TWI829647B - Electromagnetic wave shielding film - Google Patents
Electromagnetic wave shielding film Download PDFInfo
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- TWI829647B TWI829647B TW107132257A TW107132257A TWI829647B TW I829647 B TWI829647 B TW I829647B TW 107132257 A TW107132257 A TW 107132257A TW 107132257 A TW107132257 A TW 107132257A TW I829647 B TWI829647 B TW I829647B
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- insulating protective
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/406—Bright, glossy, shiny surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本發明之課題在於可實現一種既降低絕緣保護層的光澤度又使剝離膜的剝離性提高的電磁波屏蔽膜。 作為解決手段之本發明之電磁波屏蔽膜具備:絕緣保護層;導電性接著劑層;及剝離膜,隔著離型劑層設置於絕緣保護層中位在與導電性接著劑層為相反側的表面;並且,絕緣保護層的85°光澤度小於15,剝離膜之絕緣保護層側的面的85°光澤度小於3,離型劑層的厚度小於10μm。An object of the present invention is to realize an electromagnetic wave shielding film that reduces the glossiness of an insulating protective layer and improves the peelability of a release film. As a solution, the electromagnetic wave shielding film of the present invention includes: an insulating protective layer; a conductive adhesive layer; and a peeling film, which is provided in the middle of the insulating protective layer on the opposite side to the conductive adhesive layer with a release agent layer interposed therebetween. surface; and the 85° glossiness of the insulating protective layer is less than 15, the 85° glossiness of the surface of the peeling film on the insulating protective layer side is less than 3, and the thickness of the release agent layer is less than 10 μm.
Description
本發明係關於電磁波屏蔽膜及屏蔽配線基板。The present invention relates to an electromagnetic wave shielding film and a shielding wiring board.
背景技術 吾人對從外部無法視認印刷配線基板的電路圖案之設計進行研究。另一方面,於印刷配線基板表面黏貼用以遮蔽電磁雜訊的電磁波屏蔽膜。於電磁波屏蔽膜的絕緣保護層中,為了美觀及提高印刷字體的視認性等目的,添加有黑色系著色劑(例如參照專利文獻1)。藉由於印刷配線基板黏貼電磁波屏蔽膜,就可無法直接視認印刷配線基板的電路圖案。Background technology We conduct research on the design of a circuit pattern of a printed wiring board that cannot be seen from the outside. On the other hand, an electromagnetic wave shielding film for shielding electromagnetic noise is adhered to the surface of the printed wiring board. A black colorant is added to the insulating protective layer of the electromagnetic wave shielding film for the purpose of improving appearance and improving the visibility of printed characters (for example, see Patent Document 1). By attaching an electromagnetic wave shielding film to a printed wiring board, the circuit pattern of the printed wiring board cannot be directly recognized.
先行技術文獻 專利文獻 [專利文獻1]日本特開2016-143751號公報Advanced technical documents patent documents [Patent Document 1] Japanese Patent Application Publication No. 2016-143751
發明概要 發明欲解決之課題 然而,於印刷配線基板表面存在著電路圖案所造成的高低差。因此,縱使為了美觀及提高印刷字體的視認性等的目的而將絕緣保護層被黑色化的電磁波屏蔽膜黏貼於印刷配線基板,仍存在如下情形:電路圖案會因光反射等而浮出於電磁波屏蔽膜的表面,無法獲得充分的隱藏性。因此,需要進一步提高隱藏性的電磁波屏蔽膜。Summary of the invention The problem to be solved by the invention However, there is a height difference caused by the circuit pattern on the surface of the printed wiring board. Therefore, even if an electromagnetic wave shielding film in which the insulating protective layer is blackened is adhered to a printed wiring board for the purpose of improving the appearance, improving the visibility of printed characters, etc., there is still a case where the circuit pattern floats out of the electromagnetic wave due to light reflection, etc. The surface of the shielding film cannot achieve sufficient concealment. Therefore, there is a need for an electromagnetic wave shielding film that further improves concealment properties.
作為縮小絕緣保護層表面上的光反射的方法,考慮於絕緣保護層表面形成微細的凹凸。絕緣保護層可藉由於剝離膜表面塗佈樹脂組成物並使之乾燥而形成。此時,剝離膜表面的凹凸會轉印到絕緣保護層表面,藉由使用設置有凹凸的光澤度較小的剝離膜來形成絕緣保護層,可期待絕緣保護層的光澤度會降低。然而,若降低剝離膜的光澤度,恐使剝離膜的剝離變得困難,以致生產性降低或絕緣保護層表面受損。As a method of reducing light reflection on the surface of the insulating protective layer, it is considered to form fine irregularities on the surface of the insulating protective layer. The insulating protective layer can be formed by coating the surface of the release film with a resin composition and drying it. In this case, the unevenness on the surface of the release film will be transferred to the surface of the insulating protective layer. By using a release film with unevenness and low gloss to form the insulating protective layer, it is expected that the glossiness of the insulating protective layer will be reduced. However, if the glossiness of the release film is reduced, it may become difficult to peel off the release film, resulting in reduced productivity or damage to the surface of the insulating protective layer.
本發明之課題在於可實現一種既降低絕緣保護層的光澤度又使剝離膜的剝離性提高的電磁波屏蔽膜。An object of the present invention is to realize an electromagnetic wave shielding film that reduces the glossiness of an insulating protective layer and improves the peelability of a release film.
用以解決課題之手段 本發明之電磁波屏蔽膜之一態樣具備:絕緣保護層;導電性接著劑層;及剝離膜,隔著離型劑層設置於絕緣保護層中位在與導電性接著劑層為相反側的表面;並且,絕緣保護層的85°光澤度小於15,剝離膜之絕緣保護層側的表面的85°光澤度小於3,離型劑層的厚度小於10μm。means to solve problems One aspect of the electromagnetic wave shielding film of the present invention includes: an insulating protective layer; a conductive adhesive layer; and a peeling film, which is disposed in the middle of the insulating protective layer on the opposite side to the conductive adhesive layer with a release agent layer interposed therebetween. surface; and, the 85° glossiness of the insulating protective layer is less than 15, the 85° glossiness of the surface of the peeling film on the insulating protective layer side is less than 3, and the thickness of the release agent layer is less than 10 μm.
