferably 15 μm or less.
The shape of the conductive particles is not particularly limited, and can be appropriately selected from spherical, flat, scaly, and dendritic shapes.
The thickness of the adhesive layer 130 can be adjusted as needed, but is preferably 0.5 μm or more from the viewpoint of obtaining good adhesion. In addition, from the viewpoint of making the electromagnetic wave shielding film thin, it is preferably 20 μm or less.
The electromagnetic wave shielding film has the structure including the insulating protective layer 110, the shielding layer 120, and the adhesive layer 130, but as shown in fig. 2, the electromagnetic wave shielding film may have a structure including the insulating protective layer 110 and the isotropic conductive adhesive layer 140.
The insulating protective layer 110 can have the same structure as the electromagnetic wave-shielding film shown in fig. 1. The isotropic conductive adhesive layer 140 may be formed of a resin composition having the same adhesiveness as the adhesive layer 130 and conductive fine particles. The isotropic conductive adhesive layer 140 functions as a shielding layer.
(method for producing Shielding film)
The electromagnetic wave shielding film can be manufactured by a well-known manufacturing method. An example thereof is shown below.
First, the conductive adhesive layer 130 is formed on the support film whose surface is subjected to release treatment. Specifically, the adhesive layer 130 is formed by applying a solution of an adhesive layer composition including a material constituting the adhesive layer 130 to the surface of a support film and drying the solution.
Next, the shielding layer 120 is formed on the surface of the adhesive layer 130. Specifically, the following method can be used: a method of bonding a metal foil formed in advance to a predetermined thickness to the adhesive layer 130, or a method of forming a metal layer on the surface of the adhesive layer 130 by vapor deposition, plating, or the like.
Next, an insulating protective layer 110 is formed on the surface of the shield layer 120. Specifically, a method of applying a solution of an insulating protective layer composition including a material constituting the insulating protective layer 110 to the surface of the shield layer 120 and drying the solution can be used.
After that, the electromagnetic wave-shielding film can be obtained by peeling the support film.
It is also possible to make the adhesive layer 130 an isotropic conductive adhesive layer 140 and form the insulating protective layer 110 on the surface of the isotropic conductive adhesive layer 140.
The surface of the insulating protective layer 110 may be subjected to a treatment such as sandblasting in order to adjust the arithmetic mean inclination and the root mean square inclination of the surface of the insulating protective layer 110.
The example is shown in which the adhesive layer 130 is formed from the side of the adhesive layer, but the adhesive layer may be formed from the side of the insulating protective layer 110 in sequence. In this case, the arithmetic mean tilt and the root mean square tilt of the surface of the adhesive layer 130 can be adjusted by transferring a fine pattern to the surface of the adhesive layer 130 using a support film having a fine pattern.
Examples
The present invention will be described in detail below with reference to examples. However, the following examples are illustrative and do not limit the present invention.
< evaluation of characteristics >
[ evaluation of bleeding ]
The surface of the insulating protective layer of the electromagnetic wave shielding film was printed with letters and numbers of 1mm × 2mm using a screen plate, and the shapes of the letters and numbers were observed with a microscope to evaluate the presence or absence of bleeding, and ○ was observed when bleeding was not observed, and x was observed when distortion of the contour was observed and ink shrinkage holes (cissing) were observed.
[ evaluation of visibility ]
The visibility was carried out by observing a 45 ° regular reflection method, in a darkroom, the electromagnetic wave shielding film was placed at a height of 10cm from the table such that the irradiation port of the LED lamp (manufactured by SUPRABEAM) was about 45 ° from the vertical direction, and at a position offset by 10cm from the vertical direction from the irradiation port, then, 3 letters and numbers (0.5 mm in length, 0.2mm in width, and 0.1mm in interval) printed on the surface of the insulating protective layer with white ink were observed at a position offset by 10cm from the position where the electromagnetic wave shielding film was placed in the horizontal direction and 10cm in the vertical direction, and the visibility was evaluated, and the visibility was ○ when the entire contour of the printed matter could be clearly confirmed with the naked eye, and x when the printed matter could not be confirmed with the naked eye.
[ measurement of arithmetic mean Tilt and root mean Square Tilt ]
Any 5 fields of view of the surface of the insulating protective layer were observed using a laser microscope (manufactured by KEYENCE, VK-X200, 50-fold objective lens), and the arithmetic mean inclination and the mean of the root mean square inclination were measured according to JIS B0601 (2001). The reference length was 280 μm.
[ measurement of L ＊ value ]
The L ＊ value was measured using an integrating-sphere spectrophotometer (X-Rite, Ci64, tungsten light source).
[ measurement of gloss ]
The 60 ° gloss and 85 ° gloss were measured by BYK Gardner seeding and seeding (portable gloss meter).