於電磁波屏蔽膜的一態樣中,絕緣保護層可含有黑色著色劑。In one aspect of the electromagnetic wave shielding film, the insulating protective layer may contain a black colorant.
本發明之屏蔽配線基板之一態樣具備:配線基板及本發明之電磁波屏蔽膜,其中,該配線基板具有基底層、設置於基底層上的電路圖案及以覆蓋電路圖案之方式接著於基底層的絕緣膜;該電磁波屏蔽膜係接著於絕緣膜上且已去除剝離膜。An aspect of the shielded wiring board of the present invention includes: a wiring board and the electromagnetic wave shielding film of the present invention, wherein the wiring board has a base layer, a circuit pattern provided on the base layer, and is connected to the base layer in a manner to cover the circuit pattern The insulating film; the electromagnetic wave shielding film is attached to the insulating film and the peeling film has been removed.
發明效果 根據本發明之電磁波屏蔽膜,可降低絕緣保護層的光澤度且使剝離膜的剝離性提高。Invention effect According to the electromagnetic wave shielding film of the present invention, the glossiness of the insulating protective layer can be reduced and the peelability of the release film can be improved.
用以實施發明之形態 如圖1所示,本實施形態之電磁波屏蔽膜101具有:導電性接著劑層111;絕緣保護層112;及剝離膜115,隔著離型劑層114設置於絕緣保護層112中位在與導電性接著劑層111為相反側的表面。絕緣保護層112的85°光澤度小於15,剝離膜115之絕緣保護層112側的面的85°光澤度小於3,離型劑層114的厚度小於10μm。Form used to implement the invention As shown in FIG. 1 , the electromagnetic wave shielding film 101 of this embodiment includes: a conductive adhesive layer 111; an insulating protective layer 112; and a release film 115, which is provided in the middle of the insulating protective layer 112 with a release agent layer 114 interposed therebetween. The conductive adhesive layer 111 is the opposite surface. The 85° glossiness of the insulating protective layer 112 is less than 15, the 85° glossiness of the surface of the release film 115 on the side of the insulating protective layer 112 is less than 3, and the thickness of the release agent layer 114 is less than 10 μm.
於圖1中,雖然於導電性接著劑層111與絕緣保護層112之間設置有導電性屏蔽層113,但導電性接著劑層111作為屏蔽而起作用時,亦可形成未設置屏蔽層113的構造。In FIG. 1 , although the conductive shielding layer 113 is provided between the conductive adhesive layer 111 and the insulating protective layer 112 , when the conductive adhesive layer 111 functions as a shield, it may also be formed without the shielding layer 113 . structure.
如圖2所示,本實施形態之電磁波屏蔽膜101可接著於印刷配線基板102而形成屏蔽配線基板。印刷配線基板102例如具有:基底層121、設置於基底層121表面的電路圖案122、及以覆蓋電路圖案122之方式透過接著劑層123接著於基底層121的絕緣膜124。As shown in FIG. 2 , the electromagnetic wave shielding film 101 of this embodiment can be adhered to the printed wiring board 102 to form a shielding wiring board. The printed wiring board 102 has, for example, a base layer 121, a circuit pattern 122 provided on the surface of the base layer 121, and an insulating film 124 adhered to the base layer 121 through an adhesive layer 123 so as to cover the circuit pattern 122.
若將絕緣保護層112著色使之不透明,就無法直接視認電路圖案122。然而,因為電路圖案122的關係,於絕緣保護層112的表面會形成凹凸。一般的電路圖案122係利用銅線形成,其高度為數μm~十幾μm。由於存在線的部分與不存在線的部分的高度差會因為填入接著劑層123及導電性接著劑層111而變小,故於絕緣保護層112表面產生的凹凸高度為數μm。然而,即使為這樣輕微的凹凸,於容易反射光之具有光澤的表面上亦可視認凹凸的存在,無法隱藏電路圖案122。If the insulating protective layer 112 is colored to make it opaque, the circuit pattern 122 cannot be directly viewed. However, due to the circuit pattern 122, unevenness may be formed on the surface of the insulating protective layer 112. The general circuit pattern 122 is formed using copper wires, and its height is several μm to more than ten μm. Since the height difference between the portion where the line exists and the portion where the line does not exist becomes smaller due to filling of the adhesive layer 123 and the conductive adhesive layer 111, the height of the unevenness generated on the surface of the insulating protective layer 112 is several μm. However, even with such slight unevenness, the existence of unevenness can be seen on a glossy surface that easily reflects light, and the circuit pattern 122 cannot be hidden.
本案發明人等發現:藉由使絕緣保護層112的85°光澤度小於15、較佳為小於13、更佳為小於10,可大幅提高電路圖案的隱藏性。再者,絕緣保護層112的85°光澤度可藉由根據JIS Z 8741的方法進行測定。The inventors of this case discovered that by making the 85° glossiness of the insulating protective layer 112 less than 15, preferably less than 13, and more preferably less than 10, the concealability of the circuit pattern can be greatly improved. Furthermore, the 85° glossiness of the insulating protective layer 112 can be measured by the method according to JIS Z 8741.
絕緣保護層112可藉由於剝離膜115表面塗佈絕緣保護層用樹脂組成物並使之成為片狀而形成。此時,剝離膜表面115的凹凸會轉印到絕緣保護層112表面。因此,若使用表面粗糙度較大、即光澤度較低的剝離膜117來形成絕緣保護層112,可望獲得光澤度較低的絕緣保護層112。然而,若降低剝離膜115的光澤度,則剝離膜115與絕緣保護層112的密著性變高,剝離剝離膜115時需要大的力量。若剝離所需的力量變大,則不僅生產性降低,且有破壞絕緣保護層112使之產生缺損之虞。由於剝離膜115係在將電磁波屏蔽膜101接著於印刷配線基板102後才剝離,故若剝離膜115不能乾淨地剝離,則最終製品會成為不良品。The insulating protective layer 112 can be formed by applying a resin composition for an insulating protective layer to the surface of the release film 115 and forming it into a sheet shape. At this time, the unevenness on the surface of the release film 115 will be transferred to the surface of the insulating protective layer 112 . Therefore, if the release film 117 with relatively large surface roughness, that is, low gloss, is used to form the insulating protective layer 112, it is expected to obtain the insulating protective layer 112 with low gloss. However, if the glossiness of the release film 115 is lowered, the adhesion between the release film 115 and the insulating protective layer 112 becomes higher, and a large force is required to peel off the release film 115 . If the force required for peeling increases, not only the productivity decreases, but also the insulating protective layer 112 may be damaged and damaged. Since the release film 115 is peeled off after the electromagnetic wave shielding film 101 is adhered to the printed wiring board 102, if the release film 115 cannot be peeled off cleanly, the final product may become a defective product.
若增厚設置於剝離膜115表面的離型劑層114,剝離膜115的剝離會變得容易。然而此時,由於存在於剝離膜115表面的凹凸會被離型劑填補,故絕緣保護層112表面變得平滑,導致光澤度上升。If the release agent layer 114 provided on the surface of the release film 115 is thickened, the release film 115 can be easily peeled off. However, at this time, since the unevenness existing on the surface of the release film 115 will be filled by the release agent, the surface of the insulating protective layer 112 becomes smooth, resulting in an increase in gloss.
經本案發明人等研究後,結果發現:在85°光澤度小於3的剝離膜115表面設置厚度為0.1μm以上、宜為0.4μm以上且小於10μm、較佳為小於4μm的離型劑層114時,可使所形成的絕緣保護層112的85°光澤度小於15且可使剝離膜115的剝離性良好。再者,剝離膜115的85°光澤度及剝離性可藉由實施例記載的方法進行測定。After research by the inventors of this case, it was found that a release agent layer 114 with a thickness of 0.1 μm or more, preferably 0.4 μm or more and less than 10 μm, and preferably less than 4 μm is provided on the surface of the release film 115 with an 85° glossiness of less than 3. , the 85° glossiness of the formed insulating protective layer 112 can be made less than 15, and the peelability of the peeling film 115 can be made good. In addition, the 85° glossiness and peelability of the release film 115 can be measured by the method described in the Example.
剝離膜115只要光澤度滿足預定值,其材質並無特別限定,例如可使用聚烯烴系、聚酯系、聚醯亞胺系或聚苯硫醚系等的膜。剝離膜的厚度並無特別限定,由剝離性之觀點而言宜為25μm以上且100μm以下。The material of the release film 115 is not particularly limited as long as the glossiness satisfies a predetermined value. For example, a polyolefin-based, polyester-based, polyimide-based or polyphenylene sulfide-based film may be used. The thickness of the release film is not particularly limited, but from the viewpoint of releasability, it is preferably 25 μm or more and 100 μm or less.
離型劑層114只要滿足預定厚度,其材質並無特別限定,例如可使用三聚氰胺系樹脂、聚烯烴系樹脂、環氧系樹脂、醇酸系樹脂、氟系樹脂、丙烯酸系樹脂、石蠟樹脂、脲樹脂等。離型劑層的厚度可應用各種塗佈方法的厚度調整方法,以直接凹版印刷方式為例,可藉由進行版的線數、版深的調整或塗佈劑的固體成分的調整等來控制。又,離型劑層的厚度可藉由實施例所示方法進行測定。As long as the release agent layer 114 meets a predetermined thickness, its material is not particularly limited. For example, melamine resin, polyolefin resin, epoxy resin, alkyd resin, fluorine resin, acrylic resin, paraffin resin, Urea resin, etc. The thickness of the release agent layer can be adjusted using various coating methods. Taking direct gravure printing as an example, it can be controlled by adjusting the number of lines and depth of the plate, or adjusting the solid content of the coating agent. . In addition, the thickness of the release agent layer can be measured by the method shown in the embodiment.
絕緣保護層112可藉由熱塑性樹脂、熱硬化性樹脂或活性能量線硬化性樹脂等形成。關於熱塑性樹脂並無特別限定,可使用:苯乙烯系樹脂、乙酸乙烯酯系樹脂、聚酯系樹脂、聚乙烯系樹脂、聚丙烯系樹脂、醯亞胺系樹脂或丙烯酸系樹脂等。關於熱硬化性樹脂並無特別限定,可使用:酚系樹脂、環氧系樹脂、於末端具有異氰酸酯基的胺基甲酸酯系樹脂、於末端具有異氰酸酯基的脲系樹脂、於末端具有異氰酸酯基的胺基甲酸酯脲系樹脂、三聚氰胺系樹脂或醇酸系樹脂等。又,關於活性能量線硬化性樹脂並無特別限定,例如可使用分子中具有至少2個(甲基)丙烯醯氧基的聚合性化合物等。此等樹脂可單獨使用,亦可併用二種以上。The insulating protective layer 112 may be formed of thermoplastic resin, thermosetting resin, active energy ray curable resin, or the like. The thermoplastic resin is not particularly limited, and styrene-based resin, vinyl acetate-based resin, polyester-based resin, polyethylene-based resin, polypropylene-based resin, imide-based resin, acrylic resin, etc. can be used. The thermosetting resin is not particularly limited, and phenolic resins, epoxy resins, urethane resins having an isocyanate group at the terminal, urea resins having an isocyanate group at the terminal, and urea resins having an isocyanate group at the terminal can be used. Based on urethane urea resin, melamine resin or alkyd resin, etc. In addition, the active energy ray curable resin is not particularly limited, and for example, a polymerizable compound having at least two (meth)acryloxy groups in the molecule can be used. These resins can be used alone, or two or more types can be used in combination.