(example 1)
Preparation of the conductive adhesive layer
100 parts by mass of a bisphenol A epoxy resin (manufactured by Mitsubishi chemical corporation, jER 1256), 0.1 part by mass of a curing agent (manufactured by Mitsubishi chemical corporation, ST 14), and 47 parts by mass of spherical silver-coated copper powder having an average particle diameter of 10 μm were added to toluene so that the amount of solid content became 20 mass%, and the mixture was stirred and mixed to prepare a conductive adhesive layer composition. The obtained adhesive layer composition was applied to a PET film whose surface was subjected to release treatment, and heated and dried to form an adhesive layer on the surface of the support film.
Production of the shielding layer
A silver layer having a thickness of 0.1 μm was formed on the surface of the obtained adhesive layer by vapor deposition.
Production of insulating protective layer
An insulating protective layer composition was prepared by mixing 100 parts by mass of a bisphenol a type epoxy resin (jER 1256, manufactured by mitsubishi chemical corporation), 0.1 part by mass of a curing agent (ST 14, manufactured by mitsubishi chemical corporation), 15 parts by mass of carbon particles (tokicarbon co., ltd, TOKABLACK # 8300/F) as a black coloring agent, and 10 parts by mass of urethane resin particles having an average particle size of 6 μm as fine particles with a solid content of 20% by mass in toluene. The composition was applied to the obtained shielding layer and dried by heating to obtain an electromagnetic wave shielding film of example 1.
The arithmetic mean inclination of the surface of the obtained insulating protective layer was 43 °, the root mean square inclination was 50 °, the L ＊ value was 18, the 60 ° gloss was 0.2%, and the 85 ° gloss was 0.3%.
(example 2)
The same procedure as in example 1 was repeated except that 10 parts by mass of the fine particles of the insulating protective layer composition were added to the polyurethane resin particles having an average particle diameter of 2 μm, and the arithmetic average inclination of the surface of the insulating protective layer obtained was 32 °, the root-mean-square inclination was 39 °, the L ＊ value was 20, the 60 ° gloss was 1.1%, and the 85 ° gloss was 2.3%.
(example 3)
The same procedure as in example 1 was repeated except that 10 parts by mass of the fine particles of the insulating protective layer composition were added to the polyurethane resin particles having an average particle diameter of 5 μm, and the arithmetic average inclination of the surface of the insulating protective layer obtained was 46 °, the root-mean-square inclination was 52 °, the L ＊ value was 21, the 60 ° gloss was 0.3%, and the 85 ° gloss was 2.6%.
(example 4)
The same procedure as in example 1 was repeated except that 13 parts by mass of styrene-acrylic resin particles having an average particle diameter of 5 μm were used as the fine particles to which the insulating protective layer composition was added, and the arithmetic average inclination of the surface of the insulating protective layer obtained was 35 °, the root-mean-square inclination was 43 °, the L ＊ value was 18, the 60 ° gloss was 0.8%, and the 85 ° gloss was 2.1%.
Comparative example 1
The conditions were the same as in example 1 except that the arithmetic mean inclination of the surface of the obtained insulating protective layer was 22 °, the root mean square inclination was 31 °, the value of L ＊ was 28, the 60 ° gloss was 2.0% and the 85 ° gloss was 43.4%.
Comparative example 2
The same procedure as in example 1 was repeated except that the insulating protective layer composition was added so that the black coloring agent was 5 parts by mass and no fine particles were added, the arithmetic mean inclination of the surface of the insulating protective layer obtained was 16 °, the root mean square inclination was 25 °, the L ＊ value was 27, the 60 ° gloss was 11.1%, and the 85 ° gloss was 36.7%.
Comparative example 3
The same procedure as in example 1 was repeated except that the insulating protective layer composition was added such that the black coloring agent was 5 parts by mass and no fine particles were added, the arithmetic mean gradient of the surface of the insulating protective layer obtained was 23 °, the root mean square gradient was 30 °, the L ＊ value was 25, the 60 ° gloss was 4.2%, and the 85 ° gloss was 33.1%.
Comparative example 4
The same as in comparative example 1 was applied except that a film having a surface roughness of 0.6 μm was used as the support film, the arithmetic mean inclination of the surface of the obtained insulating protective layer was 13 °, the root mean square inclination was 19 °, the L ＊ value was 28, the 60 ° gloss was 8.0%, and the 85 ° gloss was 43.1%.
Comparative example 5
The same procedure as in example 1 was repeated except that the fine particles added to the insulating protective layer composition were changed to 3 parts by mass of urethane resin particles having an average particle diameter of 7 μm, the arithmetic average inclination of the surface of the insulating protective layer obtained was 14 °, the root-mean-square inclination was 20 °, the L ＊ value was 26, the 60 ° gloss was 6.1%, and the 85 ° gloss was 36.9%.