由減低光澤度之觀點而言,絕緣保護層112宜包含黑色系著色劑。黑色系著色劑可為黑色顏料、或將複數種顏料進行減色混合而黑色化的混合顏料等。黑色顏料例如可為碳黑、科琴碳黑、奈米碳管(CNT)、苝黑、鈦黑、鐵黑及苯胺黑等任一種或此等之組合。混合顏料例如可將紅色、綠色、藍色、黄色、紫色、青色及品紅等顏料混合後使用。由減低光澤度之觀點而言,黑色系著色劑的添加量宜設成相對於樹脂100質量份為0.5質量%以上、較佳為1質量%以上。From the viewpoint of reducing gloss, the insulating protective layer 112 preferably contains a black colorant. The black colorant may be a black pigment or a mixed pigment obtained by subtractively mixing a plurality of pigments to make the mixture black. The black pigment may be, for example, any one of carbon black, Ketjen black, carbon nanotube (CNT), perylene black, titanium black, iron black and aniline black or a combination thereof. The mixed pigment can be used by mixing red, green, blue, yellow, purple, cyan, magenta and other pigments, for example. From the viewpoint of reducing the glossiness, the amount of the black colorant added is preferably 0.5% by mass or more, preferably 1% by mass or more, based on 100 parts by mass of the resin.
於絕緣保護層112亦可視需要包含如下至少一種:硬化促進劑、賦黏劑、抗氧化劑、塑化劑、紫外線吸收劑、消泡劑、調平劑、填充劑、阻燃劑、黏度調節劑及抗結塊劑等。The insulating protective layer 112 may optionally contain at least one of the following: hardening accelerator, tackifier, antioxidant, plasticizer, ultraviolet absorber, defoaming agent, leveling agent, filler, flame retardant, viscosity regulator and anti-caking agents, etc.
又,絕緣保護層112的厚度並無特別限定,可視需要適當設定,可設為1μm以上、較佳為4μm以上,且可設為20μm以下、較佳為10μm以下、更佳為5μm以下。藉由將絕緣保護層112的厚度設為1μm以上,可充分地保護導電性接著劑層111及屏蔽層113。藉由將絕緣保護層112的厚度設為20μm以下,可確保電磁波屏蔽膜101的彎曲性,容易將電磁波屏蔽膜101應用於要求彎曲性的構件。In addition, the thickness of the insulating protective layer 112 is not particularly limited and can be appropriately set as needed. It can be 1 μm or more, preferably 4 μm or more, and can be 20 μm or less, preferably 10 μm or less, and more preferably 5 μm or less. By setting the thickness of the insulating protective layer 112 to 1 μm or more, the conductive adhesive layer 111 and the shielding layer 113 can be fully protected. By setting the thickness of the insulating protective layer 112 to 20 μm or less, the flexibility of the electromagnetic wave shielding film 101 can be ensured, and the electromagnetic wave shielding film 101 can be easily applied to members requiring flexibility.
設置屏蔽層113時,屏蔽層113可藉由金屬箔、蒸鍍膜及導電性填料等形成。When the shielding layer 113 is provided, the shielding layer 113 can be formed of metal foil, evaporated film, conductive filler, etc.
金屬箔並無特別限定,可作成由鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦及鋅等任一種、或包含2種以上之合金構成的箔。The metal foil is not particularly limited, and may be made of any one of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, or the like, or a foil containing two or more alloys.
蒸鍍膜並無特別限定,可蒸鍍鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦及鋅等而形成。蒸鍍上可使用電解鍍覆法、無電鍍覆法、濺鍍法、電子束蒸鍍法、真空蒸鍍法、化學氣相沉積(CVD)法或金屬有機化學氣相沉積(MOCVD)法等。The vapor deposition film is not particularly limited, and can be formed by vapor deposition of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, etc. For evaporation, electrolytic plating, electroless plating, sputtering, electron beam evaporation, vacuum evaporation, chemical vapor deposition (CVD) or metal organic chemical vapor deposition (MOCVD) can be used. .
藉由導電性填料形成屏蔽層113之情形,藉由將調配有導電性填料的溶劑塗佈於絕緣保護層112表面後使之乾燥,可形成屏蔽層113。導電性填料可使用金屬填料、金屬被覆樹脂填料、碳填料及其等之混合物。關於金屬填料,可使用:銅粉、銀粉、鎳粉、銀包銅粉、金包銅粉、銀包鎳粉及金包鎳粉等。此等金屬粉可藉由電解法、霧化法、還原法製作。金屬粉的形狀可列舉球狀、小片狀、纖維狀、樹枝狀等。When the shielding layer 113 is formed by a conductive filler, the shielding layer 113 can be formed by applying a solvent mixed with the conductive filler on the surface of the insulating protective layer 112 and then drying it. As the conductive filler, metal fillers, metal-coated resin fillers, carbon fillers, and mixtures thereof can be used. Regarding metal fillers, you can use: copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, gold-coated nickel powder, etc. These metal powders can be produced by electrolysis, atomization, and reduction. The shapes of metal powder include spherical, flake, fibrous, dendritic, etc.
於本實施形態中,屏蔽層113的厚度可以按照所要求的電磁屏蔽效果及反覆彎曲、滑動耐受性進行適當選擇即可,在屏蔽層113為金屬箔時,由確保斷裂伸度之觀點而言,屏蔽層113厚度宜為12μm以下。In this embodiment, the thickness of the shielding layer 113 can be appropriately selected according to the required electromagnetic shielding effect and repeated bending and sliding resistance. When the shielding layer 113 is a metal foil, the thickness is selected from the perspective of ensuring the breaking elongation. In other words, the thickness of the shielding layer 113 is preferably less than 12 μm.
於本實施形態中,導電性接著劑層111包含熱塑性樹脂、熱硬化性樹脂及活性能量線硬化性樹脂等至少一種、與導電性填料。In this embodiment, the conductive adhesive layer 111 includes at least one of a thermoplastic resin, a thermosetting resin, an active energy ray curable resin, and a conductive filler.
導電性接著劑層111包含熱塑性樹脂時,關於熱塑性樹脂例如可使用:苯乙烯系樹脂、乙酸乙烯酯系樹脂、聚酯系樹脂、聚乙烯系樹脂、聚丙烯系樹脂、醯亞胺系樹脂及丙烯酸系樹脂等。此等樹脂可單獨使用一種,亦可併用二種以上。When the conductive adhesive layer 111 contains a thermoplastic resin, examples of the thermoplastic resin that can be used include: styrene-based resin, vinyl acetate-based resin, polyester-based resin, polyethylene-based resin, polypropylene-based resin, imide-based resin, and Acrylic resin, etc. One type of these resins may be used alone, or two or more types may be used in combination.
導電性接著劑層111包含熱硬化性樹脂時,關於熱硬化性樹脂例如可使用:酚系樹脂、環氧系樹脂、胺基甲酸酯系樹脂、三聚氰胺系樹脂、聚醯胺系樹脂及醇酸系樹脂等。關於活性能量線硬化性樹脂並無特別限定,例如可使用分子中具有至少2個(甲基)丙烯醯氧基的聚合性化合物等。此等樹脂可單獨使用一種,亦可併用二種以上。When the conductive adhesive layer 111 contains a thermosetting resin, for example, the thermosetting resin can use: phenol resin, epoxy resin, urethane resin, melamine resin, polyamide resin, and alcohol. Acid resin, etc. The active energy ray-curable resin is not particularly limited, and for example, a polymerizable compound having at least two (meth)acryloxy groups in the molecule can be used. One type of these resins may be used alone, or two or more types may be used in combination.
熱硬化性樹脂例如包含:具有反應性第1官能基的第1樹脂成分、及會與第1官能基進行反應的第2樹脂成分。第1官能基,例如可設為環氧基、醯胺基或羥基等。第2官能基只要根據第1官能基進行選擇即可,例如第1官能基為環氧基時,第2官能基可設為羥基、羧基、環氧基及胺基等。具體而言,例如將第1樹脂成分設為環氧樹脂時,作為第2樹脂成分可使用:環氧基改質聚酯樹脂、環氧基改質聚醯胺樹脂、環氧基改質丙烯酸樹脂、環氧基改質聚胺基甲酸酯聚脲樹脂、羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質丙烯酸樹脂、羧基改質聚胺基甲酸酯聚脲樹脂及胺基甲酸酯改質聚酯樹脂等。此等之中,較佳為羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質聚胺基甲酸酯聚脲樹脂及胺基甲酸酯改質聚酯樹脂。又,第1樹脂成分為羥基時,作為第2樹脂成分可使用:環氧基改質聚酯樹脂、環氧基改質聚醯胺樹脂、環氧基改質丙烯酸樹脂、環氧基改質聚胺基甲酸酯聚脲樹脂、羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質丙烯酸樹脂、羧基改質聚胺基甲酸酯聚脲樹脂及胺基甲酸酯改質聚酯樹脂等。此等之中,較佳為羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質聚胺基甲酸酯聚脲樹脂及胺基甲酸酯改質聚酯樹脂。The thermosetting resin includes, for example, a first resin component having a reactive first functional group and a second resin component that reacts with the first functional group. The first functional group can be, for example, an epoxy group, a amide group, a hydroxyl group, or the like. The second functional group may be selected based on the first functional group. For example, when the first functional group is an epoxy group, the second functional group may be a hydroxyl group, a carboxyl group, an epoxy group, an amine group, or the like. Specifically, for example, when the first resin component is an epoxy resin, as the second resin component, epoxy-modified polyester resin, epoxy-modified polyamide resin, and epoxy-modified acrylic resin can be used. Resin, epoxy modified polyurethane polyurea resin, carboxyl modified polyester resin, carboxyl modified polyamide resin, carboxyl modified acrylic resin, carboxyl modified polyurethane polyurea resin And urethane modified polyester resin, etc. Among these, carboxyl-modified polyester resin, carboxyl-modified polyamide resin, carboxyl-modified polyurethane polyurea resin, and urethane-modified polyester resin are preferred. In addition, when the first resin component is a hydroxyl group, as the second resin component, the following can be used: epoxy-modified polyester resin, epoxy-modified polyamide resin, epoxy-modified acrylic resin, epoxy-modified Polyurethane polyurea resin, carboxyl modified polyester resin, carboxyl modified polyamide resin, carboxyl modified acrylic resin, carboxyl modified polyurethane polyurea resin and urethane modified Quality polyester resin, etc. Among these, carboxyl-modified polyester resin, carboxyl-modified polyamide resin, carboxyl-modified polyurethane polyurea resin, and urethane-modified polyester resin are preferred.
熱硬化性樹脂亦可包含用以促進熱硬化反應的硬化劑。熱硬化性樹脂具有第1官能基與第2官能基時,硬化劑可根據第1官能基及第2官能基的種類而適當選擇。第1官能基為環氧基、第2官能基為羥基時,硬化劑可使用咪唑系硬化劑、酚系硬化劑及陽離子系硬化劑等。此等硬化劑可單獨使用一種,亦可併用二種以上。此外,關於任意成分亦可包含消泡劑、抗氧化劑、黏度調整劑、稀釋劑、防沉劑、調平劑、偶合劑、著色劑及阻燃劑等。The thermosetting resin may also contain a hardener for accelerating the thermosetting reaction. When the thermosetting resin has a first functional group and a second functional group, the curing agent can be appropriately selected according to the types of the first functional group and the second functional group. When the first functional group is an epoxy group and the second functional group is a hydroxyl group, imidazole-based hardeners, phenol-based hardeners, cationic hardeners, etc. can be used as the hardener. One type of these hardeners may be used alone, or two or more types may be used in combination. In addition, any ingredients may also include defoaming agents, antioxidants, viscosity adjusters, diluents, anti-settling agents, leveling agents, coupling agents, colorants, flame retardants, etc.