The compositions and characteristics of the insulating protective layers of the examples and comparative examples are collectively shown in table 1.
[ Table 1]
In all of the insulating protective layers of examples 1 to 3 having an arithmetic mean inclination of the surface of 30 ° or more, no ink shrinkage (ringing) was observed and the printability was good. In addition, the insulating protective layers of examples 1 to 3 did not bleed out and were superior in visibility compared to the insulating protective layers of comparative examples.
Practicality of use
The electromagnetic wave shielding film of the present disclosure can print small-sized characters and the like with high accuracy, and is useful as an electromagnetic wave shielding film for electronic devices and the like.
Description of the symbols
110 insulating protective layer
120 shield layer
130 adhesive layer
140 an isotropic conductive adhesive layer.
Claims (2)
1. An electromagnetic wave shielding film, comprising:
an insulating protective layer and a shielding layer, wherein,
the arithmetic mean inclination of the surface of the insulating protective layer is 30 DEG or more,
the insulating protective layer has a 85 DEG gloss of 10% or less.
2. The electromagnetic wave-shielding film according to claim 1, wherein the insulating protective layer has a 85 ° gloss of 3% or less.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-024914 | 2016-02-12 | ||
| JP2016024914 | 2016-02-12 | ||
| PCT/JP2017/004941 WO2017138638A1 (en) | 2016-02-12 | 2017-02-10 | Electromagnetic-wave shield film |
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| CN108605425A CN108605425A (en) | 2018-09-28 |
| CN108605425B true CN108605425B (en) | 2020-04-07 |
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| JP (1) | JP6621487B2 (en) |
| KR (1) | KR102432750B1 (en) |
| CN (1) | CN108605425B (en) |
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| CN111818784B (en) * | 2016-09-06 | 2023-03-24 | 拓自达电线株式会社 | Electromagnetic wave shielding film |
| WO2019073737A1 (en) * | 2017-10-10 | 2019-04-18 | 東レ株式会社 | Film |
| JP6863908B2 (en) * | 2018-01-12 | 2021-04-21 | タツタ電線株式会社 | Electromagnetic wave shield film |
| TW201943330A (en) * | 2018-03-29 | 2019-11-01 | 日商拓自達電線股份有限公司 | Resin composition for protective layer of electromagnetic wave-shielding film, electromagnetic wave-shielding film, and method for producing electromagnetic wave-shielding film |
| JP6597927B1 (en) * | 2019-06-18 | 2019-10-30 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic shielding sheet and electromagnetic shielding wiring circuit board |
| TWI764350B (en) * | 2020-10-30 | 2022-05-11 | 臻鼎科技股份有限公司 | Electromagnetic shielding film and manufacturing method |
| TW202402154A (en) * | 2022-06-28 | 2024-01-01 | 日商拓自達電線股份有限公司 | Electromagnetic shielding film |
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| JP4360774B2 (en) * | 2002-03-29 | 2009-11-11 | タツタ電線株式会社 | Reinforcing shield film and shield flexible printed wiring board |
| JP4201548B2 (en) | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | SHIELD FILM, SHIELD FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM |
| JP5239444B2 (en) * | 2008-03-26 | 2013-07-17 | 大日本印刷株式会社 | Release paper manufacturing method and release paper manufacturing apparatus |
| US8138429B2 (en) * | 2008-12-17 | 2012-03-20 | 3M Innovative Properties Company | Electromagnetic shielding article |
| JP5736046B2 (en) * | 2010-06-23 | 2015-06-17 | インクテック カンパニー リミテッド | Method for producing electromagnetic wave shielding film and electromagnetic wave shielding film produced thereby |
| JP2014078574A (en) | 2012-10-10 | 2014-05-01 | Toyo Ink Sc Holdings Co Ltd | Electromagnetic wave-shielding coverlay film, method for manufacturing flexible printed wiring board, and flexible printed wiring board |
| JP5796690B1 (en) * | 2015-02-02 | 2015-10-21 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic shielding sheet and printed wiring board |
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- 2017-02-10 WO PCT/JP2017/004941 patent/WO2017138638A1/en active Application Filing
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| TW201803434A (en) | 2018-01-16 |
| JPWO2017138638A1 (en) | 2018-12-06 |
| KR20180113500A (en) | 2018-10-16 |
| JP6621487B2 (en) | 2019-12-18 |
| KR102432750B1 (en) | 2022-08-12 |
| WO2017138638A1 (en) | 2017-08-17 |
| CN108605425A (en) | 2018-09-28 |
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