導電性填料並無特別限定,例如可使用金屬填料、金屬被覆樹脂填料、碳填料及其等之混合物。關於金屬填料,可列舉:銅粉、銀粉、鎳粉、銀包銅粉、金包銅粉、銀包鎳粉及金包鎳粉等。此等金屬粉可藉由電解法、霧化法或還原法等製作。其中,較佳為銀粉、銀包銅粉及銅粉中之任一種。The conductive filler is not particularly limited, and for example, metal fillers, metal-coated resin fillers, carbon fillers, and mixtures thereof can be used. Regarding metal fillers, examples include: copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, gold-coated nickel powder, etc. These metal powders can be produced by electrolysis, atomization or reduction. Among them, any one of silver powder, silver-coated copper powder and copper powder is preferred.
由填料彼此接觸之觀點而言,導電性填料的平均粒徑較佳為1μm以上、更佳為3μm以上,且較佳為50μm以下、更佳為40μm以下。導電性填料的形狀並無特別限定,可作成球狀、小片狀、樹枝狀或纖維狀等。From the viewpoint of fillers being in contact with each other, the average particle size of the conductive filler is preferably 1 μm or more, more preferably 3 μm or more, and is preferably 50 μm or less, more preferably 40 μm or less. The shape of the conductive filler is not particularly limited and may be spherical, flake-like, dendritic, fibrous, etc.
導電性填料的含量可根據用途適當選擇,於總固體成分中較佳為5質量%以上、更佳為10質量%以上,且較佳為95質量%以下、更佳為90質量%以下。由填埋性之觀點而言,較佳為70質量%以下、更佳為60質量%以下。又,於實現各向異性導電性時,較佳為40質量%以下、更佳為35質量%以下。The content of the conductive filler can be appropriately selected according to the use, but it is preferably 5 mass% or more, more preferably 10 mass% or more, and more preferably 95 mass% or less, more preferably 90 mass% or less in the total solid content. From the viewpoint of landfillability, the content is preferably 70 mass% or less, and more preferably 60 mass% or less. In addition, when achieving anisotropic conductivity, the content is preferably 40 mass% or less, and more preferably 35 mass% or less.
由填埋性之觀點而言,導電性接著劑層111的厚度宜為1μm~50μm。From the viewpoint of embedding properties, the thickness of the conductive adhesive layer 111 is preferably 1 μm to 50 μm.
[實施例] 以下,使用實施例進一步詳細地說明本發明之電磁波屏蔽膜。以下實施例為例示,並非意欲限定本發明。[Example] Hereinafter, the electromagnetic wave shielding film of the present invention will be described in further detail using examples. The following examples are examples and are not intended to limit the present invention.
<製作電磁波屏蔽膜> 於具有預定光澤度且由聚對苯二甲酸乙二酯(PET)構成的剝離膜之成為絕緣層側的面,使用線棒塗佈離型劑,形成預定厚度的離型劑層。離型劑層的厚度係利用光干涉式膜厚計(K-MAC公司製、ST-2000-DLXn)進行測定。於經形成離型劑層的剝離膜之形成有離型劑層側的面,使用線棒塗佈絕緣保護層用組成物,並進行加熱乾燥,藉此形成厚度為5μm的絕緣保護層。接著,於絕緣保護層上形成0.1μm的Ag蒸鍍膜作為屏蔽層。於屏蔽層上藉由線棒塗佈導電性接著劑層用組成物後,進行100℃×3分鐘的乾燥,形成厚度為15μm的導電性接著劑層。<Production of electromagnetic wave shielding film> A release agent is applied to the surface of the release film made of polyethylene terephthalate (PET) that has a predetermined glossiness and is on the insulating layer side using a wire bar to form a release agent layer with a predetermined thickness. The thickness of the release agent layer was measured using an optical interference type film thickness meter (ST-2000-DLXn, manufactured by K-MAC Corporation). The composition for an insulating protective layer was applied using a wire bar on the surface of the release film on which the release agent layer was formed, and the composition was heated and dried to form an insulating protective layer with a thickness of 5 μm. Next, a 0.1 μm Ag evaporated film was formed on the insulating protective layer as a shielding layer. After applying the composition for the conductive adhesive layer on the shielding layer with a wire bar, it was dried at 100° C. for 3 minutes to form a conductive adhesive layer with a thickness of 15 μm.
於離型劑使用醇酸樹脂系者。絕緣保護層作成2層構造,係厚度為2μm的聚酯系透明樹脂的硬塗層、與厚度為3μm的含碳黑的環氧系黑色樹脂的軟塗層。導電性接著劑層用組成物係設定為於含磷系阻燃劑之環氧系樹脂中使用銀被覆銅粉之導電性粒子者。Use alkyd resin as a release agent. The insulating protective layer has a two-layer structure, which is a hard coat layer of polyester transparent resin with a thickness of 2 μm and a soft layer of epoxy black resin containing carbon black with a thickness of 3 μm. The composition for the conductive adhesive layer is set to use conductive particles of silver-coated copper powder in an epoxy resin containing a phosphorus-based flame retardant.
<製作屏蔽配線基板> 使用加壓機於溫度:170℃、時間:3分鐘、壓力:2~3MPa的條件下將獲得的電磁波屏蔽膜與印刷配線基板進行接著,製成屏蔽配線基板。<Preparation of shielded wiring board> The obtained electromagnetic wave shielding film and the printed wiring board were bonded using a press machine under conditions of temperature: 170°C, time: 3 minutes, and pressure: 2 to 3 MPa to prepare a shielding wiring board.
印刷配線基板係使用於由聚醯亞胺膜構成的基底層121上形成有如圖3所示電路圖案122者。電路圖案122係藉由線寬0.1mm、高度12μm的銅箔形成。於基底層121上,以被覆電路圖案之方式設置有厚度為25μm的接著劑層、與厚度為12.5μm的由聚醯亞胺膜構成的覆蓋層(絕緣膜)。The printed wiring board is one in which a circuit pattern 122 as shown in FIG. 3 is formed on a base layer 121 made of a polyimide film. The circuit pattern 122 is formed of copper foil with a line width of 0.1 mm and a height of 12 μm. On the base layer 121, an adhesive layer with a thickness of 25 μm and a covering layer (insulating film) composed of a polyimide film with a thickness of 12.5 μm are provided to cover the circuit pattern.
<評價剝離性> 將電磁波屏蔽膜接著於印刷配線基板後,使用剝離強度測試儀((股)PALMEC製、PFT50S)以樣品寬度10mm、剝離角度170°、剝離速度1000mm/min評價表面剝離膜的剝離性。於剝離時可無材料破損地剝離剝離膜之情形視為剝離性良好,於剝離時剝離膜材料破損之情形視為剝離性不良。<Evaluation of peelability> After the electromagnetic wave shielding film was adhered to the printed wiring board, a peel strength tester (PFT50S manufactured by PALMEC Co., Ltd.) was used to evaluate the peelability of the surface peeling film at a sample width of 10 mm, a peeling angle of 170°, and a peeling speed of 1000mm/min. When the release film can be peeled off without material damage during peeling, the peelability is considered to be good, and when the release film material is damaged during peeling, the peelability is considered to be poor.
<測定光澤度> 85°光澤度係使用攜帶型光澤度計(BYK加德納·微光澤計、東洋精機製作所),根據JIS Z 8741進行。<Measurement of Glossiness> The 85° glossiness was measured in accordance with JIS Z 8741 using a portable gloss meter (BYK Gardner Microgloss Meter, Toyo Seiki Co., Ltd.).
剝離膜的光澤度係對塗佈離型劑前的剝離膜之成為絕緣層保護層側的面進行測定。The glossiness of the release film is measured on the side of the release film that becomes the insulating layer protective layer before applying the release agent.
絕緣保護層的光澤度係於將電磁波屏蔽膜接著於印刷配線基板並將剝離膜剝離後才進行測定。The glossiness of the insulating protective layer is measured after the electromagnetic wave shielding film is adhered to the printed wiring board and the release film is peeled off.
<評價隱藏性> 將接著有電磁波屏蔽膜的屏蔽配線基板放置於平坦的桌面上,於屏蔽配線基板表面的照度為800-1000勒克司的環境下,評價從電磁波屏蔽膜側是否可視認電路圖案。視認角度設定成相對於電磁波屏蔽膜面為0~180度的範圍。無法視認電路圖案時,視為隱藏性良好(○),可視認電路圖案時,視為隱藏性不良(×)。<Evaluation Hiddenness> Place the shielded wiring board with the electromagnetic wave shielding film attached on a flat tabletop, and evaluate whether the circuit pattern is visible from the side of the electromagnetic wave shielding film in an environment where the illumination on the surface of the shielding wiring board is 800-1000 lux. The viewing angle is set in the range of 0 to 180 degrees relative to the electromagnetic wave shielding film surface. When the circuit pattern cannot be visually recognized, it is regarded as good concealment (○), and when the circuit pattern is visible, it is regarded as poor concealment (×).
(實施例1) 使用厚度為50μm、85°光澤度為2.3的PET膜作為剝離膜。於剝離膜之成為絕緣保護層側的面形成厚度為0.7μm的離型劑層。剝離膜的剝離性為良好。剝離剝離膜後的絕緣保護層的85°光澤度為9.2。又,隱藏性為良好。(Example 1) A PET film with a thickness of 50 μm and an 85° glossiness of 2.3 was used as the release film. A release agent layer with a thickness of 0.7 μm was formed on the surface of the release film that becomes the insulating protective layer. The peelability of the release film was good. The 85° glossiness of the insulating protective layer after peeling off the release film is 9.2. Also, the concealability is good.
(實施例2) 使用厚度為50μm、85°光澤度為2.3的PET膜作為剝離膜。於剝離膜之成為絕緣保護層側的面形成厚度為3.0μm的離型劑層。剝離膜的剝離性為良好。剝離剝離膜後的絕緣保護層的85°光澤度為9.6。又,隱藏性為良好。(Example 2) A PET film with a thickness of 50 μm and an 85° glossiness of 2.3 was used as the release film. A release agent layer with a thickness of 3.0 μm was formed on the surface of the release film that becomes the insulating protective layer. The peelability of the release film was good. The 85° glossiness of the insulating protective layer after peeling off the release film is 9.6. Also, the concealability is good.
(比較例1) 使用厚度為50μm、85°光澤度為19.3的PET膜作為剝離膜。於剝離膜之成為絕緣保護層側的面形成厚度為0.4μm的離型劑層。剝離膜的剝離性為良好。剝離剝離膜後的絕緣保護層的85°光澤度為35.4。又,隱藏性為不良。(Comparative example 1) A PET film with a thickness of 50 μm and an 85° glossiness of 19.3 was used as the release film. A release agent layer with a thickness of 0.4 μm was formed on the surface of the release film that becomes the insulating protective layer. The peelability of the release film was good. The 85° glossiness of the insulating protective layer after peeling off the release film is 35.4. Also, concealment is bad.
(比較例2) 使用厚度為50μm、85°光澤度為2.3的PET膜作為剝離膜。於剝離膜之成為絕緣保護層側的面形成厚度為10.0μm的離型劑層。剝離膜的剝離性為不良。剝離剝離膜後的絕緣保護層的85°光澤度為15.5。又,隱藏性為不良。(Comparative example 2) A PET film with a thickness of 50 μm and an 85° glossiness of 2.3 was used as the release film. A release agent layer with a thickness of 10.0 μm was formed on the surface of the release film that becomes the insulating protective layer. The peelability of the release film was poor. The 85° glossiness of the insulating protective layer after peeling off the release film is 15.5. Also, concealment is bad.
(比較例3) 使用厚度為50μm、85°光澤度為2.3的PET膜作為剝離膜。於剝離膜之成為絕緣保護層側的面形成厚度為0.05μm的離型劑層。剝離膜的剝離性為不良。(Comparative example 3) A PET film with a thickness of 50 μm and an 85° glossiness of 2.3 was used as the release film. A release agent layer with a thickness of 0.05 μm was formed on the surface of the release film that becomes the insulating protective layer. The peelability of the release film was poor.
於表1彙總顯示各實施形態及比較例。Table 1 summarizes each embodiment and comparative examples.
[表1]
產業上之可利用性 本發明之電磁波屏蔽膜其絕緣保護層的光澤度較低且可容易將剝離膜剝離,適合作為電磁波屏蔽膜等。industrial availability The electromagnetic wave shielding film of the present invention has a low glossiness of the insulating protective layer and the release film can be easily peeled off, so it is suitable as an electromagnetic wave shielding film and the like.
101‧‧‧電磁波屏蔽膜 102‧‧‧印刷配線基板 111‧‧‧導電性接著劑層 112‧‧‧絕緣保護層 113‧‧‧屏蔽層 114‧‧‧離型劑層 115‧‧‧剝離膜 121‧‧‧基底層 122‧‧‧電路圖案 123‧‧‧接著劑層 124‧‧‧絕緣膜101‧‧‧Electromagnetic wave shielding film 102‧‧‧Printed wiring board 111‧‧‧Conductive adhesive layer 112‧‧‧Insulating protective layer 113‧‧‧shielding layer 114‧‧‧Release agent layer 115‧‧‧Peel-off film 121‧‧‧Basilar layer 122‧‧‧Circuit pattern 123‧‧‧Adhesive layer 124‧‧‧Insulation film
圖1係顯示一實施形態之電磁波屏蔽膜的截面圖。 圖2係顯示一實施形態之屏蔽配線基板的截面圖。 圖3係顯示隱藏性評價用的電路圖案的俯視圖。FIG. 1 is a cross-sectional view showing an electromagnetic wave shielding film according to an embodiment. FIG. 2 is a cross-sectional view of a shielded wiring board according to an embodiment. FIG. 3 is a plan view showing a circuit pattern for concealment evaluation.
101‧‧‧電磁波屏蔽膜 101‧‧‧Electromagnetic wave shielding film
102‧‧‧印刷配線基板 102‧‧‧Printed wiring board
111‧‧‧導電性接著劑層 111‧‧‧Conductive adhesive layer
112‧‧‧絕緣保護層 112‧‧‧Insulating protective layer
113‧‧‧屏蔽層 113‧‧‧shielding layer
121‧‧‧基底層 121‧‧‧Basilar layer
122‧‧‧電路圖案 122‧‧‧Circuit pattern
123‧‧‧接著劑層 123‧‧‧Adhesive layer
124‧‧‧絕緣膜 124‧‧‧Insulation film
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JP2018003474A JP6863908B2 (en) | 2018-01-12 | 2018-01-12 | Electromagnetic wave shield film |
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KR (1) | KR102412598B1 (en) |
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TWI730395B (en) * | 2019-09-04 | 2021-06-11 | 同泰電子科技股份有限公司 | Electromagnetic interference shielding structure, flexible circuit board having electromagnetic interference shielding structure and manufacturing method thereof |
JP6956926B1 (en) * | 2020-01-07 | 2021-11-02 | タツタ電線株式会社 | Electromagnetic wave shield film |
TWI844723B (en) | 2020-01-09 | 2024-06-11 | 日商拓自達電線股份有限公司 | Shape transfer film |
CN111491441B (en) | 2020-04-23 | 2021-10-26 | 京东方科技集团股份有限公司 | Circuit board structure and display device |
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JP2016063117A (en) * | 2014-09-19 | 2016-04-25 | 信越ポリマー株式会社 | Electromagnetic wave shield film, electromagnetic wave shield film-attached flexible printed wiring board, and manufacturing methods thereof |
WO2017138638A1 (en) * | 2016-02-12 | 2017-08-17 | タツタ電線株式会社 | Electromagnetic-wave shield film |
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DE4135096A1 (en) * | 1991-10-24 | 1993-04-29 | Hoechst Ag | SEALABLE, MATTE BIAXIAL-ORIENTED POLYOLEFIN MULTILAYER FILM, METHOD FOR THEIR PRODUCTION AND THEIR USE |
JP4330320B2 (en) * | 2002-09-27 | 2009-09-16 | 大日本印刷株式会社 | Matt layer forming composition and release sheet using the same |
TWI613956B (en) * | 2012-11-19 | 2018-02-01 | Tatsuta Electric Wire & Cable Co Ltd | Laminated film and mask printed wiring board |
JP6229409B2 (en) * | 2013-09-30 | 2017-11-15 | 東レ株式会社 | Biaxially oriented polyester film for mold release |
JP5796690B1 (en) * | 2015-02-02 | 2015-10-21 | 東洋インキScホールディングス株式会社 | Electromagnetic shielding sheet and printed wiring board |
CN105120643B (en) * | 2015-06-30 | 2019-04-19 | 保定乐凯新材料股份有限公司 | A kind of thermoplasticity electromagnetic shielding film for rapid processing |
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JP2016063117A (en) * | 2014-09-19 | 2016-04-25 | 信越ポリマー株式会社 | Electromagnetic wave shield film, electromagnetic wave shield film-attached flexible printed wiring board, and manufacturing methods thereof |
WO2017138638A1 (en) * | 2016-02-12 | 2017-08-17 | タツタ電線株式会社 | Electromagnetic-wave shield film |
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TW201930513A (en) | 2019-08-01 |
KR102412598B1 (en) | 2022-06-22 |
JP6863908B2 (en) | 2021-04-21 |
CN110027268A (en) | 2019-07-19 |
CN110027268B (en) | 2022-02-01 |
JP2019125618A (en) | 2019-07-25 |
KR20190086391A (en) | 2019-07-22 |
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